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For the first time, we use electrical characterization, spectrally-resolved electroluminescence measurements and degradation tests to explain the negative activation energy of gate reliability in power GaN HEMTs with p-GaN Schottky gate. First, the origin of gate leakage current was modeled. The results indicate that the gate leakage current originates from three different mechanisms: (i) thermionic emission of electrons from the uid-GaN layer across the AlGaN barrier, for gate voltages below threshold $(V_{G} \lt V_{TH})$ , (ii) thermionic emission of electrons from the channel to the p-GaN layer $(V_{TH} \lt V_{G} \lt 4.5 V)$ and (iii) trap-assisted-tunneling of holes at the Schottky metal for higher gate voltages. Then, the analysis of the reliability as function of gate bias demonstrated a negative activation energy (longer lifetime at high temperature). By analyzing the electroluminescence spectra under high positive bias, the improved time to failure at high temperatures was ascribed to the increased hole injection and recombination, that reduces the overall number of electrons that undergo avalanche multiplication, leading to the breakdown. Finally, the model was validated by comparing the electrical properties and conduction model of the devices pre- and post-stress.

In this paper we investigate the reliability of AlGaN-based UV-C LEDs with an emission wavelength of 265 nm. By submitting the devices to constant current stress, two main electrical degradation processes are identified: a turn-on voltage shift and an increase in the forward leakage current. In particular, these processes were respectively attributed to: (i) a partial passivation of the Mg-doping concentration in the region adjacent to the contact, probably caused by a local hydrogen diffusion, and ii) a diffusion/generation process of defects in the interlayer, responsible for the increase in the trap-assisted tunneling. To validate these hypotheses, we employed TCAD simulations by varying only the Mg-doping concentration in the region adjacent to the p-contact and the defect density in the interlayer. Thus, we correctly reproduced the experimental variation in electrical characteristics, confirming the physical mechanisms identified.

The mass production of photovoltaic (PV) devices requires fast and reliable characterization methods and equipment. PV manufacturers produce a complete module roughly every 20 s, and the electrical performance assessment is typically completed in less than 1 s. Times are even more stringent during cell manufacturing. To be competitive in the PV market, perovskite solar cells and modules aim to the same target, i.e., fast and reliable quality assessment. This communication report discusses the limit of characterizing the current perovskite technology. Standard current vs voltage measurements are compared to maximum power point tracking (MPPT), and a fast MPPT procedure is developed to meet the highly demand standard for quality control in the industry of PV production.

Abstract Trapping phenomena degrade the dynamic performance of wide-bandgap transistors. However, the identification of the related traps is challenging, especially in presence of non-ideal defects. In this paper, we propose a novel methodology (trap-state mapping) to extract trap parameters, based on the mathematical study of stretched exponential recovery kinetics. To demonstrate the effectiveness of the approach, we use it to identify the properties of traps in AlGaN/GaN transistors, submitted to hot-electron stress. After describing the mathematical framework, we demonstrate that the proposed methodology can univocally describe the properties of the distribution of trap states. In addition, to prove the validity and the usefulness of the model, the trap properties extracted mathematically are used as input for TCAD simulations. The results obtained by TCAD closely match the experimental transient curves, thus confirming the accuracy of the trap-state mapping procedure. This methodology can be adopted also on other technologies, thus constituting a universal approach for the analysis of multiexponential trapping kinetics.

The defectiveness of InGaN-based quantum wells increases with low indium contents, due to the compressive strain induced by the lattice mismatch between the InGaN and GaN layers, and to the stronger incorporation of defects favored by the presence of indium. Such defects can limit the performance and the reliability of LEDs, since they can act as non-radiative recombination centers, and favor the degradation of neighboring semiconductor layers. To investigate the location of the layers mostly subjected to degradation, we designed a color-coded structure with two quantum wells having different indium contents. By leveraging on numerical simulations, we explained the experimental results in respect of the ratio between the emissions of the two main peaks as a function of current. In addition, to evaluate the mechanisms that limit the reliability of this type of LED, we performed a constant-current stress test at high temperature, during which we monitored the variation in the optical characteristics induced by degradation. By comparing experimental and simulated results, we found that degradation can be ascribed to an increment of traps in the active region. This process occurs in two different phases, with different rates for the two quantum wells. The first phase mainly occurs in the quantum well closer to the p-contact, due to an increment of defectiveness. Degradation follows an exponential trend, and saturates during the second phase, while the quantum well close to the n-side is still degrading, supporting the hypothesis of the presence of a diffusive front that is moving from the p-side towards the n-side. The stronger degradation could be related to a lowering of the injection efficiency, or an increment of SRH recombination driven by a recombination-enhanced defect generation process.

