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AlGaN self-assembled superlattices (SASLs) and their customization were investigated via metal modulated epitaxy. Using the dynamics of metal accumulation, surface strain, and surface segregation, coherent SASL structures were demonstrated with high repeatability over 910 nm (63 periods) with no growth interrupts at rates as high as 2.8 μm/h. High customizability was shown with control over period thickness as well as the thickness of the individual layers. Factors effecting the thickness and composition of each layer are discussed and methods of customization are presented. Transmission electron microscopy shows abrupt interfaces between individual layers of the SASL and good coherency throughout the structure and strong wavelength tunable ultraviolet photoluminescence was observed. Such a method of SASL fabrication offers promise for the growth of multi-quantum well structures, distributed Bragg reflectors, strain relaxation buffers, and beyond without the need for growth interrupts, and thus unintentional contaminant incorporation, between layers. [ABSTRACT FROM AUTHOR]

Semi-insulating GaN films with controlled dopant profiles have significant potential to improve the performance of high-power electronics. Beryllium doped GaN (GaN:Be) films previously demonstrated a semi-insulating nature, but the Be-dopant profiles in these films exhibited Be surface segregation and accumulation, which would lead to undesired leakage current paths in devices and deterioration of breakdown voltage. Improved growth kinetics of metal modulated epitaxy at low growth temperatures are applied in the study of GaN:Be films to achieve selectively controlled and abrupt step-doped Be profiles. The GaN:Be films were found to be semi-insulating via Hall effect measurements at elevated temperatures of 495 K. The films were shown to effectively electrically compensate surface contaminants at regrowth interfaces. Surface contaminants (O, Si, and C) typically result in unintentional n-type doping at the GaN on GaN regrowth interface. In order to demonstrate the utility of Be doping, GaN:Mg p-type films are grown atop GaN:Be buffer, AlN buffer, and control samples without any insulating buffer on GaN:Fe templates. Remarkably, the p-type films grown atop control samples up to 400 nm thick are compensated from surface contaminants, whereas the films grown atop AlN and GaN:Be insulating layers effectively electrically neutralize the surface contaminants and result in high hole concentrations of 2.3 and 2.5 × 1019 cm−3, respectively. The use of GaN:Be instead of AlN buffers eliminates the need to deconvolve the effects of the AlN/GaN 2D sheet charges and defects from lattice mismatch, removes lateral conduction paths, and reduces inherently high static vertical electric fields that detract from power device performance. [ABSTRACT FROM AUTHOR]

A non-traditional, for AlInN, method of controlling adatom kinetics and a low temperature growth condition were employed to improve the quality of high indium content aluminum indium nitride films. Metal-rich surfaces were used to enhance adatom mobility and compensate for the low growth temperature (Tsub ≤ 400 °C) effect of reducing surface diffusion lengths. The metal-rich approach resulted in 12 times lower x-ray diffraction full-width at half-maximum rocking curve figures of merit when compared to literature. In addition to promising photoluminescence emission, these results indicate improved structural quality over other reported approaches. AlInN films with ∼70% indium content were characterized via x-ray diffraction, atomic force microscopy, and photoluminescence spectroscopy with each technique indicating an optimal growth temperature of 350 °C. Al0.3In0.7N grown above 400 °C exhibited phase separation and a reduction in quality, while samples grown colder were predominantly single-phase and displayed improved photoluminescence at ∼1.45 eV. The photoluminescence spectra suggest emission from quantum wire-like structures with dimensions ranging from 15 to 18 nm. These low-temperature, metal-rich findings for high indium content AlInN are promising for future long-wavelength III-nitride optical devices. [ABSTRACT FROM AUTHOR]

GaN p++/n++ tunnel junctions (TJs) with heavy bulk or delta Mg doping at the junction were grown via molecular beam epitaxy with a hysteresis-free and repeatable negative differential resistance (NDR). The TJ with Mg doping of 5.5 × 1020 cm−3 shows NDR at ∼1.8 V and a large current density of 3.4 KA/cm2 at −1.0 V. Atomic resolution scanning transmission electron microscopy imaging showed no additional defects despite the doping exceeding the solubility limit in GaN allowing subsequent epitaxy of series-connected layers and devices. GaN homojunction TJs grown on bulk GaN showed an improved current density and NDR stability. In addition, the effect of Mg delta doping at the junction was investigated for the first time showing a dramatic improvement in the tunneling characteristics. A metal-organic chemical vapor deposition (MOCVD) grown InGaN light-emitting diode (LED) with an MBE grown GaN homojunction tunnel contact to the MOCVD grown p-GaN layer shows superior lateral conductivity and improved luminescence uniformity, but suffers an added voltage penalty, assumed to be due to interface impurities, compared to control LED with indium-tin-oxide. [ABSTRACT FROM AUTHOR]

