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Efficiency droop at high current densities is a problem for InGaN-based light-emitting diodes (LEDs), especially for conventional c-plane devices. The large internal electric fields in c-plane quantum wells (QWs) lead to an increase in the active region carrier density (n), causing the electrical efficiency droop onset to occur at low current densities. Here, we present an approach to reduce the internal electric fields (Eint) in c-plane QWs by placing doped p-type and n-type GaN barriers close to the QW. The reduced Eint also allows a thick QW active region design, which helps to lower n to further reduce the droop. The concept of using doped barriers to control Eint is explained using theory and device simulations. Following that, multiple series of thick single QW (SQW) LEDs were grown and characterized. Key parameters in the epitaxial design such as the doping levels and the relative position of the doped barriers were systematically studied and optimized. By using optimized doped barriers and a thick SQW, c-plane LEDs with a low-efficiency droop of 14% at 300 A/cm2 [with respect to the peak external quantum efficiency (EQE)] and a high peak EQE of 49% were demonstrated. [ABSTRACT FROM AUTHOR]

Deep levels were observed using capacitance deep level optical spectroscopy (DLOS) in an AlGaN/GaN heterostructure equivalent to that of a heterojunction field effect transistor. Band gap states were assigned to either the AlGaN or GaN regions by comparing the DLOS spectra in accumulation and pinch-off modes, where the former reflects both AlGaN- and GaN-related defects, and the latter emphasizes defects residing in the GaN. A band gap state at E-c-3.85 eV was unambiguously identified with the AlGaN region, and deep levels at E-c-2.64 eV and E-c-3.30 eV were associated with the GaN layers. Both the AlGaN and GaN layers exhibited additional deep levels with large lattice relaxation. The influence of deep levels on the two-dimensional electron gas sheet charge was estimated using a lighted capacitance-voltage method. (c) 2006 American Institute of Physics.

Prospective equivalent internal quantum efficiency (eta(int)) of approximately 34% at 300 K was demonstrated for the blue emission peak of nonpolar m-plane (1 (1) over bar 00) InxGa1-xN/GaN multiple quantum well light emitting diodes (LEDs) fabricated on freestanding m-plane GaN substrates. Although the eta(int) value is yet lower than that of conventional c-plane blue LEDs (> 70%), the results encourage one to realize high performance green, amber, and red LEDs by reducing the concentration of nonradiative defects, according to the absence of the quantum-confined Stark effects due to the polarization fields parallel to the quantum well normal. The electric field component of the blue surface emission was polarized perpendicular to the c axis with the in-plane polarization ratio of 0.58 at 300 K. (c) 2006 American Institute of Physics.

We report on the use of in-situ SiNx nanomask for defect reduction in nonpolar a-plane GaN films, grown by metal-organic chemical vapor deposition. High-resolution x-ray diffraction analysis revealed that there was a monotonic reduction in the full width at half maximum, both on-axis and off-axis, with the increase in the SiNx thickness. Atomic force microscopy images revealed a significant decrease in the root-mean-square roughness and the density of submicron pits. Cross-section and plan-view transmission electron microscopy on the samples showed that the stacking fault density decreased from 8x10(5) to 3x10(5) cm(-1) and threading dislocation density decreased from 8x10(10) to 9x10(9) cm(-2). Room temperature photoluminescence measurement revealed that the band-edge emission intensity increased with the insertion of the SiNx layer, which suggests reduction in the nonradiative recombination centers. (c) 2006 American Institute of Physics.

The impact of threading dislocation density on Ni/n-GaN Schottky barrier diode characteristics is investigated using forward biased current-voltage-temperature (I-V-T) and internal photoemission (IPE) measurements. Nominally, identical metal-organic chemical vapor deposition grown GaN layers were grown on two types of GaN templates on sapphire substrates to controllably vary threading dislocation density (TDD) from 3x10(7) to 7x10(8) cm(-2). I-V-T measurements revealed thermionic emission to be the dominant transport mechanism with ideality factors near 1.01 at room temperature for both sample types. The Schottky barrier heights showed a similar invariance with TDD, with measured values of 1.12-1.13 eV obtained from fitting the I-V-T results to a thermionic emission-diffusion model. The I-V-T results were verified by IPE measurements made on the same diodes, confirming that the Ni/n-GaN barrier heights do not show a measurable TDD dependence for the TDD range measured here. In apparent contrast to this result is that the measured forward bias I-V characteristics indicate a shift in the observed forward bias turn-on voltage such that at the higher TDD value investigated here, a larger turn-on voltage (lower current) is observed. This difference is attributed to localized current blocking by high potential barrier regions surrounding threading dislocations that intersect the Ni/GaN interface. A simple model is presented that reconciles both the observed voltage shift and variations in the extracted Richardson constant as a function of threading dislocation density. With this model, an average local barrier surrounding dislocation of similar to 0.2 V is obtained, which diverts current flow across the forward biased Schottky interface to nondislocated regions. (c) 2006 American Institute of Physics.

