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Electronic devices get smaller and smaller in every generation. In micro-/nano-electronic devices such as high electron mobility transistors, heat dissipation has become a crucial design consideration due to the ultrahigh heat flux that has a negative effect on devices' performance and their lifetime. Therefore, thermal transport performance enhancement is required to adapt to the device size reduction. β-Ga2O3 has recently gained significant scientific interest for future power devices because of its inherent material properties such as extremely wide bandgap, outstanding Baliga's figure of merit, large critical electric field, etc. This work aims to use a machine learning approach to search promising substrates or heat sinks for cooling β-Ga2O3, in terms of high interfacial thermal conductance (ITC), from large-scale potential structures taken from existing material databases. With the ITC dataset of 1633 various substrates for β-Ga2O3 calculated by full density functional theory, we trained our recently developed convolutional neural network (CNN) model that utilizes the fused orbital field matrix (OFM) and composition descriptors. Our model proved to be superior in performance to traditional machine learning algorithms such as random forest and gradient boosting. We then deployed the CNN model to predict the ITC of 32 716 structures in contact with β-Ga2O3. The CNN model predicted the top 20 cubic and noncubic substrates with ITC on the same level as density functional theory (DFT) results on β-Ga2O3/YN and β-Ga2O3/MgO interfaces, which has the highest ITC of 1224 and 1211 MW/m2K, respectively, among the DFT-ITC datasets. Phonon density of states, group velocity, and scattering effect on high heat flux transport and consequently increased ITC are also investigated. Moderate to high phonon density of states overlap, high group velocity, and low phonon scattering are required to achieve high ITC. We also found three Magpie descriptors with strong Pearson correlation with ITC, namely, mean atomic number, mean atomic weight, and mean ground state volume per atom. Calculations of such descriptors are computationally efficient, and therefore, these descriptors provide a new route for quickly screening potential substrates from large-scale material pools for high-performance interfacial thermal management of high-electron mobility transistor devices. [ABSTRACT FROM AUTHOR]

We propose a main mechanism of large valley splitting experimentally observed at the interface of buried oxide (BOX)/silicon-on-insulator (SOI) structures. Silicon metal-oxide-semiconductor field effect transistors fabricated on a SIMOX (001) substrate, which is a kind of the SOI substrate, that is annealed at high temperatures for a long time are known to exhibit large valley splitting, but the origin of this splitting has long been unknown. Extended zone effective-mass approximation predicts that strain significantly affects valley splitting. In this study, we analyzed valley splitting based on this theory and found that the shear strain along [110] of approximately 5% near the BOX interface is a promising source for large valley splitting. [ABSTRACT FROM AUTHOR]

The ultra-wide bandgap of gallium oxide provides a rich plethora of electrically active defects. Understanding and controlling such defects is of crucial importance in mature device processing. Deep-level transient spectroscopy is one of the most sensitive techniques for measuring electrically active defects in semiconductors and, hence, a key technique for progress toward gallium oxide-based components, including Schottky barrier diodes and field-effect transistors. However, deep-level transient spectroscopy does not provide chemical or configurational information about the defect signature and must, therefore, be combined with other experimental techniques or theoretical modeling to gain a deeper understanding of the defect physics. Here, we discuss the current status regarding the identification of electrically active defects in beta-phase gallium oxide, as observed by deep-level transient spectroscopy and supported by first-principles defect calculations based on the density functional theory. We also discuss the coordinated use of the experiment and theory as a powerful approach for studying electrically active defects and highlight some of the interesting but challenging issues related to the characterization and control of defects in this fascinating material. [ABSTRACT FROM AUTHOR]

