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2. Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch

Author

Min-Jer Wang, Der-Jiann Liu, Ching-Nen Peng, Chung-Han Huang, Hao Chen, Wei-Hsun Lin, Hung-Chih Lin, and Sen-Kuei Hsu

Subjects
Engineering, Yield (engineering), business.industry, Acoustics, Electronic engineering, High density, Image warping, business, Probe card, Automatic testing
Abstract

High-density probing is a main trend of the test technology. The warping issues of probe card are caused by the high-density test. The metal backer and patches are applied to solve this problem and the optimized sizes of backer and patches are decided by the proposed flow. Using the probe card with optimized backer and patches, the stability of test can be ensured and the test yields are increased. 26.56% test-yield improvement can be obtained.

Published
2013
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