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Contemporary treatment of stage II/III rectal cancer combines chemotherapy, chemoradiation, and surgery, though the sequence of surgery with neoadjuvant treatments and benefits of minimally-invasive surgery (MIS) is debated.To describe patterns of surgical approach for stage II/III rectal cancer in relation to neoadjuvant therapies.A retrospective cohort was created using the National Cancer Database. Primary outcome was rate of sphincter-sparing surgery after neoadjuvant therapy. Secondary outcomes were surgical approach (open, laparoscopic, or robotic), surgical quality (R0 resection and 12+ lymph nodes), and overall survival.A total of 38927 patients with clinical stage II or III rectal adenocarcinoma underwent surgical resection from 2010-2016. Clinical stage II patients had neoadjuvant chemoradiation less frequently compared to stage III (75.8%Sphincter preservation rates are similar across stage II and III rectal cancer, regardless of delivery of preoperative chemotherapy, chemoradiation, or both. At a national level, there is a shift to predominantly MIS approaches for rectal cancer, regardless of whether sphincter sparing procedure is performed.

In this study, a high-density organic hybrid substrate for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and characterization of the hybrid substrate with an interconnect-layer. A non-linear finite element analysis is performed to show the state of stress at the vias filled with a conductive paste of the interconnect-layer.

In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are red ( $125 \times 250 \times 100 ~\mu \text{m}$ ), green ( $130 \times 270 \times 100 ~\mu \text{m}$ ), and blue ( $130 \times 270 \times 100 ~\mu \text{m}$ ). The spacing among the RGB mini-LEDs is $80~\mu \text{m}$ , the pixel-to-pixel spacing is also $\sim 80~\mu \text{m}$ , and the pixel pitch is $625~\mu \text{m}$ . The temporary glass panel for making the redistribution layers (RDLs) of the package is $515 \times 510 \times 1.1$ mm in size. To increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into 4( $2 \times 2$ pixels)-in-one surface mount device (SMD), that is, a total of 12 R, B, and G mini-LEDs. A PCB ( $132\,\,mm \times 77$ mm) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.

In this study, the reliability of the solder joints of a heterogeneous integration of one large chip (10 × 10 mm) and two smaller chips (7 × 5 mm) by a fan-out method with a redistribution layer-first substrate fabricated on a 515 × 510-mm panel is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the heterogeneous integration package on a printed circuit board (PCB). The thermal cycling test results are plotted into a Weibull distribution. The Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope and the true 10% life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at the test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the PCB assembly of the heterogeneous integration package are provided and discussed. A nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for the heterogeneous integration PCB assembly and correlated with the thermal cycling test results.

In this study, the reliability of the solder joints of a six-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test (−55°C Δ 125°C, 50-min cycle) of the six-side molded PLCSP on a printed circuit board. For comparison purpose, the one without six-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution, and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a nonlinear, time- and temperature-dependent 3-D finite element simulation is performed for these two cases and correlated with the thermal cycling test results.

In this study, the design, materials, process, assembly, and reliability of a six-side molded panel-level chip-scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the redistribution layers (RDLs) of the PLCSP on a large temporary panel with multiple device wafers. Because all the printed circuited board (PCB) panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized. Thus, it is very high throughput. Because all the processes/equipment are PCB processes/equipment (not semiconductor process/equipment), it is a very low-cost process. After the fabrication of RDLs, the wafers from the PCB panel were debonded. It is followed by solder ball mounting and fabricating the six-side molded PLCSP from the original device wafers with RDLs. The drop test and the results including failure analysis of the PLCSP are presented. Thermal cycling of the six-side molded PLCSP PCB assembly is performed by a nonlinear temperature- and time-dependent finite-element simulation.

In this investigation, the chip-last, redistribution-layer (RDL)–first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10 × 10 mm2) and two small chips (7 × 5 mm2) by an FOPLP method on a 20 × 20-mm2 RDL-first substrate fabricated on a 515 × 510 mm2 temporary glass panel. Reliability test such as the drop test of the heterogeneous integration package on a printed circuit board (PCB) is performed, and test results including failure analysis are presented. Some recommendations are also provided.

