9 results on '"Akaiwa, Tetsuya"'
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2. The Trend to Low Temperature Solder (LTS) Assembly and the Development Strategy for Tin-Bismuth based High Reliability LTS solder
3. Investigation of the Effects of Surface Finish and Reflow Conditions on the Microstructure and Mechanical Properties of Sn-based Solders
4. Reducing Cracking in Solder Joint Interfacial Cu6Sn5 with Modified Reflow Profile
5. Influence of cooling conditions on the interfacial Cu6Sn5 intermetallic compound in Sn-37Pb/Cu solder joints during reflow
6. Inhibition of cracking in Cu6Sn5 intermetallic compounds at the interface of lead-free solder joint by controlling the reflow cooling conditions
7. Effect of the Strengthening Mechanism on the Response of a Solder Alloy to Strain Rate and Ageing
8. Effects of Bismuth in Sn-Cu Based Solder Alloys and Interconnects
9. Dissolution in service of the copper substrate of solder joints
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