26 results on '"Bonhoff, Tobias"'
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2. Principles and applications of trans-wafer processing using a 2-μm thulium fiber laser
3. 4XX nm diode-laser beyond 2 kW of output power
4. Multiphysikalische Simulation und Kompensation thermooptischer Effekte in Optiken für Laseranwendungen
5. Multiphysikalische Simulation und Kompensation thermooptischer Effekte in Optiken für Laseranwendungen; 1. Auflage
6. Femtosecond Laser Post-Processing of Metal Parts Produced by Laser Additive Manufacturing
7. Multi-physical modeling of thermal and dispersive effects in optical systems for high power ultra-short laser pulses
8. Multi-physical modeling of thermal and dispersive effects in optical systems for high power ultra-short laser pulses.
9. Theoretical and experimental analysis of scan angle-depending pulse front tilt in optical systems for laser scanners
10. Principles and applications of trans-wafer processing using a 2-μm thulium fiber laser
11. Modeling of optical aberrations due to thermal deformation using finite element analysis and ray-tracing
12. Utilizing the transparency of semiconductors via "backside" machining with a nanosecond 2 μm Tm:fiber laser
13. Post-processing of 3D-printed parts using femtosecond and picosecond laser radiation
14. Studying the effect of zeolite inclusion in aluminum alloy on measurement of its surface hardness using laser-induced breakdown spectroscopy technique
15. Femtosecond laser post-processing of metal parts produced by laser additive manufacturing
16. Deformation of ultra-short laser pulses by optical systems for laser scanners
17. Silicon backside machining using a nanosecond 2-μm Tm:fiber laser
18. Backside Surface Machining of Silicon Wafers Using a Nanosecond Tm:fiber MOPA System
19. Ultrafast laser-based post-processing of parts produced by additive manufacturing
20. Trans-wafer processing of semiconductors with nanosecond mid-IR laser radiation
21. Studying the effect of zeolite inclusion in aluminum alloy on measurement of its surface hardness using laser-induced breakdown spectroscopy technique.
22. Modeling of optical aberrations due to thermal deformation using finite element analysis and ray-tracing
23. Post-processing of 3D-printed parts using femtosecond and picosecond laser radiation
24. Utilizing the transparency of semiconductors via "backside" machining with a nanosecond 2 μm Tm:fiber laser
25. Multi-physical modeling of thermal and dispersive effects in optical systems for high power ultra-short laser pulses
26. Silicon backside machining using a nanosecond 2-μm Tm:fiber laser
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