In this study, the design, materials, process, assembly, and reliability of a 6-side molded panel-level chip scale package (PLCSP) are presented. Emphasis is placed on the fabrication of the RDLs (redistribution layers) of the PLCSP on a large temporary panel with multiple device wafers. Since all the printed circuited board (PCB) panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized. Thus, it is very high throughput. Since all the processes/equipment are PCB process/equipment (not semiconductor process/equipment), it is a very low cost process. After the fabrication of RDLs, the wafers from the PCB panel are debonded. It is followed by solder ball mounting and fabricating the 6-side molded PLCSP from the original device wafers with RDLs. The drop test and the results including failure analysis of the PLCSP are presented. Thermal cycling of the 6-side molded PLCSP PCB assembly is performed by a nonlinear temperature- and time-dependent finite-element simulation.

In this study, a very high-throughput and low-cost packaging method for fabricating the fan-in chip-scale package is presented. Emphasis is placed on the utilization of the existing printed circuit board (PCB) panel carriers and the corresponding PCB equipment for making the redistribution-layers (RDLs), vias, under bump metallurgy (UBM), contact pads, solder mask, and surface finishing of the package. Since all the PCB panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized.

In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a heterogeneous integration of one large chip (10 mm $\times 10$ mm) and two small chips (7 mm $\times 5$ mm) by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a 515 mm $\times510$ mm panel. Reliability assessment by thermomechanical simulation includes thermal cycling of the heterogeneous integration of the three-chip package on a printed circuit board (PCB) assembly that is performed by a nonlinear temperature- and time-dependent finite-element simulation.

347 Background: Zanidatamab (zani) is an anti-HER2 bispecific antibody against ECD4 and ECD2 with demonstrated activity and tolerability in a range of HER2-expressing cancers. This Phase (Ph) 2 study (NCT03929666) evaluates zani in combination with chemotherapy (chemo) as first-line treatment for patients (pts) with advanced HER2-expressing mGEA. Methods: Eligible pts for this ongoing, open-label study had not received any prior systemic therapy for mGEA. Pts received zani + physician’s choice of multi-agent chemo (mFOLFOX6, CAPOX, or FP). Antidiarrheal prophylaxis for cycle 1 was added after the first 25 pts were treated. Following demonstration of tolerability of the regimens in an initial safety cohort, the primary study objective was to evaluate antitumor activity. Results: Pts were enrolled between Aug 29, 2019 and Feb 18, 2022 with a data cutoff of July 28, 2022 (N=46 pts; zani + mFOLFOX6 [24], zani + CAPOX [20], or zani + FP [2]). Median age was 58 yrs; 85% male; 42 pts (91%) had HER2+ tumors (IHC 3+ or 2+ with ISH-positivity) based on central testing. Median duration of follow-up among all 46 pts was 21.5 months (mo) and 20 pts (43%) remain on treatment. In 38 response-evaluable pts with HER2+ tumors, confirmed objective response rate (cORR) was 79% (95% CI: 63-90%) and disease control rate was 92% (95% CI: 79-98%); 3 pts achieved complete response. Median duration of response (DOR) was 20.4 mo (95% CI: 6.8-not estimable [NE]), with 57% (17/30) pts having an ongoing response at data cut-off (1 pt has ongoing response >29 months). In all 42 pts with HER2+ tumors, median progression-free survival (PFS) was 12.5 mo (95% CI: 7.1-NE) and median overall survival (OS) was not yet reached. Survival rate at 18 mo was estimated to be 87.3%. The most common (≥25% pts) treatment-related (zani and/or chemo) adverse events (TRAE) in all pts were diarrhea, nausea, peripheral sensory neuropathy, decreased appetite, fatigue, vomiting, and hypokalemia. Diarrhea was the most common Gr3+ TRAE, lasting a median (interquartile range) of 3 (2-5) days, with the majority of events occurring in cycle 1; incidence of all Gr3+ events was 56% in 25 pts who did not receive prophylaxis and 14% in 21 pts who did. There were no treatment-related deaths. Conclusions: In pts with HER2+ mGEA, zani + chemo is a highly active treatment regimen with a manageable safety profile. This maturing data set demonstrates durable disease control with encouraging cORR, DOR, PFS and OS results. A global Ph 3 study (HERIZON-GEA-01; NCT05152147) evaluating zani in combination with physician’s choice of standard chemo with or without the PD-1 inhibitor, tislelizumab, for first-line treatment of advanced HER2+ mGEA is currently enrolling. Clinical trial information: NCT03929666 .

