95 results on '"Cheramy, S."'
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2. Nanopackaging solution from clean room to UHV Environment: Hydrogen Passivated Si (100) Substrate Fabrication and Use for Atomic Scale Investigations and Self-Assembled Monolayer Grafting
3. Toward Three-Dimensional High Density
4. RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits
5. How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?
6. ExaNoDe: Combined Integration of Chiplets on Active Interposer with Bare Dice in a Multi-Chip-Module for Heterogeneous and Scalable High Performance Compute Nodes
7. Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
8. Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures
9. Robustness and reliability achievements for direct hybrid bonding integration: a review
10. Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications
11. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
12. 3DVLSI, Technology and Application
13. A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches
14. 1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy
15. RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer
16. Electrical Performance of High Density 10 µm Diameter 20 µm Pitch Cu-Pillar with Chip to Wafer Assembly
17. Hot spot aware microchannel cooling add-on for microelectronic chips in mobile devices
18. Characterization of a high conductivity heat spreading solution for hot spots in compact packages
19. A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links
20. Towards high density 3D interconnections
21. ITAC: A complete 3D integration test platform
22. Heat spreading packaging solutions for hybrid bonded 3D-ICs
23. Thin micro-cold plate for hot-spot aware chip cooling
24. Development of fine pitch interconnections for 3D integrated circuits
25. Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages
26. Development of Characterization Platform Dedicated to Bio-Inspired Objects at the Nanoscale
27. Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
28. New challenges and opportunities for 3D integrations
29. Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement
30. Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration
31. A comprehensive platform for thermal studies in TSV-based 3D integrated circuits
32. Assessment of a heat spreading solution for hot spots cooling in compact packages
33. Underfilling techniques comparison in 3D CtW stacking approach
34. Which interconnects for which 3D applications? Status and perspectives
35. Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration
36. Thermal correlation between measurements and FEM simulations in 3D ICs
37. RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits
38. Investigation of copper-tin transient liquid phase bonding reliability for 3D integration
39. Towards alternative technologies for fine pitch interconnects
40. Wafer level underfill entrapment in solder joint during thermocompression: Simulation and experimental validation
41. WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation
42. Innovative wafer-level encapsulation & underfill material for silicon interposer application
43. Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
44. Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process
45. Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack
46. 3D integration demonstration of a wireless product with design partitioning
47. TSV and Cu-Cu direct bonding: two key technologies for High Density 3D
48. Process and RF modelling of TSV last approach for 3D RF interposer
49. Cyclization of Zincated Homoallylamino Nitriles to Methanopyrrolidines
50. TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration
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