This paper provides a comprehensive study of the impact of the gate recess depth (RD) on the GaN-on-Si MOS-HEMTs DC performances. IDS = f(VGS) and IDS = f(VDS) measurements are conducted at 25 and 150 °C, respectively, in forward and blocking modes. The gate recessed depth (50, 150, and 350 nm) is modulated by adjusting the plasma etching time, which is a critical step for improving the dielectric/GaN interface quality and the gate channel electron mobility. Three distinct regions can be defined separately: the bottom, the sidewall, and the corner region being the junction between the two previous regions. To assess the impact of gate recessed depth (RD) on the several mobilities around the gate cavity first, we applied our previous methodology allowing us to extract the bottom (μbot) and the entire sidewall region mobility (μT), without distinction from the corner. The mobility of the transverse region was found surprisingly to increase with deeper RD. To gain insight into the impact of the RD on this transverse section, a new extraction methodology is proposed to extract separately the gate corner (μcorner) and sidewall (μSW) mobility. These extractions show that the corner mobility is found to be reduced compared to the sidewall one (μcorner < μSW) evidencing the different weighting contributions over the transverse mobility. Moreover, these mobilities are found to be more degraded compared to the bottom one, highlighting the different contributions on the on-state resistance (RON). Indeed, the on-state resistance is lowered with the shallower RD due to the reduced sidewall resistance contribution (lower sidewall length) and despite the incremental contribution of the bottom resistance (larger effective gate length). However, the shallower RD shows an increase in the drain–source leakage current in reason of a lower gate electrostatic control. Technology Computer Aided Design (TCAD) simulations of the three RD morphologies are carried out to validate the experimental trends and the proposed methodology. [ABSTRACT FROM AUTHOR]

A novel bilateral impact-ionization-avalanche-transit-time (BIMPATT) diode based on AlGaN/GaN two-dimensional electron gas is proposed in this article. The BIMPATT is compatible with the available GaN high electron mobility transistor (HEMT) manufacturing process and has a shorter actual electron transit distance than existing HEMT-like IMPATT (HIMPATT) diodes. Compared with the same-sized HIMPATT, the optimum frequency of BIMPATT rises from 320 to 420 GHz and possesses a far wider operating frequency band, especially in the near 0.9 THz range. The maximum DC-RF conversion efficiency rises from 12.9% to 17.6%. The maximum RF power of BIMPATT is 3.18 W/mm, which is similar to 3.12 W/mm of the HIMPATT. Furthermore, our simulation demonstrated that the characteristics of BIMPATT are significantly affected by the length of anode and the thickness of the AlGaN barrier layer. The effects of ohmic contact resistance and background impurities on BIMPATT are also taken into account. This paper provides a reference for the design and characteristics enhancement of the lateral IMPATT devices. [ABSTRACT FROM AUTHOR]

We demonstrated the crystal growth of group-III arsenides (III-As) on GaN via an arsenidation layer and GaN-channel electron mobility transistors (HEMTs) with a regrowth InAs/GaAs source and drain (S/D) region. By annealing under an AsH3 atmosphere, the surface of a GaN (0001) template is arsenided. We grew ⟨ 111 ⟩ oriented InAs and GaAs on arsenided GaN. Silicon-doped n-type InAs with a carrier mobility of over 1500 cm2/V s and a carrier concentration of over 1 × 1019 cm−3 was successfully obtained. The fabrication process and direct-current characteristics of GaN-channel HEMTs with the regrown Si-doped InAs/GaAs S/D region were demonstrated for the first time. A maximum transconductance estimated from transfer characteristics was as high as ∼195 mS/mm for the HEMT with a gate length of 2 μm without passivation, which is comparable to those for the HEMT without any S/D regrowth. The impact of the InAs/GaAs S/D region on the on-resistance of the fabricated HEMTs was estimated to be ∼0.9 Ω mm, which can be reduced by optimizing the device structures and process conditions. These results indicate that the process of GaN arsenidation and III-As regrowth can be used without any device performance degradation. Therefore, further lowering the ohmic contact resistivity and on-resistance of GaN-channel HEMTs is possible by maturing the manufacturing-process technology of III-As-contained GaN-channel HEMTs. [ABSTRACT FROM AUTHOR]