The World Health Organisation has deemed several multi-drug resistant (MDR) nosocomial bacterial pathogens to be of significant threat to human health. A stark increase in morbidity, mortality and the burden to healthcare systems around the world can be attributed to the development of resistance in these bacteria. Accordingly, alternative antimicrobial agents have been sought as an attractive means to combat MDR pathogens, with one such example being antimicrobial peptides (AMPs). Given the reported activity of AMPs, including Pardaxin, MSI-78, dermaseptin-PC (DMPC) and Cecropin B, it is important to understand their activities and modes of action against bacteria for further AMP design. In this study, we compared these AMPs against a panel of nosocomial bacterial pathogens, followed by detailed mechanistic studies. It was found that Pardaxin (1-22) and MSI-78 (4-20) displayed the most pronounced antimicrobial activity against the tested bacteria. The mechanistic studies by membrane permeability and molecular dynamics simulation further confirmed the strong membrane interaction and structure of Pardaxin (1-22) and MSI-78 (4-20), which contributed to their potent activity. This study demonstrated a structure and activity guidance for further design of Pardaxin (1-22) and MSI-78 (4-20) as therapeutics against MDR pathogens. The different effects of DMPC (1-19) and Cecropin B (1-21) on membrane integrity and phospholipid membrane interactions provided critical information for the rational design of next-generation analogues with specificity against either Gram-negative or Gram-positive bacteria.

Oral dental infections are one of the most common diseases affecting humans, with caries and periodontal disease having the highest incidence. Caries and periodontal disease arise from infections caused by oral bacterial pathogens. Current misuse and overuse of antibiotic treatments have led to the development of antimicrobial resistance. However, recent studies have shown that cationic antimicrobial peptides are a promising family of antibacterial agents that are active against oral pathogenic bacteria and also possess less propensity for development of antimicrobial resistance. This timely Review has a focus on two primary subjects: (i) the oral bacterial pathogens associated with dental infections and (ii) the current development of antimicrobial peptides targeting oral pathogens.

ImportanceThis study quantifies the trends in trimodality therapy use and its association with pathologic stage and overall survival of patients with rectal cancer at the population level.ObjectiveTo describe changes between 2006 and 2016 in the sequence and use of chemotherapy/radiation therapy (C/RT), multiagent (MA) chemotherapy, and total neoadjuvant therapy (TNT) for patients with stage 2/3 rectal cancer and identify associations with pathologic stage and survival over time.Design, Setting, and ParticipantsThis retrospective cohort analysis included patient records from the National Cancer Database between 2006 and 2016. Of 110 372 patient records, 77 905 were excluded owing to not receiving trimodality therapy and other predefined exclusion criteria. The final analytic cohort comprised 32 467 patients records treated with trimodality therapy, with 24 297 considered in the survival analysis. Data analysis was performed between June 2020 and December 2021.ExposuresTrimodality therapy was defined as including all of the following: definitive surgery; radiation therapy (RT), alone or in combination with chemotherapy; and neoadjuvant/adjuvant single-agent (SA) or multiagent (MA) chemotherapy independent of RT.Main Outcomes and MeasuresUsing Cox multivariable survival analyses across demographics, surgery type, stage, year of diagnosis, and facility type, treatment groups were allocated as the following: group A: TNT (n = 8883 [27%]); group B: preoperative C/RT plus postoperative SA chemotherapy (n = 5967 [18%]); group C: preoperative C/RT plus postoperative MA chemotherapy (n = 12 926 [40%]); and group D: postoperative C/RT plus MA chemotherapy (n = 4689 [14%]).ResultsThe final analytic cohort comprised 32 467 patients (mean [SD] age at diagnosis, 57.6 [11.6] years; 12 549 [38.7%] women and 19 918 [61.3%] men). Comparing 2016 with 2006, treatment shifted to fewer patients receiving postoperative C/RT (group D) (28% vs 8%; P P P Conclusions and RelevanceIn this cohort study, the shift toward preoperative C/RT and lower pathologic stage was associated with improved overall survival in stage 2/3 rectal cancers.

This paper presents efforts to overcome challenges with empirical probability of detection (POD) estimations in the nuclear power industry through the utilization of a novel virtual flaw method. A virtual round robin (VRR) study was conducted under the Program for Investigation Of NDE by International Collaboration (PIONIC), organized by the United States Nuclear Regulatory Commission (NRC) utilizing data generated by the virtual flaw method. Analysis of results from the VRR was performed by teams from Pacific Northwest National Laboratory (PNNL), Electric Power Research Institute (EPRI), and Aalto University. Empirically derived POD estimations are presented, and challenges associated with obtaining these estimations are discussed. The virtual flaw method is introduced and some details of its implementation for the VRR activity are described. Results from POD analysis of the VRR data by PNNL, EPRI, and Aalto University are presented and a discussion regarding differences in analysis results is provided. Finally, potential future efforts to improve the application of the virtual flaw method and its estimation of POD are discussed.

