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1. Prediction and Optimization of Residual Stress After Reflow Soldering of BGA Solder Joints Based on Multi-fidelity Surrogate Model

2. Multiple blood gas variables predict AKI survival in an independent manner

6. Characterization of MEMS Inertial Measurement Unit Package with Digital Image Correlation

7. Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions.

9. BGA Solder Ball Attaching Process Using Surface Tension of Liquid Solder

13. Automated X-ray Defect Inspection on Occluded BGA Balls Using Hybrid Algorithm.

15. Numerical Investigation of the Evolving Inelastic Deformation Path of a Solder Ball Joint under Various Loading Conditions

17. Optimization of Deep Reservoir Computing with Binary Genetic Algorithm for Multi-Time Horizon Forecasting of Power Consumption.

18. Systematic Verification of BGA Solder Joint Reliability in Multiple Ways

21. Class I Creep Deformation of Sn-Ag-Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints.

22. STUDIES ON THE EFFECT OF VARIOUS LEVELS OF NITROGENOUS FERTILIZER ALONG WITH SOME NITROGEN FIXING BLUE GREEN ALGAE ON SOME YIELD ATTRIBUTES OF RICE VARIETIES CV. PUSA 1509 AND PUSA SHARBATI.

23. Design and Realization of a W-Band Antenna in Package (AiP) Array Based on Silicon and Quartz.

24. 高集成小型化中频滤波组件设计与实现.

25. Effect of Plant Growth-Promoting Rhizobacteria and Cyanobacteria on Physico-chemical and cooking characteristics of Giza 179 rice grains.

26. Prediction of Solder Joint Reliability with Applied Acrylic Conformal Coating.

27. Effect of irrigation and nitrogen management on yield and economics of SRI-grown hybrid rice (Oryza sativa)

32. Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration.

33. Bayesian calibration of ball grid array lifetime models for solder fatigue.

35. Adaptive surface distortions for torque ripple control in vertical-axis wind turbines.

37. Detection of BGA solder defects from X-ray images using deep neural network.

38. Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature.

41. Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA Joints.

42. Effect of Surface Finish on the Shear Properties of SnAgCu-Based Solder Alloys.

43. 基于BGA 互联的毫米波模块三维集成设计.

44. Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.

45. Off-target phenotypes in forensic DNA phenotyping and biogeographic ancestry inference: A resource.

46. Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature.

47. Design of multiprobe devices for electronic components with ball leads testing.

48. Thermo-Fluidic Characterizations of Multi-Port Compact Thermal Model of Ball-Grid-Array Electronic Package

49. Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

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