This study investigates the sensitive region and safe operation voltage of single-event burnout (SEB) in lateral depletion-mode Ga2O3 MOSFET devices via technology computer aided design simulation. Based on the distribution of the electric field, carrier concentration, and electron current density when SEB occurs, the radiation damage mechanism of SEB is proposed. The mechanism of SEB in Ga2O3 MOSFET was revealed to be the result of a unique structure without a PN junction within it, which possesses gate control ability and exerts a significant influence on the conduction of the depletion region. [ABSTRACT FROM AUTHOR]

In this paper, the p-GaN gate AlGaN/GaN high electron mobility transistors (HEMTs) with varying combinations of gate metal work function and gate geometry are fabricated and investigate the influence of gate leakage current (IGS) on the threshold voltage (VTH) and subthreshold swing (SS). The unique dependence of VTH and SS on gate geometry for different metals is observed, which is different from traditional field-effect transistors. A novel hybrid physics model, consisting of the traditional capacitance divider model and hole injection model, is proposed to explain this phenomenon, and the results exhibit an excellent agreement with the experimental data. The holes traverse the gate/p-GaN Schottky barrier by thermal emission or tunneling and inject into the p-GaN layer, generating the IGS. Expanding upon the traditional capacitance divider model, a portion of the injected holes accumulate at the p-GaN/AlGaN interface and induce the corresponding electrons at the AlGaN/GaN heterojunction, which promotes channel conduction. Hence, the transfer curves display the correlation between IGS and VTH as well as SS. The results show that high IGS can alleviate the instability of VTH caused by the lithographic overlay error, and simultaneously optimize SS. This work offers a novel perspective for examining the turn-on mechanism of p-GaN HEMTs, thereby contributing to device design. [ABSTRACT FROM AUTHOR]

A comprehensive quantitative root cause study of defect evolution leading to memory window closure from a charge balance and charge trapping perspective throughout all phases of a Si channel Hf0.5Zr0.5O2 (HZO) ferroelectric field-effect-transistor (FEFET) is reported. Starting with the first write pulse, an excessive SiO2 interlayer field is revealed that triggers the creation of defect levels Dit in excess of 1015 cm−2 eV−1 at the HZO–SiO2 interface screening ferroelectric (FE) polarization while enabling FE switching. Under subsequent early bipolar fatigue cycling (up to 104 cycles), defect creation commences at the SiO2–Si interface due to the high injected hole fluence (0.39 C/m2) during each stress pulse causing negative bias instability (NBI), which shifts the threshold voltage of the erase state VT,ERS by −0.3 V with accrual of permanently captured charge Nit of up to +5 × 10−3 C/m2 (3 × 1012 cm−2). Subsequently, Nit NBI generation at the SiO2–Si interface accelerates reaching levels of +7 × 10−2 C/m2, locking both FEFET program and erase drain current vs gate–source-voltage (ID–VGS) characteristics in the FEFET on-state inducing memory window closure at 105 cycles while FE switching (switched polarization Psw = 0.34 C/m2) remains essentially intact. These findings guide the down-selection toward suitable semiconductor/FE systems for charge balanced, reliable, and high endurance FEFETs. [ABSTRACT FROM AUTHOR]

In this work, we demonstrate a hydrogen-terminated diamond (H-diamond) field-effect transistor (FET) with Al2O3/CeB6 gate materials. The CeB6 and Al2O3 films have been deposited by electron beam evaporation technique, sequentially. For the 4/8/12/15 μm gate length (LG) devices, the whole devices demonstrate distinct p-type normally off characteristics, and all the threshold voltage are negative; all the absolute values of leakage current density are 10−4 A/cm2 at a VGS of −11 V, exhibiting a relatively low leakage current density compared with CeB6 FETs, and this further demonstrates the feasibility of the introduction of Al2O3 to reduce the leakage current density; the maximum drain–source current density is −114.6, −96.0, −80.9, and −73.7 mA/mm, which may be benefited from the well-protected channel. For the 12 μm LG devices, the saturation carrier mobility is 593.6 cm2/V s, demonstrating a good channel transport characteristic. This work may provide a promising strategy for the application of normally off H-diamond FETs significantly. [ABSTRACT FROM AUTHOR]

