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Raytheon has developed a 3rd-Generation FLIR Sensor Engine (3GFSE) for advanced U.S. Army systems. The sensor engine is based around a compact, productized detector-dewar assembly incorporating a 640 x 480 staring dual-band (MW/LWIR) focal plane array (FPA) and a dual-aperture coldshield mechanism. The capability to switch the coldshield aperture and operate at either of two widely-varying f/#s will enable future multi-mode tactical systems to more fully exploit the many operational advantages offered by dual-band FPAs. RVS has previously demonstrated high-performance dual-band MW/LWIR FPAs in 640 x 480 and 1280 x 720 formats with 20 μm pitch. The 3GFSE includes compact electronics that operate the dual-band FPA and variable-aperture mechanism, and perform 14-bit analog-to-digital conversion of the FPA output video. Digital signal processing electronics perform "fixed" two-point non-uniformity correction (NUC) of the video from both bands and optional dynamic scene-based NUC; advanced enhancement processing of the output video is also supported. The dewar-electronics assembly measures approximately 4.75 x 2.25 x 1.75 inches. A compact, high-performance linear cooler and cooler electronics module provide the necessary FPA cooling over a military environmental temperature range. 3GFSE units are currently being assembled and integrated at RVS, with the first units planned for delivery to the US Army.

Raytheon Vision Systems (RVS) is developing two-color, large-format infrared FPAs to support the US Army’s Third Generation FLIR systems**. RVS has produced 640 x 480 two-color FPAs with a 20 P m pixel pitch. Work is also underway to demonstrate a 1280 x 720 two-color FPA in 2005. The FPA architecture has been designed to achieve nearly simultaneous temporal detection of the spectral bands while being producible for pixel dimensions as small as 20 microns. Raytheon’s approach employs a readout integrated circuit (ROIC) with Time Division Multiplexed Integration (TDMI). This ROIC is coupled to bias-selectable two-color detector array with a single contact per pixel. The two-color detector arrays are fabricated from MBE-grown HgCdTe triple layer heterojunction (TLHJ) wafers. The single indium bump design is producible for 20 P m unit cells and exploits mature fabrication processes that are in production at RVS for Second Generation FPAs. This combination allows for the high temporal and spatial color registration while providing a low-cost, highly producible and robust manufacturing process. High-quality MWIR/LWIR (M/L) 640 x 480 TDMI FPAs with have been produced and imaged from multiple fabrication lots. These FPAs have LWIR cutoffs ranging to 11 P m at 78K. These 20 P m pixel FPAs have demonstrated excellent sensitivity and pixel operabilities exceeding 99%. NETDs less than 25 mK at f/5 have been demonstrated for both bands operating simultaneously. Keywords: HgCdTe, infrared detectors, focal plane arrays, multi-spectral, two-color, 3

A universal sensor interface model (USIM) is being developed by the Raytheon-TI Systems Company for use with fields of unattended distributed sensors. In its production configuration, the USIM will be a multichip module consisting of a set of common modules. The common module USIM set consists of (1) a sensor adapter interface (SAI) module, (2) digital signal processor (DSP) and associated memory module, and (3) a RF transceiver model. The multispectral sensor interface is designed around a low-power A/D converted, whose input/output interface consists of: -8 buffered, sampled inputs from various devices including environmental, acoustic seismic and magnetic sensors. The eight sensor inputs are each high-impedance, low- capacitance, differential amplifiers. The inputs are ideally suited for interface with discrete or MEMS sensors, since the differential input will allow direct connection with high-impedance bridge sensors and capacitance voltage sources. Each amplifier is connected to a 22-bit (Delta) (Sigma) A/D converter to enable simultaneous samples. The low power (Delta) (Sigma) converter provides 22-bit resolution at sample frequencies up to 142 hertz (used for magnetic sensors) and 16-bit resolution at frequencies up to 1168 hertz (used for acoustic and seismic sensors). The video interface module is based around the TMS320C5410 DSP. It can provide sensor array addressing, video data input, data calibration and correction. The processor module is based upon a MPC555. It will be used for mode control, synchronization of complex sensors, sensor signal processing, array processing, target classification and tracking. Many functions of the A/D, DSP and transceiver can be powered down by using variable clock speeds under software command or chip power switches. They can be returned to intermediate or full operation by DSP command. Power management may be based on the USIM's internal timer, command from the USIM transceiver, or by sleep mode processing management. The low power detection mode is implemented by monitoring any of the sensor analog outputs at lower sample rates for detection over a software controllable threshold.© (1999) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

The distinctions between eosinophilic fascitis (Shulman's syndrome) and scleroderma may sometimes be unclear. We describe a patient with generalized morphea who also had peripheral blood eosinophilia, fibrosis and inflammation of fascia, and hyper-globulinemia, features usually attributed to Shulman's syndrome. The latter diagnosis should be restricted to those patients whose history, clinical and laboratory findings, and response to therapy closely resemble Shulman's original description. Scleroderma and eosinophilic fasciitis may represent slightly differing aspects of the same disease spectrum, with a similar immunologic pathogenesis.

The stability permanence of calcia-stabilized zirconia was studied during the course of repeated heat treatments. Zirconias with various degrees of purity and initial stability were tested. X-ray diffraction and thermal expansion measurements were used to determine stability changes. Standard purity samples were partially destabilized by cyclic heating through the temperature of monoclinic-tetragonal phase change (between 954°C and 1260° C), while very high purity samples withstood this and even more severe heat tests.