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Throughout much of the 20th century, Sn–Pb solder dominated electronics. However, environmental and health concerns have driven the adoption of lead-free alternatives. Since 2006, legislation such as the European Union's RoHS Directive has mandated lead-free solder in most electronic devices, prompting extensive research into high-performance substitutes. Lead-free solders offer advantages such as reduced environmental impact and improved reliability but replacing Sn–Pb presents challenges in areas like melting point and wetting ability. This transition is primarily motivated by a focus on protecting environmental and human health, while ensuring equal or even improved reliability. Research has explored lead-free solder's mechanical properties, microstructure, wettability, and reliability. However, there is a notable lack of studies on its long-term performance and lifetime influence. To address this gap, mathematical models are used to predict intermetallic bond evolution from process conditions, validated with experimental tests. This study contributes by extending these models to predict bond evolution under typical operating conditions of devices and comparing the predictions with actual intermetallic thickness values found through metallographic sections. [ABSTRACT FROM AUTHOR]