The performance of SiC-based metal-oxide-semiconductor field-effect transistors (MOSFETs) degrades seriously after a period of continuous operation. To directly understand this issue, we conduct real-time time-dependent density functional theory (TDDFT) simulations on a series of nitrogen passivated SiC– SiO 2 interfaces to monitor the interaction between carriers and interface atoms. We find that the nitrogen passivation always leaves behind two local states near the VBM, which gives a chance to the strong interaction between channel carriers and C–N bonds, and finally results in the generation of C dangling bond defects. These processes are vividly presented and confirmed by the TDDFT simulation. Additionally, the results show that the new defects are more easily formed by the passivated C cluster than the passivated Si vacancy. These studies provide physical insights into the degradation mechanisms of working SiC MOSFETs, while simultaneously demonstrating the advantage of TDDFT as a crucial tool for investigating defect generation dynamics in semiconductor devices. [ABSTRACT FROM AUTHOR]

The rising temperature due to a self-heating or thermal environment not only degrades the subthreshold performance but also intensifies thermal stress, posing a severe challenge to device performance and reliability design. The thermal stress effects on the ON-state performance of the p-type fin field-effect transistor were previously studied. However, as far as we know, how thermal stress affects its subthreshold conduction remains unclear, which is studied in this manuscript. The impact of thermal stress due to the self-heating of adjacent devices on subthreshold conduction is investigated by solving the quantum transport, thermal conduction, and force balance equations for ballistic transport and dissipative transport with phonon scattering. Then, the thermal stress effects at different ambient temperatures are further discussed and analyzed. The simulation results show that the OFF-state leakage current can be reduced by thermal stress, even up to 9.28% for the (110)/[001] device operating at an ambient temperature of 550 K, and its reduction is the comprehensive result of the thermal stress effects on the band structure, potential profile, carrier distribution, and source-to-drain tunneling. In addition, the thermal stress has no significant effects on subthreshold swing although it can change the magnitude of the subthreshold current. Moreover, the effect of thermal stress on subthreshold conduction is highly dependent on the thermal environment of the device and the crystal orientation of the channel semiconductor material. [ABSTRACT FROM AUTHOR]

Molybdenum disulfide (MoS2), a semiconducting two-dimensional layered transition metal dichalcogenide (2D TMDC), with attractive properties enables the opening of a new electronics era beyond Si. However, the notoriously high contact resistance (RC) regardless of the electrode metal has been a major challenge in the practical applications of MoS2-based electronics. Moreover, it is difficult to lower RC because the conventional doping technique is unsuitable for MoS2 due to its ultrathin nature. Therefore, the metal–insulator–semiconductor (MIS) architecture has been proposed as a method to fabricate a reliable and stable contact with low RC. Herein, we introduce a strategy to fabricate MIS contact based on atomic layer deposition (ALD) to dramatically reduce the RC of single-layer MoS2 field effect transistors (FETs). We utilize ALD Al2O3 as an interlayer for the MIS contact of bottom-gated MoS2 FETs. Based on the Langmuir isotherm, the uniformity of ALD Al2O3 films on MoS2 can be increased by modulating the precursor injection pressures even at low temperatures of 150 °C. We discovered, for the first time, that film uniformity critically affects RC without altering the film thickness. Additionally, we can add functionality to the uniform interlayer by adopting isopropyl alcohol (IPA) as an oxidant. Tunneling resistance across the MIS contact is lowered by n-type doping of MoS2 induced by IPA as the oxidant in the ALD process. Through a highly uniform interlayer combined with strong doping, the contact resistance is improved by more than two orders of magnitude compared to that of other MoS2 FETs fabricated in this study. [ABSTRACT FROM AUTHOR]

