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19 results on '"Ani, Fakhrozi Che"'

3. Effect of Potting Encapsulation on Crack Formation and Propagation in Electronic Package

Author

Jalar, Azman, Zain, Syed Mohamad Mardzukey Syed Mohamed, Ani, Fakhrozi Che, Ramli, Mohamad Riduwan, Bakar, Maria Abu, Kacprzyk, Janusz, Series Editor, Pal, Nikhil R., Advisory Editor, Bello Perez, Rafael, Advisory Editor, Corchado, Emilio S., Advisory Editor, Hagras, Hani, Advisory Editor, Kóczy, László T., Advisory Editor, Kreinovich, Vladik, Advisory Editor, Lin, Chin-Teng, Advisory Editor, Lu, Jie, Advisory Editor, Melin, Patricia, Advisory Editor, Nedjah, Nadia, Advisory Editor, Nguyen, Ngoc Thanh, Advisory Editor, Wang, Jun, Advisory Editor, Mat Jizat, Jessnor Arif, editor, Khairuddin, Ismail Mohd, editor, Mohd Razman, Mohd Azraai, editor, Ab. Nasir, Ahmad Fakhri, editor, Abdul Karim, Mohamad Shaiful, editor, Jaafar, Abdul Aziz, editor, Hong, Lim Wei, editor, Abdul Majeed, Anwar P. P., editor, Liu, Pengcheng, editor, Myung, Hyun, editor, Choi, Han-Lim, editor, and Susto, Gian-Antonio, editor

Published
2021
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4. Effect of Moisture Content on Crack Formation During Reflow Soldering of Ball Grid Array (BGA) Component

Author

Zain, Syed Mohamad Mardzukey Syed Mohamed, Ani, Fakhrozi Che, Ramli, Mohamad Riduwan, Jalar, Azman, Bakar, Maria Abu, Kacprzyk, Janusz, Series Editor, Pal, Nikhil R., Advisory Editor, Bello Perez, Rafael, Advisory Editor, Corchado, Emilio S., Advisory Editor, Hagras, Hani, Advisory Editor, Kóczy, László T., Advisory Editor, Kreinovich, Vladik, Advisory Editor, Lin, Chin-Teng, Advisory Editor, Lu, Jie, Advisory Editor, Melin, Patricia, Advisory Editor, Nedjah, Nadia, Advisory Editor, Nguyen, Ngoc Thanh, Advisory Editor, Wang, Jun, Advisory Editor, Mat Jizat, Jessnor Arif, editor, Khairuddin, Ismail Mohd, editor, Mohd Razman, Mohd Azraai, editor, Ab. Nasir, Ahmad Fakhri, editor, Abdul Karim, Mohamad Shaiful, editor, Jaafar, Abdul Aziz, editor, Hong, Lim Wei, editor, Abdul Majeed, Anwar P. P., editor, Liu, Pengcheng, editor, Myung, Hyun, editor, Choi, Han-Lim, editor, and Susto, Gian-Antonio, editor

Published
2021
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7. Validation of experimental analysis of the PC thermoformed product using finite element methods.

Author

Zulfiqar, Sana, Saad, Abdullah Aziz, Sharif, Mohamad Fikri Mohd, Samsudin, Zambri, Ali, Mohd Yusuf Tura, Ani, Fakhrozi Che, Ahmad, Zulkifli, and Abdullah, Muhammad Khalil

Subjects
FINITE element method, AUTOMOBILE lighting, PRINTED circuits, NUMERICAL control of machine tools, DEFORMATION of surfaces
Abstract

Thermoforming process has now become the most suitable and conventional method for manufacturing 3D circuits with complex geometries. The mold of commercially available automobile lighting LED is developed using CNC machine. The stretchable circuit is printed on a thermoplastic substrate through screen printing technique before undergoing thermoforming process. The factors that affect a thermoformed product are the stretch level and thickness reductions of the substrate. This paper aims to study the effect of the variation in dimensions of the thermoformed product without the printed stretchable circuit on the substrate. Finite element methods (FEM) analysis is also carried out in order to visualize the behavior of the substrate in terms of area stretch ratios (ASR) and thickness reductions of different wall surfaces after deformation according to the geometry of the mold. The ASR and thickness values obtained by experiment and simulation are compared. As a result, the simulated values are bit higher than the experimental ones but they are acceptable, therefore, the behavior of thermoforming product like large stretch areas and less thickness, can be determined prior to the actual thermoforming process of the product with printed stretchable circuit. [ABSTRACT FROM AUTHOR]

Published
2023
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12. Horizontal Crack Induced Vertical Crack Formation in Epoxy Mold Compound for Electronic Packaging.

Author

Mardzukey Syed Mohamed Zain, Syed Mohamad, Jalar, Azman, Bakar, Maria Abu, Ani, Fakhrozi Che, and Ramli, Mohamad Riduwan

Subjects
EPOXY resins, TEMPERATURE, MOISTURE, THERMAL expansion, EXPANSION of gases
Abstract

Copyright of Informacije MIDEM: Journal of Microelectronics, Electronic Components & Materials is the property of MIDEM Society and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Published
2021
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18. LIFE CYCLE ASSESSMENT OF TOXICITY POTENTIAL OF METALLIC ELEMENTS AND PROCESS STAGES IN ELECTRONICS: A CASE STUDY OF ELECTRONIC CONNECTOR LEADS.

Author

Chellvarajoo, Srivalli, Pogaku, Ravindra, Abdullah, Mohd Zulkfly, and Ani, Fakhrozi Che

Abstract

The electronic waste (e-waste) is increasingly flooding Asia, especially in developing countries. E-waste could precipitate a growing volume of toxic input to the local environment if it was not handled properly. This brings the evaluation of environmental impact from electronics an essentially important task for the life cycle assessment (LCA) and the end-of-life management of electronic products. This case study presented a quantitative investigation on the environmental impact analysis on electronics connector lead via LCA. A single connector lead can have a considerable toxicity to the environment as referred to hazardous metallic elements. LCA using SimaPro7 software showed that carcinogenic effect is the serious impact of electronic part on human health (57.33%). However, the metallic constituents in the electronic connector leads and its process stages indirectly become major contributor to the environmental impact. This suggests a major concern for the environmental impact of the total e-waste with such a large mass since most electronics are similar in composition, but the other electronic products and processes are much far and multiple times heavier than this small electronics part. LCA tool is good benchmarking to impact assessment even though several supporting tools complement each other to solve e-waste issue. [ABSTRACT FROM AUTHOR]

Published
2017
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