In this work, radio-frequency (RF) plasma-induced damage to III-nitride surfaces and bulk defects is observed and mitigated. It is shown that for InN films, the surface is more sensitive to plasma-induced damage than GaN films, as observed via atomic force microscopy and reflection high energy electron diffraction. In order to isolate any possible plasma-induced damage, a growth window for InN is established, and temperature ranges are determined for other damaging effects which include roughening due to low adatom mobility, InN decomposition, and indium desorption. In situ plasma monitoring and optimization are accomplished with a combination of optical emission spectroscopy as well as a remote Langmuir probe. It is shown that by increasing the plasma nitrogen flow, the positive ion content increases; however, the ion acceleration potential reduces. Additionally, a reduced RF plasma power results in a reduction of atomic nitrogen species. These plasma species and energetic variations result in variations in the bulk unintentional background electron concentrations observed by room temperature Hall effect measurements of ∼1 μm thick InN films. By increasing the nitrogen flow from 2.5 to 7.5 sccm for a constant RF power of 350 W, the background electron concentration decreases by 74% from 1.36 × 1019 cm−3 to 3.54 × 1018 cm−3, while maintaining a smooth surface morphology. Additionally, photoluminescence spectra indicate optical emission energies shift from ∼0.81 to 0.71 eV (closer to the fundamental bandgap of InN) by limiting the damaging plasma species. Finally, conditions are presented to further minimize plasma-induced damage in III-nitride devices. [ABSTRACT FROM AUTHOR]

Utilizing a modified nitrogen plasma source, plasma assisted molecular beam epitaxy (PAMBE) has been used to achieve higher growth rates in GaN. A higher conductance aperture plate, combined with higher nitrogen flow and added pumping capacity, resulted in dramatically increased growth rates up to 8.4?μm/h using 34 sccm of N2 while still maintaining acceptably low operating pressure. It was further discovered that argon could be added to the plasma gas to enhance growth rates up to 9.8?μm/h, which was achieved using 20 sccm of N2 and 7.7 sccm Ar flows at 600?W radio frequency power, for which the standard deviation of thickness was just 2% over a full 2 in. diameter wafer. A remote Langmuir style probe employing the flux gauge was used to indirectly measure the relative ion content in the plasma. The use of argon dilution at low plasma pressures resulted in a dramatic reduction of the plasma ion current by more than half, while high plasma pressures suppressed ion content regardless of plasma gas chemistry. Moreover, different trends are apparent for the molecular and atomic nitrogen species generated by varying pressure and nitrogen composition in the plasma. Argon dilution resulted in nearly an order of magnitude achievable growth rate range from 1?μm/h to nearly 10?μm/h. Even for films grown at more than 6?μm/h, the surface morphology remained smooth showing clear atomic steps with root mean square roughness less than 1?nm. Due to the low vapor pressure of Si, Ge was explored as an alternative n-type dopant for high growth rate applications. Electron concentrations from 2.2?×?1016 to 3.8?×?1019 cm-3 were achieved in GaN using Ge doping, and unintentionally doped GaN films exhibited low background electron concentrations of just 1-2?×?1015 cm-3. The highest growth rates resulted in macroscopic surface features due to Ga cell spitting, which is an engineering challenge still to be addressed. Nonetheless, the dramatically enhanced growth rates demonstrate great promise for the future of III-nitride devices grown by PAMBE. [ABSTRACT FROM AUTHOR]

The bulk and 2-dimensional (2D) electrical transport properties of heavily Mg-doped p-type GaN films grown on AlN buffer layers by Metal Modulated Epitaxy are explored. Distinctions are made between three primary p-type conduction mechanisms: traditional valence band conduction, impurity band conduction, and 2D conduction within a 2D hole gas at a hetero-interface. The bulk and 2D contributions to the overall carrier transport are identified and the relative contributions are found to vary strongly with growth conditions. Films grown with III/V ratio less than 1.5 exhibit high hole concentrations exceeding 2×1019 cm-3 with effective acceptor activation energies of 51 meV. Films with III/V ratios greater than 1.5 exhibit lower overall hole concentrations and significant contributions from 2D transport at the hetero-interface. Films grown with III/V ratio of 1.2 and Mg concentrations exceeding 2×1020 cm-3 show no detectable inversion domains or Mg precipitation. Highly Mg-doped p-GaN and p-AlGaN with Al fractions up to 27% similarly exhibit hole concentrations exceeding 2×1019 cm-3. The p-GaN and p-Al0.11Ga0.89N films show broad ultraviolet (UV) photoluminescence peaks, which intercept the valence band, supporting the presence of a Mg acceptor band. Finally, a multi-quantum-well light-emitting diode (LED) and p-i-n diode are grown, both of which demonstrate rectifying behavior with turn-on voltages of 3-3.5V and series resistances of 6-10 Ω without the need for any post-metallization annealing. The LED exhibits violet-blue luminescence at 425 nm, while the p-i-n diode shows UV luminescence at 381 nm, and both devices still show substantial light emission even when submerged in liquid nitrogen at 77 K. [ABSTRACT FROM AUTHOR]