The spatial distribution of strain, dislocations, and crystallographic orientation in uncoalesced and coalesced GaN layers grown on striped Si or SiC substrates was studied by polychromatic X-ray microdiffraction and high resolution monochromatic X-ray diffraction. Tilt boundaries formed at the column/wing interface depending on the growth conditions and geometry of the striped substrate. The measurements revealed that the free-hanging wings are tilted upward at room temperature. A misorientation between the GaN(0001) and the Si(111) or SiC(0001) surface normal is observed. Distinct structural properties of the pendeo and cantilever epitaxially grown samples are discussed.

We use photoreflectance (PR) spectroscopy to study the electronic band structure modification of GaN films grown along different nonpolar orientations due to biaxial, anisotropic in-plane strain. The exciton transition energies of an unstrained, high-quality C-plane GaN film are used to accurately determine the crystal-field and spin-orbit splitting energies. For films with a nonpolar orientation, the resonant features observed in the PR spectra exhibit a strong in-plane polarization anisotropy and different transition energies from the ones measured in the C-plane GaN film. The deformation potential D-5 is accurately determined from four GaN films with a nonpolar orientation using the measured energies together with the polarization properties and out-of-plane strain. (c) 2006 American Institute of Physics.

In this letter, unpassivated high power deeply recessed GaN-based high electron mobility transistors (HEMTs) are reported. The introduction of a thick graded AlGaN cap layer and a novel fluorine-plasma surface treatment reduced the gate-leakage current and increased breakdown voltage significantly, enabling the application of much higher drain biases. Due to excellent dispersion suppression achieved at an epitaxial level, an output power density of more than 17 W/mm with an associated power added efficiency (PAE) of 50% was measured at 4 GHz and V-DS = 80 V without SiNx passivation. These results demonstrate the great potential of this novel epitaxial approach for passivation-free GaN-based HEMTs for high-power applications.

Recombination dynamics of the 268 nm photoluminescence (PL) peak in a quaternary Al0.53In0.11Ga0.36N/Al0.58In0.02Ga0.40N multiple quantum well (MQW) grown on relaxed AlGaN templates were studied. Although the polarization field in the compressively strained Al0.53In0.11Ga0.36N wells was as high as 1.6 MV/cm, the value of integrated PL intensity at 300 K divided by that at 8 K (eta(int)) was as high as 1.2%. The value was similar to that obtained for the 285 nm PL peak in an Al0.30Ga0.70N/Al0.70Ga0.30N MQW (1.3%), though the A1N molar fraction in the wells was higher by a factor of 1.7. According to these results and the fact that time-resolved PL signal exhibited a stretched exponential decay shape, the improved eta(int) of the AlInGaN wells was attributed to a beneficial effect of the exciton localization as is the case with InGaN alloys; doping or alloying with InN was confirmed to work also on AlGaN in improving eta(int) to realize deep UV optoelectronic devices.

We demonstrate a technique to reduce the extended defect densities in a-plane GaN deposited on r-plane sapphire. The SiO2 lateral epitaxial overgrowth mask consisted of (GaN) stripes. Both the mask and GaN were etched through the mask openings and the lateral growth was initiated from the etched c-plane GaN sidewalls, and the material was grown over the mask regions until a smooth coalesced film was achieved. Threading dislocation densities in the range of 10(6)-10(7) cm(-2) were realized throughout the film surface. The on-axis and off-axis full width at half maximum value and surface roughness were 0.082 degrees, 0.114 degrees, and 0.622 nm, respectively. (c) 2006 American Institute of Physics.

