1. Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications
- Author
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Kemal Furkan Sokmen, Emrah Yürüklü, Nurettin Yamankaradeniz, Uludağ Üniversitesi/Teknik Bilimler Meslek Yüksekokulu/İklimlendirme ve Soğutma Programı., Yamankaradeniz, Nurettin, and AAA-1753-2021
- Subjects
Printed circuit boards ,Headlights ,Engineering ,Electric losses ,Mechanical engineering ,02 engineering and technology ,Computational fluid dynamics ,Annular fin ,Industrial and Manufacturing Engineering ,Fin (extended surface) ,Printed circuit board ,Heat transfer ,0202 electrical engineering, electronic engineering, information engineering ,Automotive LED lighting systems ,Thermal analysis ,Temperature limits ,Temperature ,Fins (heat exchange) ,021001 nanoscience & nanotechnology ,Energy & fuels ,Light emitting diodes ,Forced convection ,Computational fluid dynamics (CFD) ,Printed circuits ,Thermodynamics ,Junction temperature ,Low ambient temperatures ,High heat transfers ,0210 nano-technology ,Junction temperatures ,Cooling applications ,020209 energy ,Engineering, mechanical ,Energy Engineering and Power Technology ,Heat transfer coefficient ,Heat sink ,Mechanics ,Heat transfer coefficients ,Structural optimization ,Heat sinks ,Power Semiconductor Diodes ,Heat Sinks ,Hot Temperature ,Temperature increase ,LED lighting system ,Application programs ,business.industry ,Thermoanalysis ,Laminar natural convection ,business ,Copper ,Aluminum - Abstract
In this study, the effects of fin design, fin material, and free and forced convection on junction temperature in automotive headlamp cooling applications of LED lights are researched by using ANSYS CFX 14 software. Furthermore a new methodology is presented for defining the optimum cylindrical fin structure within the given limits. For measuring the performance of methodology, analyses are carried out for various ambient temperatures (25 degrees C, 50 degrees C and 80 degrees C) and different LED power dissipations (0.5 W, 0.75 W, 1 W and 1.25 W). Then, analyses are repeated at different heat transfer coefficients and different fin materials in order to calculate LED junction temperature in order to see if the fin structure proposed by the methodology is appropriate for staying below the given safety temperature limit. As a result, the suggested method has always proposed proper fin structures with optimum characteristics for given LED designs. As another result, for safe junction temperature ranges, it is seen that for all LED power dissipations, adding aluminum or copper plate behind the printed circuit board at low ambient temperatures is sufficient. Also, as the ambient temperature increases, especially in high powered LED lights, addition of aluminum is not sufficient and fin usage becomes essential. High heat transfer coefficient and using copper fin affect the junction temperature positively. Magneti Marelli SpA
- Published
- 2016
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