179 results on '"Avenas, Yvan"'
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2. Field Plate Integration for Mitigating Partial Discharge Activity in PCB-Embedded Power Electronic Modules
3. Impact of the Printed Circuit Board Geometrical Design on the AC Breakdown and Partial Discharge Activity in Air
4. An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm
5. Porous Copper Layer Development by Dynamic Hydrogen Bubble Template for Power Modules Assembling by Thermocompression
6. Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters
7. Design of Power Modules Using Containers Filled With Phase Change Materials as Device Top Interconnection for Power Peak Management
8. Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter
9. Parameters affecting forced convection enhancement in ferrofluid cooling systems
10. Méthode non intrusive de mesure de température de puce pour le refroidissement diphasique par immersion de composant semiconducteurs de puissance
11. Power Module Using Ceramic Heat Sink and Multilayers Silver Sintering
12. Modeling of power devices with drift region integrated microchannel cooler
13. Design of an Integrated Power Module for Silicon Carbide MOSFET with Self-Compensation of the Magnetic Field
14. Effect of Large Amplitude Thermal Cycles on Power Assemblies Based on Ceramic Heat Sink and Multilayer Pressureless Silver Sintering
15. Design of an Integrated Power Module for Silicon Carbide MOSFET with Self-Compensation of the Magnetic Field
16. TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges
17. A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration
18. Design of a porous electroosmotic pump used in power electronic cooling
19. DBC technology for extremely thin flat heat pipes
20. Advanced Packaging Concepts for Wide Bandgap PowerElectronics
21. Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks
22. Generic thermal cooling design for multicell converters
23. Implementation and validation of a dynamic calorimetric method to evaluate the losses in switching discrete power MOSFETs
24. Full 3D advanced packaging concepts for Wide Bandgap Power Electronics
25. Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging
26. Online capacitor early ageing monitoring and detection using a dynamic reference model
27. Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors
28. Design by Optimization of multiphase inverter for electric vehicle drive
29. Implementation of TAPIR Switching Cells with Integrated Direct Air-Cooling for SiC Power Devices
30. Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems
31. Discrete Power Semiconductor Losses Versus Junction Temperature Estimation Based on Thermal Impedance Curves
32. A Method for Accelerated Aging Tests of Power Modules for Photovoltaic Inverters Considering the Inverter Mission Profiles
33. Reciprocal and Self-Aging Effects of Power Components on Reliability of DC–DC Boost Converter With Coupled and Decoupled Thermal Structures
34. Power semiconductor ageing test bench dedicated tophotovoltaic applications
35. Estimation des pertes dans les composants semi-conducteurs de puissance par méthode calorimétrique dynamique
36. In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters
37. An Analytical Model for the Optimisation of Metal Foam for Power Electronics Cooling
38. Teaching how to characterize and implement high speed power devices for tomorrow's engineers
39. Power Semiconductor Ageing Test Bench Dedicated to Photovoltaic Applications
40. Influence of Power Modules on the Thermal Design of Laminated Busbars
41. CFD simulation of heat transfer and fluid flow within metallic foam in forced convection environment
42. Instrumented Chip Dedicated to Semiconductor Temperature Measurements in Power ElectronicConverters
43. Power semiconductor ageing test bench dedicated to photovoltaic applications
44. Modèle analytique d'estimation des pertes dans une cellule de commutation MOSFET-diode Schottky SiC en vue de la conception et de l'optimisation d'un dissipateur thermique
45. Optimisation Globale d'une Cellule de Commutation SiC : Dimensionnement CEM et Thermique
46. Estimation des contraintes électrothermiques sur les composants semi-conducteurs dans les onduleurs photovoltaïques
47. Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (VCE_VGE) Method with Series Resistance Removal
48. A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles
49. Évaluation de la température des composants actifs de puissance
50. Realization and characterization of instrumented power diode with aluminum RTD sensor – application to thermal impedance evaluation
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