This paper describes development and demonstration of nondestructive examination (NDE) technologies to support periodic examinations of interim dry storage system (DSS) canisters for spent nuclear fuel in the USA to verify continued safe operation and that the canister confinement is intact and performing its intended safety function. Specifically, this work relates to NDE technology development for “canister” based DSS systems, which form the majority population of DSSs in the USA for interim storage of spent nuclear fuel. Consideration of potential degradation of the welded stainless-steel canister in these systems is required for continued usage in the period of extended operation (PEO) beyond the initial license or certified term. Physical access to the canister surface is constrained due to narrow annulus spaces between the canister and the overpack, tortuous entry pathways, and high temperatures and radiation doses that can be damaging to materials and electronics related to inspections. Several activities to demonstrate NDE technologies for the inspections of different DSS systems are summarized.

This paper describes development and demonstration of remote crawling systems to support periodic examinations of interim dry storage system (DSS) canisters for spent nuclear fuel in the USA. Specifically, this work relates to robotic crawler developments for “canister” based DSS systems, which form the majority population of DSSs in the USA for interim storage of spent nuclear fuel. Consideration of potential degradation of the welded stainless-steel canister in these systems is required for continued usage in the period of extended operation (PEO) beyond their initial licensed or certified terms. Challenges with performing the periodic examinations are associated with physical access to the canister surface, which is constrained due to narrow annulus spaces between the canister and the overpack, tortuous entry pathways, and high temperatures and radiation doses that can be damaging to materials and electronics. Motivations for performing periodic examinations and developing robotic crawlers for performing those examinations remotely will be presented, and several activities to demonstrate robotic crawlers for different DSS systems are summarized.

In this study, the reliability of the solder joints of a heterogeneous integration of one large chip and two smaller chips by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a panel is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\rightleftarrows 125^{\circ}\mathrm{C}$ , 50-minute cycle) of the heterogeneous integration package on a PCB (printed circuit board). The thermal cycling test results are plotted into a Weibull distribution. The Weibull slope and characteristic life at median rank are presented. At 90% confidence, the true Weibull slope and the true 10% life interval are also provided. A linear acceleration factor is adopted to map the solder joint reliability at test condition to the solder joint reliability at an operating condition. The failure location and failure mode of the PCB assembly of the heterogeneous integration package are provided and discussed. A non-linear, time and temperature dependent 3D finite element simulation is performed for the heterogeneous integration PCB assembly and correlated with the thermal cycling test results.

In this study, the feasibility of mini-LED RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are Red ( $125 \times 250 \times 100\mu \mathrm{m}$ ), Green ( $130\times 270\times 100 \mu \mathrm{m}$ ), and Blue ( $130 \times 270\times 100\mu \mathrm{m}$ ). The spacing among the RGB mini-LEDs is $80\mu \mathrm{m}$ , the pixel-to-pixel spacing is also $\sim 80\mu \mathrm{m}$ , and the pixel pitch is $625\mu\mathrm{m}$ . The temporary glass panel for making the RDLs of the package is $515 \times 510\times 1.1\text{mm}$ in size. In order to increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into $4(2\times 2\ \text{pixels})$ in one SMD (surface mount device), i.e., a total of 12 R, B, and G mini-LEDs. A PCB ( $132\text{mm}\times 77\text{mm}$ ) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.

In this study, the reliability of the solder joints of a 6-side molded panel-level chip-scale package (PLCSP) is investigated. Emphasis is placed on the thermal cycling test ( $-55^{\circ}\mathrm{C}\leftrightarrows 125^{\circ}\mathrm{C}$ , 50-minute cycle) of the 6-side molded PLCSP on a PCB (printed circuit board). For comparison purpose, the one without 6-side molded (ordinary) PLCSP is also subjected to the same test. The thermal cycling test results are plotted into a Weibull distribution and the true Weibull slope and true characteristic life at 90% confidence are presented. The solder joint mean life ratio of these two cases and its confidence level are also determined. Furthermore, their solder joint failure location and failure mode are provided. Finally, a non-linear, time and temperature dependent 3D finite element simulation is performed for these two cases and correlated with the thermal cycling test results.