Polarization gradients in graded AlGaN alloys induce bulk electron distributions without the use of impurity doping. Since the alloy composition is not constant in these structures, the electron scattering rates vary across the structure. Capacitance and conductivity measurements on field effect transistors were used to find mobility as a function of depth. The effective electron mobility at different depths calculated from theory closely matched the measured mobility. Local bulk mobility values for different AlGaN compositions were found, and the electron mobility in AlGaN as a function of alloy composition was deduced. These were found to match with theoretical calculations. (c) 2006 American Institute of Physics.

We demonstrate the growth and fabrication of a semipolar (10 (13) over bar) InGaN/GaN green (similar to 525 nm) light emitting diode (LED). The fabricated devices demonstrated a low turn-on voltage of 3.2 V and a series resistance of 14.3 Omega. Electroluminescence measurements on the semipolar LED yielded a reduced blueshifting of the peak emission wavelength with increasing drive current, compared to a reference commercial c-plane LED. On-wafer measurements yielded an approximately linear increase in output power with drive current, with measured values of 19.3 and 264 muW at drive currents of 20 and 250 mA,respectively. The external quantum efficiency did not decrease appreciably at high currents. Polarization anisotropy was also observed in the electroluminescence from the semipolar green LED, with the strongest emission intensity parallel to the [1 (2) over bar 10] direction. A polarization ratio of 0.32 was obtained at a drive current of 20 mA. (c) 2005 American Institute of Physics.

We report on the fabrication and high-frequency characterization of AlGaN/GaN high-electron mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE) and metal-organic chemical vapor deposition (MOCVD). In devices with a gate length of 160 nm, a record power density of 10.5 W/mm with 34% power added efficiency (PAE) has been measured at 40 GHz in MOCVD-grown HEMTs biased at V-DS = 30 V. Under similar bias conditions, more than 8.6 W/mm, with 32% PAE, were obtained on the MBE-grown sample. The dependence of output power, gain, and PAE on gate and drain voltages, and frequency have also been analyzed.

(0001)-oriented epitaxial wurtzite III-nitride layers grown on mismatched substrates have no resolved shear stress on the natural basal and prismatic slip planes; however, strained Ill-nitride layers may gradually relax. We report on the stress relaxation of Al0.49Ga0.51N layers grown on nominally relaxed Al0.62Ga0.38N buffer layers on sapphire. The reduction in elastic strain of the Al0.49Ga0.51N was enhanced by Si doping which caused an increased surface roughness. Despite the Si doping, the films always sustained step-flow growth. The extent of relaxation of the Al0.49Ga0.51N layer was determined by on-axis omega-2 theta scans of (0001) peaks and reciprocal space maps of inclined (off-axis) peaks. Cross-section and plan-view transmission electron microscopy studies showed that the threading dislocations in the Al(0.49)Gao(0.5)N layer inclined from the [0001] direction towards (1 (1) over bar 00) directions by similar to 15-25 degrees, perpendicular to their Burgers vector (1/3 ) These inclined threading dislocations have a misfit dislocation component and thus provide stress relief. The contribution of the dislocation inclination to the degree of relaxation has been formulated and the energy release has been determined for dislocation inclination in mismatched stressed layers. (c) 2005 American Institute of Physics.

Polarity and dislocation dependence study of photoelectrochemical wet etching on GaN was carried out on lateral epitaxial overgrown nonpolar (11 (2) over bar0)a-GaN/(1 (1) over bar 02)r-plane sapphire substrate. This LEO nonpolar GaN sample has low dislocation density Ga- and N-faces exposed horizontally in opposite directions, which can be exposed to identical etching conditions for both polarity and dislocation dependence study. It is observed that N-face GaN is essentially much chemically active than Ga-face GaN, which shows the hexagonal pyramids with {10 (1) over bar(1) over bar} facets on the etched N face. No obvious etching was observed on Ga face in the same etch condition. As for dislocation dependence, the "wing" (low dislocation density) region was etched faster than the "window" (high dislocation density) region. Smooth etched surfaces were formed with the ((1) over bar(1) over bar2 (2) over bar) facet as an etch stop plane both on Ga and N-wing region. (C) 2004 American Institute of Physics.

