1. Transient Thermal Damage Simulation for Novel Location-Controlled Grain Technique in Monolithic 3D IC
- Author
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Chih-Ming Shen, Ming-Chi Tai, Chang-Hong Shen, Kuan-Neng Chen, Pin-Jun Chen, Wei-Chung Lo, Chih-Chao Yang, and Chenming Hu
- Subjects
Materials science ,business.industry ,Three-dimensional integrated circuit ,Dielectric ,Integrated circuit ,Thermal conduction ,Finite element method ,law.invention ,Amorphous solid ,Semiconductor ,law ,Optoelectronics ,Transient (oscillation) ,business - Abstract
In this research, Finite Element Method (FEM) is used to simulate transient thermal conduction in the monolithic three-dimensional integrated circuit (3DIC) with a novel location-controlled-grain (LCG) technique. Through this method, the impact of laser flux, amorphous Si thickness and interlayer dielectric (ILD) thickness on that model can be investigated. Furthermore, with the assistance of thermal damage simulation, we can utilize the optimal process parameters in this state-of-the-art technique to accelerate the development of advanced semiconductor technologies.
- Published
- 2019
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