1. PCB 通孔高电流密度电镀铜用加速剂的研究.
- Author
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杨晶, 曾祥键, 陈春, 潘湛昌, and 胡光辉
- Subjects
COPPER ,THERMAL shock ,PRINTED circuits ,POLYETHYLENE glycol ,THERMAL resistance ,THIADIAZOLES - Abstract
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- Published
- 2023
- Full Text
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