Gallenene is a novel metallic 2D material that can provide a semiconducting counterpart if patterned into quasi-one-dimensional (quasi-1D) nanostructures, i.e., gallenene nanoribbons (GaNRs). We investigate semiconducting GaNRs as a potential channel material for future ultrascaled field-effect transistors (FETs) by employing quantum transport simulations based on Green's functions and tight-binding Hamiltonians with the orbital resolution calibrated on ab initio calculations. The impact of GaNR width downscaling from ∼6 nm down to ∼0.2 nm on the electronic, transport, and ballistic device properties is investigated for the FET channel length of 15 nm. We report current enhancement and injection velocity overshoot effects for sub-1.2 nm-wide nFETs and pFETs, with a maximum current increase of 53% in the 1.2 nm-wide GaNR pFET in comparison to the widest device. In addition, promising current-driving capabilities of n- and p-channel GaNR FETs are observed with top ballistic currents of more than 2.2 mA/μm and injection velocities of up to 2.4 × 107 cm/s. The reported data are explained by analyzing the evolution of band structure and related parameters such as injection velocity, quantum capacitance, effective transport mass etc., with increasing quantum confinement effects in ultranarrow GaNRs. Generally, we find that quasi-1D gallenene is a promising channel material for future nanoscale FETs, especially for transistor architectures based on stacked nanosheets. [ABSTRACT FROM AUTHOR]

Negative differential resistance (NDR) is observed in various emerging electronic devices. As compared to the conventional silicon-based field effect transistor (FET), the NDR is widely investigated in two-dimensional (2D) transition metal dichalcogenide (TMD) FETs. In this work, we study the NDR effect for the TMD-based metal-edge-contact MoS 2 double-gate FET with 10 nm channel length. The multiscale atomistic simulation is demonstrated for the lateral heterostructure of a metal–semiconductor–metal FET by density functional theory, maximally localized Wannier function tight-binding Hamiltonian, and non-equilibrium Green's function methods. The quantum transport model in the given lateral heterostructure resulted in NDR in a double-gate FET. Here, we focus on the NDR by the systematic study of the transmission spectrum of the metal-edge-contact MoS 2 channel FET and finally compare it with zero NDR ideal highly doped FET. The peak-to-valley ratio in the NDR response can be modulated with the change in the gate-to-source voltage and can be used to explore various future electronic applications. [ABSTRACT FROM AUTHOR]

This Perspective focuses on experimental and theoretical aspects of positron annihilation spectroscopy. This set of methods is highly suitable for identifying and quantifying vacancy-type defects in semiconductors and also allows for analyzing their physics characteristics. We present selected examples from the past decade, where the methods have been used for obtaining timely and useful insights into the defect-controlled phenomenon in narrow-gap (Ge, GaSb) and wide-gap (III-nitride, oxide) semiconductors. We also discuss possible future developments that may allow more detailed studies in novel semiconductor materials and devices with ever more complex lattice structures. [ABSTRACT FROM AUTHOR]

With the proportional reduction of metal–oxide–semiconductor field effect transistor (MOSFET) devices, the short channel effect, the parasitic effect, and the field strength effect are significantly enhanced, the proportion of parasitic resistance increases, and the non-intrinsic noise also increases, which seriously affects the working efficiency of the device. However, existing research mainly focuses on the intrinsic noise of MOSFET, and there is little research on the non-intrinsic noise; furthermore, the models describing the relationship between non-intrinsic noise, device structure, and bias have not yet been addressed. Therefore, in this paper, 90, 65, 32, 10, and 5 nm MOSFETs are studied. The rate of the intrinsic ballistic parameter is introduced to set up the source–drain current model and the non-intrinsic noise model. The source–drain current model is consistent with the theoretical model, numerical simulation, and experimental results in the literature. Finally, the relationship between the non-intrinsic noise and the bias and the device parameters are analyzed, and the conclusion is helpful to improve the working efficiency, lifetime, and response speed of nanoscale MOSFET devices. [ABSTRACT FROM AUTHOR]

