12 results on '"Ayyagari-Sangamalli, Buvna"'
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2. Development of Copper Thermal Coefficient For Low Temperature Hybrid Bonding
3. Material Innovation Through Atomistic Modelling for Hybrid Bonding Technology
4. MOL Local Interconnect Innovation: Materials, Process & Systems Co-optimization for 3nm Node and Beyond
5. Optimization of 2.5D Organic Interposer Channel for Die and Chiplets
6. A Holistic Development Framework for Hybrid Bonding
7. A Fully Integrated System‐on‐Chip Design with Scalable Resistive Random‐Access Memory Tile Design for Analog in‐Memory Computing
8. Materials to Systems Co-Optimization Platform for Rapid Technology Development Targeting Future Generation CMOS Nodes
9. Nanosheet Width Investigation for Gate-All-Around Devices Targeting SRAM Application
10. Self-Aligned Single Diffusion Break Technology Optimization Through Material Engineering for Advanced CMOS Nodes
11. Complementary FET Device and Circuit Level Evaluation Using Fin-Based and Sheet-Based Configurations Targeting 3nm Node and Beyond
12. Modeling and Optimization of Advanced 3D NAND Memory
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