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Your search keyword '"Bouldin, Donald W."' showing total 12 results
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12 results on '"Bouldin, Donald W."'

1. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Author

Dehkordi, Peyman H. and Bouldin, Donald W.

Subjects
Circuit Design, Chip Packaging, New Technique, Research and Development, Packaging Density, Multichip Module, Integrated circuit fabrication, Very-large-scale integration, Hybrid integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Very-large-scale integration -- Innovations
Published
1993

3. On special-purpose hardware clusters for high-performance computational grids

Author

Abu-Khzam, Faisal N., Lehrter, Jeanne M., Bouldin, Donald W., Langston, Micheal A., Peterson, Gregory D., Abu-Khzam, Faisal N., Lehrter, Jeanne M., Bouldin, Donald W., Langston, Micheal A., and Peterson, Gregory D.

Abstract

Lehrter, J. M., Abu-Khzam, F. N., Bouldin, D. W., Langston, M. A., & Peterson, G. D. (2002, November). On Special-purpose Hardware Clusters for High-performance Computational Grids. In IASTED PDCS (pp. 1-5).

Published
2017

5. Design for Packageability; Early Consideration of Packaging from a Microelectronic System Designer's Viewpoint

Author

TENNESSEE UNIV KNOXVILLE, Bouldin, Donald W., TENNESSEE UNIV KNOXVILLE, and Bouldin, Donald W.

Abstract

The goal of this project was to assist in globally optimizing the design of higher performing microelectronic systems by incorporating critical packaging factors into the IC design flow. More specifically, our work was intended to empower system designers, especially designers of multi-million transistor ICs, to obtain optimized MCM-based systems.

Published
1998

6. Medical telesensors

Author

Ferrell, Trinidad L., primary, Crilly, P. B., additional, Smith, S. F., additional, Wintenberg, Alan L., additional, Britton, Jr., Charles L., additional, Morrison, Gilbert W., additional, Ericson, M. N., additional, Hedden, D., additional, Bouldin, Donald W., additional, Passian, A., additional, Downey, Todd R., additional, Wig, A. G., additional, and Meriaudeau, Fabrice, additional

Published
1998
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9. AN OVERVIEW OF PLACEMENT AND ROUTING ALGORITHMS FOR MULTI-CHIP MODULES.

Author

CHATTOPADHYAY, SUBHOMOY, BOULDIN, DONALD W., and DEHKORDI, PEYMAN H.

Abstract

Multi-chip modules are now required to achieve higher system speed and greater density than the traditional single chip packages mounted on printed circuit boards. Algorithms for placement of bare dies and and routing of their interconnections on MCM substrates are reviewed in this paper. Comparisons are given to point out the strengths and weaknesses of each approach. This information can assist researchers in identifying those areas which need improvement and application designers in selecting the most appropriate algorithm for a specific application. [ABSTRACT FROM AUTHOR]

Published
1995
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