The semiconductor/insulator blends for organic field-effect transistors are a potential solution to improve the charge transport in the active layer by inducing phase separation in the blends. However, the technique is less investigated for long-chain conducting polymers such as Poly[2,5-(2-octyldodecyl)-3,6-diketopyrrolopyrrole-alt-5,5-(2,5-di(thien-2-yl)thieno [3,2-b]thiophene)] (DPPDTT), and lateral phase separation is generally reported due to the instability during solvent evaporation, which results in degraded device performance. Herein, we report how to tailor the dominant mechanism of phase separation in such blends and the molecular assembly of the polymer. For DPPDTT/PMMA blends, we found that for higher DPPDTT concentrations (more than 75%) where the vertical phase separation mechanism is dominant, PMMA assisted in the self-assembly of DPPDTT to form nanowires and micro-transport channels on top of PMMA. The formation of nanowires yielded 13 times higher mobility as compared to pristine devices. For blend ratios with DPPDTT ≤ 50%, both the competing mechanisms, vertical and lateral phase separation, are taking place. It resulted in somewhat lower charge carrier mobilities. Hence, our results show that by systematic tuning of the blend ratio, PMMA can act as an excellent binding material in long-chain polymers such as DPPDTT and produce vertically stratified and aligned structures to ensure high mobility devices. [ABSTRACT FROM AUTHOR]

Gallium oxide (G a 2 O 3 ) is a promising ultra-wide bandgap material offering a large bandgap (> --> 4.7 eV) and high critical electric fields. The increasing demand for electronic devices for high-power applications in electric automobiles, high-performance computing, green energy technologies, etc., requires higher voltages and currents with enhanced efficiency. Vertical transistors, such as fin-shaped field-effect transistors (FinFETs) have emerged to meet the growing need with improved current handling capabilities, reduced resistance, and enhanced thermal performance. However, to fully exploit the Ga 2 O 3 power transistors, precise and reliable physics-driven models are crucial. Therefore, a comprehensive surface potential model has been developed in this work for a vertical Ga 2 O 3 FinFET. The electric potential across the channel is explained by analyzing the two-dimensional (2D) Poisson equation employing parabolic approximation. Such a surface potential model is instrumental in determining the performance of the Ga 2 O 3 FinFET as it affects the threshold voltage, the drain current, and fringing capacitance. Exploiting the surface potentials, a fringing capacitance model is derived which is crucial in analyzing the speed of the device in compact integrated circuits. In addition, statistical analysis of the Ga 2 O 3 FinFET using the Monte Carlo simulation technique is performed to determine the leakage current fluctuation due to doping variations. The validation of the analytical model with experimental results confirms the effectiveness and prospects of the developed models in the rapid development and characterization of next-generation high-performance vertical Ga 2 O 3 power transistors. [ABSTRACT FROM AUTHOR]

Current–voltage characteristics and low-frequency (LF) noise of industrial-quality AlGaAs/InGaAs/GaAs pseudomorphic high-electron-mobility transistors are evaluated as a function of bias stress and temperature. A small positive shift of threshold voltage Vth and negligible degradation in peak transconductance GM are observed under ON-state bias conditions at elevated temperatures. The Vth measurements suggest activation of an acceptor-like defect or impurity center. The GM measurements demonstrate that newly activated defects are not located close enough to the two-dimensional electron gas to scatter carriers strongly. First-principles calculations and comparisons with previous work suggest that OAs impurity centers, other oxygen-related defects, isolated AsGa antisites, and dopant-based DX centers may contribute significantly to low-frequency (LF) noise in as-processed devices. LF noise is relatively unaffected by voltage stress at elevated temperatures, consistent with the small changes in Vth and peak GM. [ABSTRACT FROM AUTHOR]