Over the past two decades, the multi-functions of portable electronic devices have a significant influence to change the daily life of people. To meet the requirements of short transmission path of signals, and high I/O counts, ultrathin packaging technology and novel packaging architectures are continuously progressed in accordance with the emergence of advanced technologies in global semiconductor industry. Currently, the architecture of fan out panel-level packaging (FOPLP) grows into the mainstream to meet the essentials of three-dimensional chip stacking and heterogeneous integration. Some researches suggested that the fine metal trace small than 5μm/5μm (line-width/spacing) has been carried out by using redistributed layer (RDL) first interposer technology. In the meanwhile, the package on package framework was introduced for connecting application processor and stacked memory chips, which have been gradually implemented the above-mentioned portable electronic devices. However, the warpage issue of the top and bottom packages are always a critical issue while assembled. In order to solve this issue, an additional reinforcement frame, integrated with RDL interposer is proposed to reduce its deformation caused by coefficient of thermal expansion (CTE) mismatch among the materials of packaging components. The design of reinforcement frame is 15 mm x 15 mm with a 12 mm x 12 mm cavity. There are 540 interconnections with a 300 gm of pitch at the periphery of the present package. To estimate the reliability of abovementioned novel package with efficiency, a non-linear process-oriented finite element analysis (FEA) is approached. In addition, the technique of equivalent material characteristics is also needed into FEA model to simplify the complexity of packaging structure. Finally, the better combinations to control the warpage of the present novel packaging structure through choosing the type of MUF. The warpage of packaging is obtained via the simulation methodology and provided as the designed guideline of related packaging architectures.

In this study, the fan-out chip-last panel-level packaging for heterogeneous integrations is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10mm x 10mm) and two small chips (7mm x 5mm) by a fan-out method with a redistribution-layer (RDL)-first substrate fabricated on a 515mm x 510mm panel. Reliability assessments such as the thermal cycling of the heterogeneous integration of the 3-chip package printed circuit board (PCB) assembly are performed by a nonlinear temperature- and time-dependent finite element simulation.

In this study, a very high-throughput and low-cost packaging method for fabricating the fan-in chip scale package is presented. Emphasis is placed on the utilization of the existing PCB (printed circuit board) panel carriers and the corresponding PCB equipment for making the RDLs (redistribution-layers), vias, UBM (under bump metallurgy), contact pads, and solder mask of the package. Since all the PCB panels are in rectangular shape, some of the device wafers are diced into two or more pieces so the panel is fully utilized.

On the urgent multi-function requirements of mobile products and internet of things, a more than Moore's rule becomes a major concern in accordance with the scaling limitation of advanced devices. Accordingly, the architecture of fan out panel-level packaging (FOPLP) grows into the mainstream to meet the essentials of three-dimensional chip stacking and heterogeneous integration. Nevertheless, unfavorable warpage and residual stress issues resulted from the reconstruction and assembly processes of FOPLP are introduced, decreasing the assembly yield and subsequently long-term packaging reliability. To resolve the above-mentioned problem, this research proposes a 370 × 470 mm2 carrier size FOPLP vehicle combined the novel designs of double embedded metal rings. The major geometrical characteristics of the foregoing metal rings are separately embedded in the multi-redistribution layers (RDLs) and epoxy molding compound (EMC) regions to control the process-induced warpage. On the basis of simulation-based factorial design, the key material selections, such as RDLs composed of photoimagable dielectric (PID) and EMC within the embedded metal rings, is investigated to significant restrain the induced warpage. Notably, a stiffer and a lower coefficient of thermal expansion (CTE) for PID are indicated to be an effective solution of miniaturizing the induced warp during the corresponding curing step. Consequently, a superior capability in warpage reduction after debonding process of panel level vehicles is acquired by means of the present simulation methodology and experimental validation.

