29 results on '"Ahn, Chae Hyuck"'
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2. Robust Method of Fabricating Epitaxially Encapsulated MEMS Devices with Large Gaps
3. Phonon conduction in silicon nanobeams
4. Electrostatic tuning of temperature coefficient of frequency of anisotropic disk-shaped resonators
5. Fabrication of wide and deep cavities for silicon MEMS devices without wafer bonding
6. Environmentally robust differential resonant accelerometer in a wafer-scale encapsulation process
7. High-G (>20,000g) inertial shock survivability of epitaxially encapsulated silicon MEMS devices
8. Experimental Investigation Into Stiction Forces and Dynamic Mechanical Anti-Stiction Solutions in Ultra-Clean Encapsulated MEMS Devices
9. Stable Encapsulated Charge-Biased Resonators
10. Stochastic method for disk resonating gyroscope mode matching and quadrature nulling
11. Overcoming stiction forces with resonant over-travel stops
12. Erratum to “Temperature Dependence of the Elastic Constants of Doped Silicon” [Jun 15 730-741]
13. Characterization of Oxide-Coated Polysilicon Disk Resonator Gyroscope Within a Wafer-Scale Encapsulation Process
14. Investigation of a Vacuum Encapsulated Si-to-Si Contact Microswitch Operated From −60 °C to 400 °C
15. Multifunctional Integrated Sensors for Multiparameter Monitoring Applications
16. A unified epi-seal process for resonators and inertial sensors
17. Temperature Dependence of the Elastic Constants of Doped Silicon
18. Accurate Modeling of Quality Factor Behavior of Complex Silicon MEMS Resonators
19. Mode-Matching of Wineglass Mode Disk Resonator Gyroscope in (100) Single Crystal Silicon
20. In-situ ovenization of Lamé-mode silicon resonators for temperature compensation
21. Experimental investigation on mode coupling of bulk mode silicon MEMS resonators
22. A 7ppm, 6°/hr frequency-output MEMS gyroscope
23. Fabrication and Characterization of a Vacuum Encapsulated Curved Beam Switch for Harsh Environment Application
24. Characterization of stiction forces in ultra-clean encapsulated MEMS devices
25. Stable pull-in electrodes for narrow gap actuation
26. Stable charge-biased capacitive resonators with encapsulated switches
27. Stability of Silicon Microelectromechanical Systems Resonant Thermometers
28. Resonant pressure sensor with on-chip temperature and strain sensors for error correction
29. Stability measurements of silicon MEMS resonant thermometers
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