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14. Corrigendum to “A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups” [Microporous Mesoporous Mater. 306 (2020) 110434]

20. A theoretical and experimental study of atomic-layer-deposited films onto porous dielectric substrates

23. Oxidation and roughening of silicon during annealing in a rapid thermal processing chamber

26. Effect of the C-bridge on UV properties of organosilicate films

31. Magnetic field-induced dissipation-free state in superconducting nanostructures

33. The mechanism of low-k SiOCH film modification by oxygen atoms

34. Improving mechanical robustness of ultralow-k SiOCH plasma enhanced chemical vapor deposition glasses by controlled porogen decomposition prior to UV-hardening

35. Low dielectric constant materials for microelectronics

37. Toward successful integration of gap-filling ultralow-k dielectrics

38. Laser anneal of oxycarbosilane low-k film

42. HF etching mechanisms of advanced low-k films

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