In this paper, we compare and discuss the main techniques for the analysis of the dynamic performance of GaN-based transistors. The pulsed current-voltage characterization provides information on the effect of different trapping voltages on various bias points of the device under test, leading to the detection of all the possible effects, as well as to the choice of the optimal filling and measure bias conditions in other techniques. The drain current transients use one of the identified bias configurations to extract information on the deep level signature responsible for the performance variation and, thus, they can pinpoint the corresponding physical crystal lattice configuration, providing useful information to the growers on how the issue can be solved. Finally, given the complex interplay between the filling and emission time constants, the gate frequency sweeps can be used to obtain the real performance in the target operating condition.

This work investigates p+n−n GaN-on-Si vertical structures, through dedicated measurements and TCAD simulations, with the ultimate goal of identifying possible strategies for leakage and breakdown optimization. First, the dominant leakage processes were identified through temperature-dependent current–voltage characterization. Second, the breakdown voltage of the diodes was modelled through TCAD simulations based on the incomplete ionization of Mg in the p+ GaN layer. Finally, the developed simulation model was utilized to estimate the impact of varying the p-doping concentration on the design of breakdown voltage; while high p-doped structures are limited by the critical electric field at the interface, low p-doping designs need to contend with possible depletion of the entire p-GaN region and the consequent punch-through. A trade-off on the value of p-doping therefore exists to optimize the breakdown.

The vertical Gallium Nitride-on-Silicon (GaN-on-Si) trench metal-oxide-semiconductor field effect transistor (MOSFET) is a promising architecture for the development of efficient GaN-based power transistors on foreign substrates for power conversion applications. This work presents an overview of recent case studies, to discuss the most relevant challenges related to the development of reliable vertical GaN-on-Si trench MOSFETs. The focus lies on strategies to identify and tackle the most relevant reliability issues. First, we describe leakage and doping considerations, which must be considered to design vertical GaN-on-Si stacks with high breakdown voltage. Next, we describe gate design techniques to improve breakdown performance, through variation of dielectric composition coupled with optimization of the trench structure. Finally, we describe how to identify and compare trapping effects with the help of pulsed techniques, combined with light-assisted de-trapping analyses, in order to assess the dynamic performance of the devices.

We present a detailed analysis of the gradual degradation mechanisms of InGaAs Light-Emitting Diodes (LEDs) tuned for optical emission in the 1.45–1.65 μm range. Specifically, we propose a simple and effective methodology for estimating the relative changes in non-radiative lifetime, and a procedure for extracting the properties of defects responsible for Shockley-Read-Hall recombination. By means of a series of accelerated aging experiments, during which we evaluated the variations of the optical and electrical characteristics of three different families of LEDs, we were able to identify the root causes of device degradation. Specifically, the experimental results show that, both for longer stress time at moderate currents or for short-term stress under high injection levels, all the devices are affected: (i) by a partial recovery of the optical emission at the nominal bias current; and (ii) by a decrease in the emission in low-bias regime. This second process was deeply investigated, and was found to be related to the decrease in the non-radiative Shockley-Read-Hall (SRH) lifetime due to the generation/propagation of defects within the active region of the LEDs. Devices tuned for longer-wavelength emission exhibited a second degradation process, which was found to modify the carrier injection dynamics and further speed-up optical degradation in the low bias regime. These processes were ascribed to the effects of a second non-radiative recombination center, whose formation within the active region of the device was induced by the aging procedure. Through mathematical analysis of the degradation data, we could quantify the percentage variation in SRH lifetime, and identify the activation energy of the related defects.

We propose to use a bilayer insulator (2.5 nm Al2O3 + 35 nm SiO2) as an alternative to a conventional uni-layer Al2O3 (35 nm), for improving the performance and the reliability of GaN-on-Si semi vertical trench MOSFETs. This analysis has been performed on a test vehicle structure for module development, which has a limited OFF-state performance. We demonstrate that devices with the bilayer dielectric present superior reliability characteristics than those with the uni-layer, including: (i) gate leakage two-orders of magnitude lower; (ii) 11 V higher off-state drain breakdown voltage; and (iii) 18 V higher gate-source breakdown voltage. From Weibull slope extractions, the uni-layer shows an extrinsic failure, while the bilayer presents a wear-out mechanism. Extended reliability tests investigate the degradation process, and hot-spots are identified through electroluminescence microscopy. TCAD simulations, in good agreement with measurements, reflect electric field distribution near breakdown for gate and drain stresses, demonstrating a higher electric field during positive gate stress. Furthermore, DC capability of the bilayer and unilayer insulators are found to be comparable for same bias points. Finally, comparison of trapping processes through double pulsed and Vth transient methods confirms that the Vth shifts are similar, despite the additional interface present in the bilayer devices.

