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Overheating has emerged as a primary challenge constraining the reliability and performance of next-generation high-performance electronics, such as chiplets and (ultra)wide bandgap electronics. Advanced heterogeneous integration not only constitutes a pivotal technique for fabricating these electronics but also offers potential solutions for thermal management. This study presents the integration of high thermal conductivity semiconductors, specifically, 3C-SiC thin films and diamond substrates, through a room-temperature surface-activated bonding technique. Notably, the thermal conductivity of the 3C-SiC films is among the highest for all semiconductor films which can be integrated near room temperature with similar thicknesses. Furthermore, following annealing, the interfaces between 3C-SiC and diamond demonstrate a remarkable enhancement in thermal boundary conductance (TBC), reaching up to approximately 300%, surpassing all other grown and bonded heterointerfaces. This enhancement is attributed to interfacial reactions, specifically the transformation of amorphous silicon into SiC upon interaction with diamond, which is further corroborated by picosecond ultrasonics measurements. Subsequent to annealing at 1100 C, the achieved TBC (150 MW/m2-K) is record-high among all bonded diamond interfaces. Additionally, the visualization of large-area TBC, facilitated by femtosecond laser-based time-domain thermoreflectance measurements, shows the uniformity of the interfaces which are capable of withstanding temperatures as high as 1100 C. Our research marks a significant advancement in the realm of thermally conductive heterogeneous integration, which is promising for enhanced cooling of next-generation electronics.

The coupled transport of charge and heat provide fundamental insights into the microscopic thermodynamics and kinetics of materials. We describe a sensitive ac differential resistance bridge that enables measurements of the temperature difference on two sides of a coin cell with a resolution of better than 10 uK. We use this temperature difference metrology to determine the ionic Peltier coefficients of symmetric Li-ion electrochemical cells as a function of Li salt concentration, solvent composition, electrode material, and temperature. The Peltier coefficients {\Pi} are negative, i.e., heat flows in the direction opposite to the drift of Li ions in the applied electric field, large, 30 kJ mol-1, and increase with increasing temperature at T > 300 K. The Peltier coefficient is approximately constant on time scales that span the characteristic time for mass diffusion across the thickness of the electrolyte, suggesting that heat of transport plays a minor role in comparison to the changes in partial molar entropy of Li at the interface between the electrode and electrolyte. Our work demonstrates a new platform for studying the non-equilibrium thermodynamics of electrochemical cells and provides a window into the transport properties of electrochemical materials through measurements of temperature differences and heat currents that complement traditional measurements of voltages and charge currents.

Iron-based superconductors have great potential for high-power applications due to their prominent high-field properties. One of the central issues in enhancing the critical current density of iron-based superconducting wires is to reveal the roles and limitations of grain boundaries in supercurrent transport. Here, we finely tuned the electronic properties of grain boundaries by doping Ba1-xKxFe2As2 superconductors in a wide range (0.25

beta-Ga2O3 is a wide bandgap semiconductor with electrical properties better than SiC and GaN which makes it promising for applications of next-generation power devices. However, the thermal conductivity of \b{eta}-Ga2O3 is more than one order of magnitude lower than that of SiC and GaN, resulting in serious thermal management problems that limit device performance and reliability. This work reports selectively transferring of high thermal conductivity 3C-SiC thin film grown on Si to beta-Ga2O3 (001) substrate using surface activated bonding (SAB) technique at room temperature, to attempt extracting the heat from the surface of the devices. A 4.5-nm-thick interfacial crystal defect layer is formed at the as-bonded 3C-SiC/beta-Ga2O3 interface. The thickness of the interfacial crystal defect layer decreases with increasing annealing temperature, which decreases to 1.5 nm after annealing at 1000 C. No voids and unbonded area are observed at the interfaces, even after annealing at temperature as high as 1000 C. The thermal boundary conductance (TBC) of the 1000 C-annealed 3C-SiC/beta-Ga2O3 interface and thermal conductivity of the beta-Ga2O3 substrate was measured by time-domain thermoreflectance (TDTR). The 3C-SiC/beta-Ga2O3 TBC value was determined to be 244 MW/m2-K, which is the highest value ever reported for SiC/Ga2O3 interfaces, due to the high-quality heterointerface. Our works demonstrate that selective transferring of 3C-SiC film to the beta-Ga2O3 substrate is an efficient path to improve heat dissipation of the \b{eta}-Ga2O3 power devices.

