Search

Your search keyword '"Depla, Diederik"' showing total 216 results
Start Over Author "Depla, Diederik"
216 results on '"Depla, Diederik"'

10. Plasmonic effects in the neutralization of slow ions at a metallic surface.

Author

Bercx, Marnik, Mayda, Selma, Depla, Diederik, Partoens, Bart, and Lamoen, Dirk

Subjects
SECONDARY electron emission, PLASMONICS, METALLIC surfaces, DENSITY functional theory, POISSON processes, POINT processes, ELECTRON emission
Abstract

Secondary electron emission is an important process that plays a significant role in several plasma‐related applications. As measuring the secondary electron yield experimentally is very challenging, quantitative modelling of this process to obtain reliable yield data is critical as input for higher‐scale simulations. Here, we build upon our previous work combining density functional theory calculations with a model originally developed by Hagstrum to extend its application to metallic surfaces. As plasmonic effects play a much more important role in the secondary electron emission mechanism for metals, we introduce an approach based on Poisson point processes to include both surface and bulk plasmon excitations to the process. The resulting model is able to reproduce the yield spectra of several available experimental results quite well but requires the introduction of global fitting parameters, which describe the strength of the plasmon interactions. Finally, we use an in‐house developed workflow to calculate the electron yield for a list of elemental surfaces spanning the periodic table to produce an extensive data set for the community and compare our results with more simplified approaches from the literature. [ABSTRACT FROM AUTHOR]

Published
2024
Full Text
View/download PDF

11. Understanding residual stress in thin films: Analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model.

Author

Rao, Zhaoxia, Berman, Sarah, Yang, Peilin, Depla, Diederik, and Chason, Eric

Subjects
CURVATURE measurements, RESIDUAL stresses, THIN films, MANUFACTURING processes, COPPER films
Abstract

An analytical model for the evolution of residual stress in polycrystalline thin films is used to analyze numerous previously reported wafer curvature measurements obtained for a variety of materials and processing conditions. The model, which has been described in previous publications, considers stress-generating mechanisms that occur at the grain boundary as it forms between adjacent grains and stress due to the subsurface grain growth in layers that have already been deposited. Current work extends the model to include different types of microstructural evolutions. A set of parameters for each dataset is obtained by non-linear least square fitting. Model parameters that are not expected to depend on the processing conditions are constrained to have a common value when fitting the multiple datasets for each material. The dependence of the fitting parameters on the material and process conditions is evaluated and compared with the physical mechanisms implemented in the model. [ABSTRACT FROM AUTHOR]

Published
2021
Full Text
View/download PDF

12. Effect of Growth Temperature and Atmosphere Exposure Time on Impurity Incorporation in Sputtered Mg, Al, and Ca Thin Films

Author

Aliramaji, Shamsa, Keuter, Philipp, Neuss, Deborah, Hans, Marcus, Primetzhofer, Daniel, Depla, Diederik, Schneider, Jochen M., Aliramaji, Shamsa, Keuter, Philipp, Neuss, Deborah, Hans, Marcus, Primetzhofer, Daniel, Depla, Diederik, and Schneider, Jochen M.

Abstract

Impurities can be incorporated during thin film deposition, but also can originate from atmosphere exposure. As impurities can strongly affect the composition-structure-property relations in magnetron sputter deposited thin films, it is important to distinguish between both incorporation channels. Therefore, the impurity incorporation by atmosphere exposure into sputtered Mg, Al, and Ca thin films is systematically studied by a variation of the deposition temperatures and atmosphere exposure times. Deposition temperature variation results in morphological modifications explained by considering surface and bulk diffusion as well as grain boundary motion and evaporation. The film morphologies exhibiting the lowest oxygen concentrations, as measured by energy dispersive X-ray spectroscopy, are obtained at a homologous temperature of 0.4 for both Mg and Al thin films. For Ca, preventing atmosphere exposure is essential to hinder impurity incorporation: By comparing the impurity concentration in Al-capped and uncapped thin films, it is demonstrated that Ca thin films are locally protected by Al-capping, while Mg (and Al) form native passivation layers. Furthermore, it can be learned that the capping (or self-passivation) efficiency in terms of hindering further oxidation of the films in atmosphere is strongly dependent on the underlying morphology, which in turn is defined by the growth temperature.

Published
2023
Full Text
View/download PDF

18. Cell Behavior Changes and Enzymatic Biodegradation of Hybrid Electrospun Poly(3‐hydroxybutyrate)‐Based Scaffolds with an Enhanced Piezoresponse after the Addition of Reduced Graphene Oxide

Author

Chernozem, Roman V., primary, Pariy, Igor, additional, Surmeneva, Maria A., additional, Shvartsman, Vladimir V., additional, Planckaert, Guillaume, additional, Verduijn, Joost, additional, Ghysels, Stef, additional, Abalymov, Anatolii, additional, Parakhonskiy, Bogdan V., additional, Gracey, Eric, additional, Gonçalves, Amanda, additional, Mathur, Sanjay, additional, Ronsse, Frederik, additional, Depla, Diederik, additional, Lupascu, Doru C., additional, Elewaut, Dirk, additional, Surmenev, Roman A., additional, and Skirtach, Andre G., additional

Published
2023
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results