1. Multi-micron silicon photonicsplatform for highly manufacturable and versatile photonic integrated circuits
- Author
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Mazin Alalusi, Guomin Yu, Gerald Miller, Hua Yang, Kevin Masuda, Hooman Abediasl, Frank H. Peters, Thomas Schrans, Hong Liang, Amit Singh Nagra, Evie Kho, Melissa Ziebell, Yangyang Liu, Damiana Lerose, Andrea Trita, David Arlo Nelson, Jerry Byrd, John Paul Drake, Aaron Zilkie, Pradeep Srinivasan, Andrew George Rickman, Henri Nykanen, and Karl Muth
- Subjects
Sensing applications ,Computer science ,Physics::Instrumentation and Detectors ,Silicon photonics ,Physics::Optics ,Elemental semiconductors ,III-V hybrid integration ,Multiplexing ,Versatile photonic integrated circuits ,Integrated photodetectors ,Optical fibre losses ,Photonic integration ,Efficient hybrid wavelength division multiplexed lasers ,Photonic integrated circuit ,Semiconductor optical amplifiers ,Photodetectors ,Data communications ,Integrated photonic applications ,Atomic and Molecular Physics, and Optics ,Fibre optic sensors ,Design for manufacturability ,Micrometers ,Electroabsorption ,integrated optics ,Optical losses ,Si ,Silicon ,Electro-optical modulation ,Optical interconnects ,chemistry.chemical_element ,Ribs ,Photonic integrated circuits ,Optical fibre communication ,Wavelength-division multiplexing ,Hybrid lasers ,Electronic engineering ,Integrated optoelectronics ,Power efficiency ,Electrical and Electronic Engineering ,Optoelectronics ,High-volume manufacturing ,Highly manufacturable integrated circuits ,business.industry ,Optical fibre filters ,Compact low-loss filters ,High-speed electro-absorption modulators ,Photonics ,chemistry ,Wavelength division multiplexing ,Low-loss fiber attach ,Multimicron silicon photonics platform ,business ,Electrical efficiency ,Optical fiber polarization - Abstract
We describe and characterize a multi-micron silicon photonics platform that was designed to combine performance, power efficiency, manufacturability, and versatility for integrated photonic applications ranging from data communications to sensors. We outline the attributes needed for broad applicability, high-volume manufacturing, and large-scale deployment of silicon photonics, and describe how the platform is favorable with respect to these attributes. We present demonstrations of key technologies needed for the communications and sensing applications, including low-loss fiber attach, compact low-loss filters, efficient hybrid wavelength division multiplexed lasers, and high-speed electro-absorption modulators and integrated photodetectors.
- Published
- 2019