We discuss an AlGaN/GaN metal-semiconductor field-effect transistor (MESFET) structure grown without any impurity doping in the channel. A high-mobility polarization-induced bulk channel charge was created by grading the channel region linearly from GaN to Al0.3Ga0.7N over 1000 Angstrom. This polarization-doped FET (PolFET) was fabricated and tested under dc and rf conditions. Current density of 850 mA/mm and transconductance of 93 mS/mm was observed under dc conditions. The 0.7 mum gate length devices had a cutoff frequency, f(tau)=19 GHz, and maximum oscillation frequency, f(max)=46 GHz. We demonstrate that the PolFETs perform better than comparable MESFETs with impurity-doped channels, and are suitable for high power microwave applications. An important advantage of these devices over AlGaN/GaN high electron mobility transistors is that the transconductance versus gate voltage profile can be tailored by compositional grading for better large-signal linearity. (C) 2004 American Institute of Physics.

AlGaN/GaN current aperture vertical electron transistors with regrown aperture and source regions have been fabricated and tested. A 2 mum thick GaN:Si drain region followed by a 0.4 mum GaN:Mg current-blocking layer were grown by metalorganic chemical vapor deposition on a c-plane sapphire substrate. Channel apertures were etched, and a maskless regrowth was performed to grow unintentionally doped GaN inside the aperture as well as above the insulating layer, and to add an AlGaN cap layer. Cl-2 reactive ion etching was used to pattern the device mesa, and source, drain, and gate metals were then deposited. Devices were achieved with a maximum source-drain current of 750 mA/mm, an extrinsic transconductance of 120 mS/mm, and a 2-terminal gate breakdown of 65 V while exhibiting almost no DC-RF dispersion for 80 mus pulsed I-V curves. The suppression of DC-RF dispersion was shown to result from the absence of the large electric fields at the surface on the drain-side edge of the gate that are present in high electron mobility transistors. Parasitic leakage currents, which were present in all devices, have been studied in detail. Three leakage paths have been identified, and methods to eliminate them are discussed. (C) 2004 American Institute of Physics.

This letter describes the relationship between the morphological evolution of heteroepitaxial a-plane GaN films and the formation of the extended defect structure. The initial a-plane GaN growth on a-plane SiC substrates (via a high temperature AlN buffer layer) follows a Volmer-Weber growth mode. Consequently, the coalescence of three-dimensional (3D) islands generates threading dislocations which dominate the nonpolar GaN film's microstructure (3x10(10) cm(-2)). Exposed nitrogen-face surfaces, identified using x-ray diffraction measurements and convergent beam electron diffraction analysis, are present throughout the 3D growth and are the likely source of basal plane faulting (7x10(5) cm(-1)) within the film. Atomic force microscopy and scanning electron microscopy were used to image the morphological transition, which was correlated to changes in the a-GaN crystal tilt mosaic measured by x-ray rocking curves. (C) 2004 American Institute of Physics.

Cathodoluminescence technique combined with transmission electron microscopy (TEM-CL) has been used to characterize optical properties of dislocations in GaN epilayers. The dislocations act as nonradiative centers with different recombination rates. TEM-CL observation showed that even for the same Burgers vector of a, the dislocations show different electrical activity depending on the direction of dislocation line, i.e., the edge-type dislocation parallel to the c plane is very active, while the screw-type one is less active. The simulation of the CL images gives us the information of parameters such as carrier lifetime and diffusion length. (C) 2003 American Institute of Physics.

This letter discusses the structural and morphological characteristics of planar, nonpolar (11 (2) over bar0) a-plane GaN films grown on (1 (1) over bar 02) r-plane sapphire by hydride vapor phase epitaxy. Specular films with thicknesses over 50 mum were grown, eliminating the severely faceted surfaces that have previously been observed for hydride vapor phase epitaxy-grown a-plane films. Internal cracks and crack healing, similar to that in c-plane GaN films, were observed. Atomic force microscopy revealed nanometer-scale pitting and steps on the film surfaces, with rms roughness of similar to2 nm. X-ray diffraction confirmed the films are solely a-plane oriented with on-axis (11 (2) over bar0) and 30degrees off-axis (10 (1) over bar0) rocking curve peak widths of 1040 and 3000 arcsec, respectively. Transmission electron microscopy revealed a typical basal plane stacking fault density of 4x10(5) cm(-1). The dislocation content of the films consisted of predominately edge component (b(edge)=+/-[0001]) threading dislocations with a density of 2x10(10) cm(-2), and mixed-character Shockley partial dislocations (b=1/3(1) over bar 00>) with a density of 7x10(9) cm(-2). (C) 2003 American Institute of Physics.

