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1. Dry resist metrology readiness for high-NA EUVL

3. Achieving zero EUV patterning defect with dry photoresist system

6. The road towards aggressive pitch scaling with single exposure EUV

8. Fundamental characterization of stochastic variation for improved single-expose extreme ultraviolet patterning at aggressive pitch

10. Leveraging sub-E0 dose assessment methodology to improve EUV lithography cluster dose performance

12. Material and process improvements towards sub 36nm pitch EUV single exposure

20. Defect detection strategies and process partitioning for single-expose EUV patterning

24. Polymer brush as adhesion promoter for EUV patterning

25. Defect detection strategies and process partitioning for SE EUV patterning (Conference Presentation)

28. Coater/developer based techniques to improve high-resolution EUV patterning defectivity

29. Development of TiO2 containing hardmasks through plasma-enhanced atomic layer deposition

30. Driving down defect density in composite EUV patterning film stacks

32. Development of TiO2 containing hardmasks through PEALD deposition

33. Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer

34. Single-expose patterning development for EUV lithography

39. IBM Research Semiconductor Group.

40. Study of alternate hardmasks for extreme ultraviolet patterning

41. Successes and frontiers in extreme UV patterning

42. EUV patterning successes and frontiers

48. Inorganic hardmask development for extreme ultraviolet patterning.

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