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1. Laser Processing For 3D Junctionless Transistor Fabrication

7. A Selection of SOI Puzzles and Tentative Answers

9. Impact of local back biasing on performance in hybrid FDSOI/bulk high-k/metal gate low power (LP) technology

10. Parasitic bipolar impact in 32 nm undoped channel Ultra-Thin BOX (UTBOX) and biased Ground Plane FDSOI high-k/metal gate technology

11. Thin-film devices for low power applications

14. Impact of a 10 nm ultra-thin BOX (UTBOX) and ground plane on FDSOI devices for 32 nm node and below

15. A comparison of advanced transport models for the computation of the drain current in nanoscale nMOSFETs

16. FDSOI devices with thin BOX and ground plane integration for 32 nm node and below

25. Emerging silicon-on-nothing (SON) devices technology

34. Services rendus et contribution de l’élevage au développement du territoire Auvergne - Rhône-Alpes

35. Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

36. Integration of Low Temperature 480℃ SiOCN as Offset Spacer in view of 3D Sequential Integration

42. Efficiency of mechanical stressors in Planar FDSOI n and p MOSFETs down to 14nm gate length

50. 25nm Short and narrow strained FDSOI with TiN/HfO2 gate stack

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