Evaluation of the structural properties of 200-nm-thick Si-doped Al0.49Ga0.51N films, grown on nominally relaxed 1-mum-thick Al0.62Ga0.38N buffer layers on sapphire, revealed that increased Si doping promoted the relaxation of the compressively strained layers. The degree of strain relaxation R of the Al0.49Ga0.51N films, as determined by x-ray diffraction (XRD), increased from R=0.55 to R=0.94 with an increase in disilane injection from 1.25 nmol/min to 8.57 nmol/min. Transmission electron microscopy analysis showed that the edge threading dislocations (TDs) in the Al0.49Ga0.51N layers were inclined, such that the redirected TD lines had a misfit dislocation component. The calculated strain relaxation due to the inclined TDs was in close agreement with the values determined from XRD. We propose that the TD line redirection was promoted by the Si-induced surface roughness. (C) 2003 American Institute of Physics.

This letter reports on the reduction in extended-defect densities in a-plane (11 (2) over bar0) GaN films achieved via lateral epitaxial overgrowth (LEO) by hydride vapor phase-epitaxy. A variety of dielectric mask patterns was used to produce 8-125-mum-thick, fully coalesced nonpolar GaN films. The nanometer-scale pit densities in the overgrown regions were less than 3x10(6) cm(-2) compared to similar to10(10) cm(-2) in the direct-growth a-plane GaN. Cathodoluminescence revealed a fourfold increase in luminous intensity in the overgrown material compared to the window material. X-ray rocking curves indicate the films were free of wing tilt within the sensitivity of the measurements. Whereas non-LEO a-plane GaN exhibits basal plane stacking fault and threading dislocation densities of 10(5) cm(-1) and 10(9) cm(-2), respectively, the overgrown LEO material was essentially free of extended defects. The basal plane stacking fault and threading dislocation densities in the wing regions were below the detection limits of similar to5x10(6) cm(-2) and 3x10(3) cm(-1), respectively. (C) 2003 American Institute of Physics.

The influence of AlGaN and GaN cap layer thickness on Hall sheet carrier density and mobility was investigated for Al0.32Ga0.68N/GaN and GaN/Al0.32Ga0.68N/GaN heterostructures deposited on sapphire substrates. The sheet carrier density was found to increase and saturate with the AlGaN layer thickness, while for the GaN-capped structures it decreased and saturated with the GaN cap layer thickness. A relatively close fit was achieved between the measured data and two-dimensional electron gas densities predicted from simulations of the band diagrams. The simulations also indicated the presence of a two-dimensional hole gas at the upper interface of GaN/AlGaN/GaN structures with sufficiently thick GaN cap layers. A surface Fermi-level pinning position of 1.7 eV for AlGaN and 0.9-1.0 eV for GaN, and an interface polarization charge density of 1.6x10(13)-1.7x10(13) cm(-2), were extracted from the simulations. (C) 2003 American Institute of Physics.

We propose and demonstrate a long-wavelength vertical cavity surface emitting laser (VCSEL) which consists of a (311)B InP-based active region and (100) GaAs-based distributed Bragg reflectors (DBRs), with an aim to control the in-plane polarization of output power. Crystal growth on (311)B InP substrates was performed under low-migration conditions to achieve good crystalline quality. The VCSEL was fabricated by wafer bonding, which enables us to combine different materials regardless of their lattice and orientation mismatch without degrading their quality. The VCSEL was polarized with a power extinction ratio of 31 dB. (C) 2003 American Institute of Physics.

N-p-n Al0.05GaN/GaN heterojunction bipolar transistors with a common emitter operation voltage higher than 330 V have been demonstrated using selectively regrown emitters. Devices were grown by metalorganic chemical vapor deposition on sapphire substrates. The n-type emitter was grown selectively on a 100-nm-thick p-base with an 8 mum n-collector structure using a dielectric mask. The shallow etch down to the collector mitigates damages induced in the dry etch, resulting a low leakage and a high breakdown. The graded AlGaN emitter results in a common emitter current gain of similar to18 at an average collector current density of up to 1 kA/cm(2) at room temperature.

The design and demonstration of unitravelling carrier (UTC) photodiodes fabricated using a novel quantum-well (QW) intermixing and metal-organic chemical vapor deposition (MOCVD) regrowth fabrication platform is presented. It is found that photodiodes exhibit approximately 90 percent internal quantum efficiency, excellent photocurrent handling capabilities and minimal response roll-off over the 20 GHz of our testing capability.