We investigated the origin of vertical leakage and breakdown in GaN-on-Si epitaxial structures. In order to understand the role of the nucleation layer, AlGaN buffer, and C-doped GaN, we designed a sequential growth experiment. Specifically, we analyzed three different structures grown on silicon substrates: AlN/Si, AlGaN/AlN/Si, C:GaN/AlGaN/AlN/Si. The results demonstrate that: (i) the AlN layer grown on silicon has a breakdown field of 3.25 MV/cm, which further decreases with temperature. This value is much lower than that of highly-crystalline AlN, and the difference can be ascribed to the high density of vertical leakage paths like V-pits or threading dislocations. (ii) the AlN/Si structures show negative charge trapping, due to the injection of electrons from silicon to deep traps in AlN. (iii) adding AlGaN on top of AlN significantly reduces the defect density, thus resulting in a more uniform sample-to-sample leakage. (iv) a substantial increase in breakdown voltage is obtained only in the C:GaN/AlGaN/AlN/Si structure, that allows it to reach VBD > 800 V. (v) remarkably, during a vertical I−V sweep, the C:GaN/AlGaN/AlN/Si stack shows evidence for positive charge trapping. Holes from C:GaN are trapped at the GaN/AlGaN interface, thus bringing a positive charge storage in the buffer. For the first time, the results summarized in this paper clarify the contribution of each buffer layer to vertical leakage and breakdown.

This paper investigates the reliability of blue-emitting phosphors for Near-UV (NUV) laser excitation. By means of a series of thermal stress experiments, and of stress under high levels of optical excitation, we have been able to identify the physical process responsible for the degradation of Eu2+-activated alkaline-earth halophosphate phosphors under typical and extreme operating conditions. In particular, for temperatures equal to or greater than 450 °C the material exhibited a time-dependent drop in the Photo-Luminescence (PL), which was attributed to the thermally induced ionization of the Eu2+ optically active centers. Several analytical techniques, including spatially and spectrally resolved PL, Electron Paramagnetic Resonance (EPR) and X-ray Photo-emission Spectroscopy (XPS) were used to support this hypothesis and to gain insight on the degradation process. By means of further tests, evidence of this degradation process was also found on samples stressed under a relatively low power density of 3 W/mm2 at 405 nm. This indicated that the optically (and thermally) induced ionization of the optically active species is the most critical degradation process for this family of phosphorescent material. The operating limits of a second-generation Eu-doped halophosphate phosphor were also investigated by means of short-term stress under optical excitation. The experimental data showed that a threshold excitation intensity for continuous pumping exists. Above this threshold, decay of the steady-state PL performance and non-recoverable degradation of the material were found to take place. This behavior is a consequence of the extremely harsh excitation regime, mainly due to the thermal management capabilities of the substrate material employed for our experimental purposes rather than from intrinsic properties of the phosphors.

The aim of this work is to present a potential application of gallium nitride-based optoelectronic devices. By using a laser diode and a photodetector, we designed and demonstrated a free-space compact and lightweight wireless power transfer system, whose efficiency is limited by the efficiency of the receiver. We analyzed the effect of the electrical load, temperature, partial absorption and optical excitation distribution on the efficiency, by identifying heating and band-filling as the most impactful processes. By comparing the final demonstrator with a commercial RF-based Qi system, we conclude that the efficiency is still low at close range, but is promising in medium to long range applications. Efficiency may not be a limiting factor, since this concept can enable entirely new possibilities and designs, especially relevant for space applications.

This paper presents an extensive analysis of the operating principles, theoretical background, advantages and limitations of laser-based lighting systems. In the first part of the paper we discuss the main advantages and issues of laser-based lighting, and present a comparison with conventional LED-lighting technology. In the second part of the paper, we present original experimental data on the stability and reliability of phosphor layers for laser lighting, based on high light-intensity and high-temperature degradation tests. In the third part of the paper (for the first time) we present a detailed comparison between three different solutions for laser lighting, based on (i) transmissive phosphor layers; (ii) a reflective/angled phosphor layer; and (iii) a parabolic reflector, by discussing the advantages and drawbacks of each approach. The results presented within this paper can be used as a guideline for the development of advanced lighting systems based on laser diodes.