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This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensorsystems that have been developed to monitor the motion and vital signs of humans invarious environments. Integration of radio frequency transmitter (RF) technology withcomplementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. Theessential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiralinductors for an LC resonator and an integrated antenna have been fabricated and evaluatedexperimentally. The fabricated RF transmitter and integrated antenna were packaged withsubminiature series A (SMA) connectors, respectively. For the impedance (50 ) matching,a bonding wire type inductor was developed. In this paper, the design and fabrication of thebonding wire inductor for impedance matching is described. Integrated techniques for theRF transmitter by CMOS compatible processes have been successfully developed. Aftermatching by inserting the bonding wire inductor between the on-chip integrated antennaand the VCO output, the measured emission power at distance of 5 m from RF transmitterwas -37 dBm (0.2 μW).

An airflow sensing chip, which integrates MEMS sensors with their CMOS signal processing circuits into a single chip, is proposed for respiration detection. Three micro-cantilever-based airflow sensors were designed and fabricated using a 0.35 \mum CMOS/MEMS 2P4M mixed-signal polycide process. Two main differences were present among these three designs: they were either metal-covered or metal-free structures, and had either bridge-type or fixed-type reference resistors. The performances of these sensors were measured and compared, including temperature sensitivity and airflow sensitivity. Based on the measured results, the metal-free structure with fixed-type reference resistors is recommended for use, because it has the highest airflow sensitivity and also can effectively reduce the output voltage drift caused by temperature change. [ABSTRACT FROM PUBLISHER]