31 results on '"Bresson, N."'
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2. Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
3. Electron magnetoresistance mobility in silicon-on-insulator layers using Kelvin’s technique
4. 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer
5. Ultra-thin strained SOI substrate analysis by pseudo-MOS measurements
6. Integration of buried insulators with high thermal conductivity in SOI MOSFETs: Thermal properties and short channel effects
7. Innovating SOI films: impact of thickness and temperature
8. Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
9. Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields
10. Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness
11. Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
12. Transport measurements in silicon-on-insulator films: Comparison of Hall effect, mobility spectrum, and pseudo-metal-oxide-semiconductor-field-effect-transistor techniques.
13. 1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy
14. Effect of passivation annealing on the electromigration properties of hybrid bonding stack
15. ITAC: A complete 3D integration test platform
16. Development of fine pitch interconnections for 3D integrated circuits
17. Through Silicon Via technology using tungsten metallization
18. Effects of stress in polysilicon VIA - first TSV technology
19. Electron magnetoresistance mobility in silicon on insulator layers using Kelvin's technique
20. Correlation of Pseudo-MOS transistor and Hall effect measurements in thin SOI wafers
21. Possible Influence of the Schottky Contacts on the Characteristics of Ultrathin SOI Pseudo-MOS Transistors
22. Detailed Investigation of Geometrical Factor for Pseudo-MOS Transistor Technique
23. Characterization of multiple Si∕SiO2 interfaces in silicon-on-insulator materials via second-harmonic generation
24. Effects of stress in polysilicon VIA - first TSV technology.
25. Alternative dielectrics for advanced SOI MOSFETs: thermal properties and short channel effects.
26. Characterization of multiple Si/SiO2 interfaces in silicon-on-insulator materials via second-harmonic generation.
27. Detailed investigation of geometrical factor for pseudo-MOS transistor technique
28. Alternative dielectrics for advanced SOI MOSFETs: thermal properties and short channel effects
29. Electrical characterization of ultra-thin SOI films: comparison of the pseudo-MOSFET and Hg-FET techniques.
30. Detailed investigation of geometrical factor for pseudo-MOS transistor technique.
31. Emerging floating-body effects in advanced partially-depleted SOI devices.
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