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The results of the study of melting of Bi–Sn and Pb–Sn polycrystalline layered film systems with the thickness of 200–400 nm on a substrate with temperature gradient are given. Multilayer (each layer is of 10–20 nm) and bilayer films (layers are of 100–200 nm) of the same total thickness have been investigated. Broadening of the melting range in all films and lowering of melting point in multilayer samples compared to the bilayer ones have been observed. The observed phenomena are discussed within existing thermodynamic concepts in consideration of interfacial energy of contacting layers of components and energy of grain boundaries in polycrystalline films [ABSTRACT FROM AUTHOR]

We have studied the morphology changes of the continuous polycrystalline films made of fusible metals during their heating and annealing on the substrate affected by a temperature gradient. It was found, that melting of the polycrystalline metal films with grain size distributed among the wide interval, occurred only in certain temperature range, and this range reduces with the increases of average grain size. We also have estimated the average energy of intergranular borders in the tin and lead films. [ABSTRACT FROM AUTHOR]