1. Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing
- Author
-
Hafez, W., primary, Agnihotri, P., additional, Asoro, M., additional, Aykol, M., additional, Bains, B., additional, Bambery, R., additional, Bapna, M., additional, Barik, A., additional, Chatterjee, A., additional, Chiu, P.C., additional, Chu, T., additional, Firby, C., additional, Fischer, K., additional, Fradkin, M., additional, Greve, H., additional, Gupta, A., additional, Haralson, E., additional, Haran, M., additional, Hicks, J., additional, Illa, A., additional, Jang, M., additional, Klopcic, S., additional, Kobrinsky, M., additional, Kuns, B., additional, Lai, H.-h., additional, Lanni, G., additional, Lee, S.-H., additional, Lindert, N., additional, Lo, C.-l., additional, Luo, Y., additional, Malyavanatham, G., additional, Marinkovic, B., additional, Maymon, Y., additional, Nabors, M., additional, Neirynck, J., additional, Packan, P., additional, Paliwal, A., additional, Pantisano, L., additional, Paulson, L., additional, Penmatsa, P., additional, Prasad, C., additional, Puls, C., additional, Rahman, T., additional, Ramaswamy, R., additional, Samant, S., additional, Sell, B., additional, Sethi, K., additional, Shah, F., additional, Shamanna, M., additional, Shang, K., additional, Li, Q., additional, Sibakoti, M., additional, Stoeger, J., additional, Strutt, N., additional, Thirugnanasambandam, R., additional, Tsai, C., additional, Wang, X., additional, Wang, A., additional, Wu, S.-j., additional, Xu, Q., additional, Zhong, X.-h., additional, and Natarajan, S., additional
- Published
- 2023
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