High thermal conductivity electronic materials are critical components for high-performance electronic and photonic devices as either active functional materials or thermal management materials. We report an isotropic high thermal conductivity over 500 W m-1K-1 at room temperature in high-quality wafer-scale cubic silicon carbide (3C-SiC) crystals, which is the second highest among large crystals (only surpassed by diamond). Furthermore, the corresponding 3C-SiC thin films are found to have record-high in-plane and cross-plane thermal conductivity, even higher than diamond thin films with equivalent thicknesses. Our results resolve a long-lasting puzzle that the literature values of thermal conductivity for 3C-SiC are perplexingly lower than the structurally more complex 6H-SiC. Further analysis reveals that the observed high thermal conductivity in this work arises from the high purity and high crystal quality of 3C-SiC crystals which excludes the exceptionally strong defect-phonon scatterings in 3C-SiC. Moreover, by integrating 3C-SiC with other semiconductors by epitaxial growth, we show that the measured 3C-SiC-Si TBC is among the highest for semiconductor interfaces. These findings not only provide insights for fundamental phonon transport mechanisms, also suggest that 3C-SiC may constitute an excellent wide-bandgap semiconductor for applications of power electronics as either active components or substrates.

Coherent conversion of microwave and optical photons can significantly expand the ability to control the information processing and communication systems. Here, we experimentally demonstrate the microwave-to-optical frequency conversion in a magneto-optical whispering gallery mode microcavity. By applying a magnetic field parallel to the microsphere equator, the intra-cavity optical field will be modulated when the magnon is excited by the microwave drive, leading to microwave-to-optical conversion via the magnetic Stokes and anti-Stokes scattering processes. The observed single sideband conversion phenomenon indicates a non-trivial optical photon-magnon interaction mechanism, which is derived from the magnon induced both the frequency shift and modulated coupling rate of optical modes. In addition, we demonstrate the single-sideband frequency conversion with an ultrawide tuning range up to 2.5GHz, showing its great potential in microwave-to-optical conversion., Comment: 6 pages, 4 figures

The reversible heat in lithium-ion batteries (LIBs) due to entropy change is fundamentally important for understanding the chemical reactions in LIBs and developing proper thermal management strategies. However, the direct measurements of reversible heat are challenging due to the limited temperature resolution of applied thermometry. In this work, by developing an ultra-sensitive thermometry with a differential AC bridge using two thermistors, the noise-equivalent temperature resolution we achieve (10 uK) is several orders of magnitude higher than previous thermometry applied on LIBs. We directly observe reversible heat absorption of a LIR2032 coin cell during charging with negligible irreversible heat generation and a linear relation between heat generations and discharging currents. The cell entropy changes determined from the reversible heat agree excellently with those measured from temperature dependent open circuit voltage. Moreover, it is found that the large reversible entropy change can cancel out the irreversible entropy generation at a charging rate as large as C/3.7 and produce a zero-heat-dissipation LIB during charging. Our work significantly contributes to fundamental understanding of the entropy changes and heat generations of the chemical reactions in LIBs, and reveals that reversible heat absorption can be an effective way to cool LIBs during charging.

Interfaces impede heat flow in micro/nanostructured systems. Conventional theories for interfacial thermal transport were derived based on bulk phonon properties of the materials making up the interface without explicitly considering the atomistic interfacial details, which are found critical to correctly describing thermal boundary conductance (TBC). Recent theoretical studies predicted the existence of localized phonon modes at the interface which can play an important role in understanding interfacial thermal transport. However, experimental validation is still lacking. Through a combination of Raman spectroscopy and high-energy resolution electron energy-loss spectroscopy (EELS) in a scanning transmission electron microscope, we report the first experimental observation of localized interfacial phonon modes at ~12 THz at a high-quality epitaxial Si-Ge interface. These modes are further confirmed using molecular dynamics simulations with a high-fidelity neural network interatomic potential, which also yield TBC agreeing well with that measured from time-domain thermoreflectance (TDTR) experiments. Simulations find that the interfacial phonon modes have obvious contribution to the total TBC. Our findings may significantly contribute to the understanding of interfacial thermal transport physics and have impact on engineering TBC at interfaces in applications such as electronics thermal management and thermoelectric energy conversion.

