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1. 1.6Tbps Coherent 2-Channel Transceiver Using a Monolithic Tx/Rx InP PIC and Single SiGe ASIC

2. 2-Channels × 100 GBd 32QAM Transmission over 500 km Enabled by InP PICs and SiGe ASICs

3. Demonstration of Fully Integrated $6\lambda \times 200$ Gbps (1.2 Tbps) PICs and Transceivers in L-Band

4. $4 \times 600$ Gb/s Photonic IC Transmitter and Receiver Modules

5. Multi-channel InP-based Coherent PICs with Hybrid Integrated SiGe Electronics Operating up to 100 GBd, 32QAM

6. Extended C-band tunable multi-channel InP-based coherent receiver PICs

7. Data-center, metro and long-haul applications based on advanced photonic integrated circuits

8. Integrated Devices for High-Performance Optical Links

9. 100 Gb/s photonic integrated circuits with over 1 billion field hours of operation and zero field failures

10. Terabit Photonic Integrated Circuits in InP

11. Integrated laser sources for WDM coherent transmission

12. 112 Tb/s superchannel coherent PM-QPSK InP transmitter photonic integrated circuit (PIC)

13. Current Status of Large-Scale InP Photonic Integrated Circuits

14. Terabit photonic integrated circuits in InP: 10-channel coherent PM-QPSK transmitter and receiver PICs operating at 100 Gb/s per wavelength

15. Multi-Channel Coherent PM-QPSK InP Transmitter Photonic Integrated Circuit (PIC) Operating At 112 Gb/s Per Wavelength

16. Large-Scale Monolithic Integration of PM-QPSK Modulation Architecture in 500Gb/s Transmitters

17. Five-channel, 114 Gbit/s per channel, dual carrier, dual polarisation, coherent QPSK, monolithic InP receiver photonic integrated circuit

18. Photonic integrated circuits for phase modulation formats

19. Optical system performance of large-scale photonic integrated circuits

20. 100 Gb/s (10/spl times/10 Gb/s) DWDM photonic integrated circuit transmitters and receivers

24. Large-scale photonic integrated circuits.

29. Fiber-optic liquid contact measurements in pool boiling.

30. Low cost/high volume laser modules using silicon optical bench technology

37. Integrated devices for high-performance optical links.

42. Monolithically integrated L-band PICs and transceiver modules with 6λ x 200 Gbps (1.2 Tbps) for C + L band communication systems.

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