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1. Joule Expansion Imaging Techniques on Microlectronic Devices

9. Combined pressure-temperature inactivation of alkaline phosphatase in bovine milk: a kinetic study

20. Cross-plan Si/SiGe superlattice acoustic and thermal properties measurement by picosecond ultrasonics.

28. Coherent phonons in Si/ SiGe superlattices

30. Qualitative Temperature Variation Imaging by Thermoreflectance and SThM Techniques

32. Development of an original method of high resolution imagery in real time across an absorbent environment: application to microelectronic circuits

33. Effect of the laser pulse duration on picosecond ultrasonic signals

34. Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés

36. Application of Picosecond Ultrasonics to Non-Destructive Defect Analysis in VLSI Circuits

37. Optical studies for MEMS thermomechanical characterization

38. Differential thermal testing: An approach to its feasibility

39. Heterodyne lock-in thermal coupling measurements in integrated circuits: Applications to test and characterization

40. A heterodyne method for the thermal observation of the electrical behavior of high-frequency integrated circuits

41. High resolution interferometry (HRI) and electronic speckle pattern interferometry (ESPI) applied to the thermomechanical study of a MOS power transistor

43. Thermal characterization of defects in an IC: Thermal testing

45. Optical studies for MEMS thermomechanical characterization

46. TESTING OF THE QUALITY OF SOLDER JOINTS THROUGH THE ANALYSIS OF THEIR THERMAL-BEHAVIOR WITH AN INTERFEROMETRIC LASER PROBE

48. Four different approaches for the measurement of IC surface temperature: Application to thermal testing

49. EARLY DETECTION OF AGING IN SOLDER JOINTS THROUGH LASER PROBE THERMAL-ANALYSIS OF THE PELTIER EFFECT

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