Management of heat during charging and discharging of Li-ion batteries is critical for their safety, reliability, and performance. Understanding the thermal conductivity of the materials comprising batteries is crucial for controlling the temperature and temperature distribution in batteries. This work provides systemic quantitative measurements of the thermal conductivity of three important classes of solid electrolytes (oxides, sulfides, and halides) over the temperature range 150-350 K. Studies include the oxides Li1.5Al0.5Ge1.5(PO4)3 and Li6.4La3Zr1.4Ta0.6O12, sulfides Li2S-P2S5, Li6PS5Cl, and Na3PS4, and halides Li3InCl6 and Li3YCl6. Thermal conductivities of sulfide and halide solid electrolytes are in the range 0.45-0.70 W m-1 K-1; thermal conductivities of Li6.4La3Zr1.4Ta0.6O12 and Li1.5Al0.5Ge1.5(PO4)3 are 1.4 W m-1 K-1 and 2.2 W m-1 K-1, respectively. For most of the solid electrolytes studied in this work, the thermal conductivity increases with increasing temperature; i.e., the thermal conductivity has a glass-like temperature dependence. The measured room-temperature thermal conductivities agree well with the calculated minimum thermal conductivities indicating the phonon mean-free-paths in these solid electrolytes are close to an atomic spacing. We attribute the low, glass-like thermal conductivity of the solid electrolytes investigated to the combination of their complex crystal structures and the atomic-scale disorder induced by the materials processing methods that are typically needed to produce high ionic conductivities.

Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding interfacial thermal transport, advanced thermal characterization techniques which can visualize thermal conductance across buried interfaces, especially for nonmetal-nonmetal interfaces, are still under development. This work reports a dual-modulation-frequency TDTR mapping technique to visualize the thermal conduction across buried semiconductor interfaces for beta-Ga2O3-SiC samples. Both the beta-Ga2O3 thermal conductivity and the buried beta-Ga2O3-SiC thermal boundary conductance (TBC) are visualized for an area of 200 um x 200 um. Areas with low TBC values ( smaller than 20 MW/m2-K) are successfully identified on the TBC map, which correspond to weakly bonded interfaces caused by high-temperature annealing. The steady-state temperature rise (detector voltage), usually ignored in TDTR measurements, is found to be able to probe TBC variations of the buried interfaces without the limit of thermal penetration depth. This technique can be applied to detect defects/voids in deeply buried heterogeneous interfaces non-destructively, and also opens a door for the visualization of thermal conductance in nanoscale nonhomogeneous structures.

Nowadays the development of high-field magnets strongly relies on the performance of superconducting materials. Iron-based superconductors exhibit high upper critical fields and low electromagnetic anisotropy, making them particularly attractive for high-field applications, especially in particle accelerator magnets, nuclear magnetic resonance spectrometers, medical magnetic resonance imaging systems and nuclear fusion reactors. Herein, through an industrially scalable and cost-effective manufacturing strategy, a practical level critical current density up to 1.1x10^5 A/cm2 at 4.2 K in an external magnetic field of 10 T was achieved in Cu/Ag composite sheathed Ba0.6K0.4Fe2As2 superconducting tapes. The preparation strategy combines flat rolling to induce grain texture and a subsequent hot-isostatic-pressing densification. By varying the parameters of rolling, the degree of grain texture was engineered. It is found that the transport properties of the Ba1-xKxFe2As2 tapes can be enhanced by applying a large amount of deformation during rolling, which can be attributed to the improved degree of c-axis texture. Microstructure characterizations on the highest-performance tape demonstrate that the Ba1-xKxFe2As2 phase has a uniform element distribution and small grains with good connectivity. Grain boundary pinning is consequently enhanced as proved by large currents circulating through the sample even at 25 K. Our work proves that Cu/Ag composite sheathed Ba1-xKxFe2As2 superconducting tapes can be a promising competitor for practical high-field applications in terms of the viable, scalable and cost-effective fabrication strategy applied and the high transport properties achieved in this work., Comment: 30 pages, 7 figures, accepted to SCIENCE CHINA Materials