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1. Physics of the Edwards–Anderson spin glass in dimensions d = 3, ... ,8 from heuristic ground state optimization.

2. Physics of the Edwards-Anderson spin glass in dimensions d = 3,...,8 from heuristic ground state optimization.

3. Monte Carlo solution of the reflected systems' criticality problems with Anlı–Güngör, Inönü and tetra-anisotropic kernels for both fission and scattered neutrons.

4. Physics of the Edwards–Anderson spin glass in dimensions d = 3, … ,8 from heuristic ground state optimization

5. Lithography Equipment

9. Composite operators of stochastic model A.

10. On Hamiltonian systems with critical Sobolev exponents.

11. Hitting probabilities of Gaussian random fields and collision of eigenvalues of random matrices.

12. The Mode Expansion of the String Fields.

13. Preliminary study of photomask pattern inspection by beam-shaped knife-edge interferometry.

14. Sub-5 nm AFM Tip Characterizer Based on Multilayer Deposition Technology.

15. Characterization of a nano line width reference material based on metrological scanning electron microscope.

16. Random simplicial complexes, duality and the critical dimension.

18. Dimension and process effects on the mechanical stability of ultra-small HSQ nanopillars.

19. An effective lithography training module adapting semianalytical calculation approaches.

20. La dimensión crítica de la moral: la correspondencia Masham-Leibniz.

21. Sub-5 nm AFM Tip Characterizer Based on Multilayer Deposition Technology

22. Olafur Eliasson's The Weather Project and the Birth of the Political.

23. Development of a Vaporizer for Gradual Vaporization Control of Precursor Materials in the CVD Process.

24. 34.4: Applications of Electron Beam Review System for AMOLED Patterning Process Control.

25. Active Contour Method Based Sub-pixel Critical Dimension Measurement of Thin Film Transistor Liquid Crystal Display (TFT-LCD) Patterns.

26. A comparative study on the bone repair effects of two kinds of tissue regeneration membranes.

28. Surface enhanced infrared spectroelectrochemistry using a microband electrode

29. Depth-correlated backscattered electron signal intensity for 3D-profile measurement of high aspect ratio holes.

30. Tilted beam scanning electron microscopy, 3-D metrology for microelectronics industry.

31. Three-dimensional atomic force microscopy for ultra-high-aspect-ratio imaging.

32. 光刻法图案化石墨烯研究.

33. Research on critical dimensions variation based on improved optical lithography imaging model.

34. Nanoscale surface morphology modulation of graphene – i-SiC heterostructures

38. Bringing Electrochemical Three-Dimensional Printing to the Nanoscale

39. Heat Dissipation Derivation and Optimization of the Fan-Out 3-D Package Model

40. Critical Dimension Bimodality Both Within Wafer and Within Die.

41. MODELLING AND DECISION SUPPORT SYSTEM FOR INTELLIGENT MANUFACTURING: AN EMPIRICAL STUDY FOR FEEDFORWARD-FEEDBACK LEARNING-BASED RUN-TO-RUN CONTROLLER FOR SEMICONDUCTOR DRY-ETCHING PROCESS.

42. A position-controllable external stage for critical dimension measurements via low-noise atomic force microscopy.

43. A new criterion to a two-chemical substances chemotaxis system with critical dimension.

44. Methodology for evaluating the information distribution in small angle scattering from periodic nanostructures.

45. SEPARATION STRUCTURE OF RADIAL SOLUTIONS FOR SEMILINEAR ELLIPTIC EQUATIONS WITH EXPONENTIAL NONLINEARITY.

46. Use of model-based library in critical dimension measurement by CD-SEM.

47. Fin field effect transistor directionality impacts printing of implantation shapes.

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