1. New device and method for measuring thermal conductivity of thin-films.
- Author
-
Subramanian CS, Amer T, UpChurch BT, Alderfer DW, Burkett C, and Sealey B
- Subjects
- Equipment Design, Equipment Failure Analysis, Reproducibility of Results, Sensitivity and Specificity, Thermography methods, Materials Testing instrumentation, Membranes, Artificial, Paint analysis, Thermal Conductivity, Thermography instrumentation
- Abstract
Thermal sensitive paints (TSPs) are used for global nonintrusive detection of boundary layer transition in flow over the surface of wind tunnel research models. Since the transition is a transient process, the TSP should have a fast response characteristic. A low paint thermal conductivity is required for fast response. A thin-film thermal conductivity meter (TFTCM) was designed and built to measure thermal conductivity of the TSPs, which are typically between 50 and 150 microm thick. In this paper, the design and operating features of the TFTCM are described. Measurement of the thermal conductivity with this TFTCM of three standard thin-film low conductivity specimens, Kapton, Teflon, and Borofloat glass, showed good agreement with the manufacturer quoted values, thus validating the instrument and the procedure. Consistently repeatable values for thermal conductivity (k=0.41 +/- 0.02 W/m K) were also obtained for the TSP specimen (TSB-B, 75 microm) tested.
- Published
- 2006
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