29 results on '"Anciant, R."'
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2. Suppression of the resonance of vacuum-sealed accelerometers: A comparison of two different strategies
3. Dynamic control of an accelerometer bandwidth through tunable damping factor and effective moment of inertia
4. Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture
5. Aluminum to Aluminum bonding at room temperature
6. Investigation of copper-tin transient liquid phase bonding reliability for 3D integration
7. Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack
8. ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY
9. Ultra low cost wafer level via filling and interconnection using conductive polymer
10. Process and RF modelling of TSV last approach for 3D RF interposer
11. Through Silicon Via technology using tungsten metallization
12. Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs
13. Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications
14. Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results
15. Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results
16. Dual-level inorganic write-once Blu-ray Disc
17. Simulation of Writing and Erasing Processes of GeSbTe and GeSbTeSn with GeN Interlayers in the Case of Dual-Level DVR Discs
18. Mid-process through silicon vias technology using tungsten metallization: Process optimazation and electrical results.
19. Via first approach optimisation for Through Silicon Via applications.
20. Multiphysics simulation of super-resolution BD ROM optical disk readout.
21. Dual-level inorganic write-once Blu-ray Disc.
22. Process and RF modelling of TSV last approach for 3D RF interposer.
23. Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3DICs.
24. Multiphysics Simulation of Super-Resolution BD ROM Optical Disk Readout.
25. Simulation of the writing and erasing processes of GeSbTe and GeSbTeSn with GeN interlayers in the case of dual level DVR discs.
26. Inorganic technology for optical data storage.
27. Advantage of pseudo-binary PhaseChange material against eutectic material for application in poor rapid cooling structure.
28. Simulation of the writing and erasing processes of GeSbTe and GeSbTeSn with GeN interlayers in the case of dual level DVR discs
29. Advantage of pseudo-binary PhaseChange material against eutectic material for application in poor rapid cooling structure
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