The U.S. Nuclear Regulatory Commission (NRC) in cooperation with the nuclear industry has developed a probabilistic fracture mechanics code called xLPR (extremely Low Probability of Rupture). xLPR is a modular-based probabilistic assessment tool for determining probability of leakage and rupture for pressure boundary piping. One of the modules in xLPR is the In-Service Inspection (ISI) module which models the probability of detection (POD) and sizing performance of NDE performed during in-service inspection to account for and predict the influence of periodic inspections on the probability of component leakage and rupture. The accuracy of the ISI module in xLPR is dependent on the quality of the estimates of detection and sizing performance that are input to the module. Multiple efforts have been attempted to quantify the detection and sizing performance of NDE in the nuclear industry. These efforts include an analysis of inspection data collected as part of the industry’s Performance Demonstration Initiative (PDI) and data collected from NRC sponsored round robin studies such as PINC-Program for the Inspection of Nickel Alloy Components and PARENT-Program to Assess the Reliability of Emerging Nondestructive Techniques. Usage of a given data set in the xLPR ISI module requires understanding of which set of data is most representative for the specific scenario under consideration. A comparative analysis of detection performance data from PDI, PINC, and PARENT is provided in this paper in an effort to elucidate for users of xLPR types of applications the above mentioned data sets may be most appropriate for.

Welded stainless steel canisters are used in dry storage systems of spent nuclear fuel from commercial power reactors in the U.S. These systems were initially licensed for 20 years and may receive license renewals for 40 more years from the U.S. Nuclear Regulatory Commission (NRC). The requirements for license renewal include aging management programs (AMPs) to ensure systems, structures, and components (SSCs) continue to perform their safety function. Nondestructive examination (NDE) plays an important role in AMPs that rely on inspection to detect service degradations such as chloride-induced stress corrosion cracking (CISCC) of austenitic stainless steel canisters so that mitigation actions can be taken to manage the aging effects. The American Society of Mechanical Engineer (ASME) is currently developing a code case for the in-service inspection (ISI) of dry storage canisters. The nuclear industry is also developing inspection systems for conducting examinations of canisters. This paper is intended to...

Chemical mechanical polishing (CMP) is commonly utilized in back-end of IC manufacturing. However, it has never been applied in printed-circuit-board (PCB) industry yet. In this paper, CMP with panel level processing is introduced and some promising results for three different applications are demonstrated. This paper showed the evaluation of smoothing and planning capability for Cu traces of semi-additive process. The variation of copper thickness over the panel size of 510mm x 515mm was improved from as Cu plating of 6.7µm to 3.1µm or even 1.5µm by CMP. Better copper thickness uniformity provides better electrical performance. We also evaluated the smoothing down feasibility of Cu pillars (pads) and obtained the Cu height non-uniformity of

Screen content coding plays an important role in many applications. To meet the growing demands of screen content coding, the emerging AV1 video codec incorporates several coding tools, which are specially designed for screen content utilizing its distinctive characteristics. Among these tools, the intra block copy utilizes the characteristic that repeating patterns frequently occur in screen content. This paper presents the technology of intra block copy in AV1. In particular, to efficiently search the predictor in the reconstructed regions of the current picture, AV1 uses the hash matching method at the encoder side. For the generation of hash table, a bottom-to-up manner is adopted to reduce the redundant computation and then decrease the encoding time. In addition, several constraints are involved to facilitate hardware design. Experimental results demonstrate that the intra block copy in AV1 can bring 27.1% bitrate saving for screen content. When compared with the non hash-based intra block copy, the hash-based method achieves 12.2% bitrate saving.

This paper describes an Integrated Web Services Brokering System (IWB) to support the automated discovery and application integration of Web Services. In contrast to more static broker approaches that deal with specific data servers, our approach creates a dynamic knowledge base from Web Service interface specifications. This assists with brokering of requests to multiple data providers even when those providers have not implemented a community standard interface or have implemented different versions of a community standard interface. A specific context we illustrate here is the domain of meteorological and oceanographic (MetOc) Web Services. Our approach includes the use of specific domain ontologies and has evaluated the use of case-based classification in the IWB to support automated Web Services discovery. It was also demonstrated that the mediation approach could be extended to OGC Web Coverage Services.

As society goes to mobile, data bandwidth is required to increase every year. Memory industry community is responsible for products like DDR3, DD4 and for mobile LPDDR3 and LPDDR4, etc. However, the products launching speed do not match well with the industry requirements. Hence revolutionary specs, such as HBM, HMC, and wide I/O 1 and wide I/O 2 have been proposed. However, to realize these memory products, TSV is needed. Even though samples have been delivered but the high price of TSV prevent wide spread use of these innovative memory products.

