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Low-power embedded system design has become extremely important in the most recent years. To fulfill system-level design requirements and time-to-market constraints, a power-driven methodology is essential during embedded system design. The aim of this paper is to introduce accurate and efficient power metrics included in a hardware/software (HW/SW) co-design environment to show the system-level partitioning and design. In order to verify the design effectiveness of hardware/software co-design synthesis, we consider the digital power dissipation methodology and its power reduction techniques. To maximize the performance of system, we developed hierarchical design technique and co-design synthesis for power efficient HW/SW co-design process. In the end, we provided simulation results for single circuit with new design vs. circuit integration with hierarchical power efficiency system (HPES), multiple circuits with new design vs. circuit integration with HPES, new design and no load vs. circuit integration with HPES, new design with load vs. circuit integration with HPES.

This paper raises the issue of why test engineers often do not act in ways which test economics says are optimal. The new field of behavioral economics explains why people often do not act in their economic self interest, and the authors propose that some of the same principles, applied to testing, can explain some of the behavior of test engineers. The authors use several examples to illustrate these principles, and for each describe the underlying economic and behavioral economic principles behind them, and give recommendations for decision makers

The test of chip has become an important issue as its complexity has been dramatically increased. Currently, system-on-chip (SoC) is major product that can be used for many applications. Since the SoC is a chip designed by VLSI design techniques, its methodologies of design and test are similar to conventional chip manufacturing aspects. However, the complexity, developing procedures, and many other things are different from the case of the conventional chips. Thus, new test approach is needed for complex SoC. The proposed economics model for SoC helps the chip developers predict total cost of SoC development at the early design stage, and decide the strategy to test by cost- effective way.

This paper proposes a manufacturing test cost model for systems as they go through a manufacturing test process. The cost model allows the company to calibrate the test process to the risks of the product, while taking into account other manufacturing and development processes. Without an accurate cost model, understanding the financial implications of test tradeoffs is impossible.

The implementation of test improvements can have a significant impact on product lifecycle costs. However, the time lag in accruing potential benefits can be problematic when attempting to justify the required investment. This can be overcome if a phased implementation is adopted where each interim level of investment delivers less substantial but more immediate gains. This chapter demonstrates that techniques previously used to investigate cost-saving opportunities at strategic and lifecycle level can be used within a system manufacturing process to achieve tangible short-term benefits. The failure profile of a system level test process is characterized and used to drive defect elimination and optimum test times. Various “stopping criteria”, product-process comparisons and improvements are discussed.