Microsoft ® Windows Media 9 Series is a set of technologies that enables rich digital media experiences across many types of networks and devices. These technologies are widely used in the industry for media delivery over the internet and other media, and are also applied to broadcast, high definition DVDs, and digital projection in theaters. At the core of these technologies is a state-of-the-art video codec called Windows Media Video 9 (WMV-9), which provides highly competitive video quality for reasonable computational complexity. WMV-9 is currently under standardization by the Society of Motion Picture and Television Engineers (SMPTE) and the spec is at the CD (Committee Draft) stage. This paper includes a brief introduction to Windows Media technologies and their applications, with a focus on the compression algorithms used in WMV-9. We present analysis, experimental results, and independent studies that demonstrate quality benefits of WMV-9 over a variety of codecs, including optimized implementations of MPEG-2, MPEG-4, and H.264/AVC. We also discuss the complexity advantages of WMV-9 over H.264/AVC.

359 Background: GA, FOLFIRINOX and FOLFIRI are standard chemotherapy (CTX) regimens for mPC.The optimal introduction of these regimens following GA is not known. This phase II study evaluated 2 different approaches to this question. Methods: Eligibility criteria included 1) untreated mPC, 2) ECOG PS 0/1, 3) organ function adequate for Rx. Patients (pts) were treated according to one of 2 methods following GA given per standard dose/schedule: FOLFIRINOX (bolus 5-FU omitted) for up to 12 cycles at 24 weeks or at time of disease progression (S); or GA alternating with FOLFIRI q8 weeks up to 48 weeks total Rx (A). Results: 54 evaluable pts (28S, 26A) were enrolled . Pt characteristics included median age 65, M/F 48/52% , liver involvement 89%. 17/53 pts (31%) did not achieve disease control at 8 weeks (8 toxicity/complications , 6 disease progression, 3 declined further protocol therapy). Of the remaining 37 pts, 24/13 were treated with S/A regimens, respectively. Grade ≥ 3 treatment toxicities reported while on study with frequency ≥ 10% included anemia 21%, neutropenia 43%, thrombocytopenia 15%, and fatigue 22%. Grade ≥ 3 neuropathy occurred in 8% of pts. For all 54 pts using RECIST 1.0, CR/PR/SD/DC was 2 (4%)/20 (37%)/19 (35%)/41(76%). Ca19.9 response ≥ 90% was seen in 20/37 (54%). For all pts, median OS was 12.3 months ( 95% CI 8.6-14.5 mo); 12 and 24 mo OS was 51% and 11%, respectively. For the 37 pts with DC on GA at 8 weeks (calculated from start Rx) median OS was 13.5 mo (95% CI 10.7-15.4 mo); 12 and 24 mo OS was 55% and 16% , respectively. No statistically significant differences were seen between S and A with respect to toxicity, response or survival. Conclusions: 1) As opposed to introduction of 5FU-based CTX at the time of disease progression/prohibitive toxicity, introduction prior to that time may be at least comparable regarding both toxicity and OS. 2) This approach may further enhance OS in pts who achieve DC on GA at 8 weeks. 3) Neither S nor A method of 5FU-based CTX introduction following GA was clearly superior in this study. 4) How best to combine 5FU-based combination CTX following GA in mPC merits further study. Supported by the Seena Magowitz Foundation.

Air pollution is of serious concern in many Asian countries, especially in densely populated cities with many highly polluting two-stroke engine vehicles like scooters. Four-stroke engines and electric battery-powered scooters are often proposed as alternatives, but a fuel cell scooter would be superior by offering both zero tailpipe emissions and combustion-scooter class range (200 km) without lengthy battery recharging times. This advanced scooter concept is explored here. A conceptual polymer electrolyte membrane fuel cell scooter design with compact metal hydride hydrogen storage is presented here; technology projections are for the short term, less than 5 years. A computer simulation is developed to examine overall vehicle design. Vehicle characteristics, fuel cell polarization curves, and a Taiwanese urban driving cycle are specified as inputs. Transient power requirements reach 5.9 kW due to rapid acceleration, suggesting a large fuel cell. However, average power is only 600 W: a hybrid vehicle with a smaller fuel cell and peaking batteries could also handle the load. Fuel economies are greater than 500 mpge at steady-state driving. Results show that hybrid vehicles do not significantly improve mileage, but would drastically reduce the size of fuel cell needed. System size is approximately the same as present electric scooters, at 43 l and 61 kg for the fuel cell, hydrogen storage, and electric motor/controller, for a total scooter weight of about 130 kg.