The recent progress in quantum computing and space exploration led to a surge in interest in cryogenic electronics. Superconducting devices such as Josephson junction, Josephson field effect transistor, cryotron, and superconducting quantum interference device (SQUID) are traditionally used to build cryogenic logic gates. However, due to the superconducting nature, gate-voltage-based control of these devices is extremely difficult. Even more challenging is to cascade the logic gates because most of these devices require current bias for their operation. Therefore, these devices are not as convenient as the semiconducting transistors to design logic gates. Here, to overcome these challenges, we propose a ferroelectric SQUID (FeSQUID) based voltage-controlled logic gates. FeSQUID exhibits two different critical current levels for two different voltage-switchable polarization states of the ferroelectric. We utilize the polarization-dependent (hence, voltage-controllable) superconducting to resistive switching of FeSQUID to design Boolean logic gates such as Copy, NOT, AND, and OR gates. The operations of these gates are verified using a Verilog-A-based compact model of FeSQUID. Finally, to demonstrate the fanning out capability of FeSQUID-based logic family, we simulate a two-input XOR gate using FeSQUID-based NOT, AND, and OR gates. Together with the ongoing progress on FeSQUID-based non-volatile memory, our designed FeSQUID-based logic family will enable all FeSQUID-based cryogenic computer, ensuring minimum mismatch between logic and memory blocks in terms of speed, power consumption, and fabrication process. [ABSTRACT FROM AUTHOR]

Thermal issue has been regarded as one of the bottlenecks for GaN high-electron-mobility transistor (HEMT) performance and reliability, which highlights the importance of accurate thermal modeling. In the present work, we propose a GP (Gaussian process)-resistor–capacitor compact thermal model integrated with the ensemble Kalman filter (EnKF) to handle the nonlinear problems attributed to the temperature-dependent properties of GaN HEMTs under large-signal working conditions. The GP predictor is employed for the nonlinear correction term, with strong ability and extendibility to characterize various temperature-dependent relations resulting from different design configurations and materials. The model is identified via the EnKFs by inputting a sequence of channel temperature oscillations induced by imposing a large-signal continuous wave heating source to the device. Furthermore, an adaptation mode is devised for the in situ and timely update of the model parameters to adapt to the thermal variability of GaN devices, avoiding storing a large amount of historical data and repeated offline regressions. The validation of our modeling scheme is conducted through the case study on GaN-on-SiC HEMT's detailed 3D finite element method simulations. [ABSTRACT FROM AUTHOR]

We have analyzed and modeled the reverse-biased gate leakage current in a Schottky-gate AlGaN/GaN high electron mobility transistor. While the Poole–Frenkel emission current along conductive threading dislocations dominates at low negative gate bias, the trap-assisted tunneling of thermally energized electrons and the thermal emission of electrons from threading dislocations aided by dislocation-related states at multiple energy levels within the AlGaN bandgap are dominant at moderate to large reverse bias. Additionally, deep trap levels of high density localized near the gate/AlGaN interface cause significant leakage at 473 K at low to moderate reverse bias, which could be specific to the device we have analyzed. We extracted about 10 12 cm − 2 traps near the AlGaN/GaN interface from the difference of the barrier layer electric field profile obtained from the experimental high-frequency capacitance–gate voltage and the one needed for final matching. The thermionic- and the thermionic field-emission currents are considerably low; the latter, however, dominates in the defect-free case. Finally, the simulation framework we developed here helped us identify various conduction mechanisms contributing to the reverse-biased gate leakage and the density and electronic structure of the responsible defects. [ABSTRACT FROM AUTHOR]

The delafossite semiconductor CuInO 2 has shown great potential in transparent electronics for its bipolar dopability. However, little is known about the limiting factors about its carrier mobility, which impedes its further development. Applying a b i n i t i o Boltzmann transport formalism, here we calculate the intrinsic, phonon-limited carrier mobility of CuInO 2 and study its carrier–phonon coupling mechanisms. The calculated room-temperature electron and hole mobilities along the in-plane direction are μ e = 97.6 cm 2 V − 1 s − 1 and μ h = 1.4 cm 2 V − 1 s − 1 , respectively. We find that the electron mobility is limited by the combination of acoustic phonons and polar longitudinal optical (LO) phonons, while the hole mobility is mainly limited by carrier–acoustic phonon scattering. We further show that the electron effective mass and bandgap of CuInO 2 can be tuned through strain engineering for improved carrier transport properties. Our work uncovers the underlying factors that govern the intrinsic carrier mobility of the transparent bipolar semiconductor CuInO 2 and sheds light on the design and exploration of bipolar conducting transparent conductive oxides (TCOs) based on delafossite semiconductors. [ABSTRACT FROM AUTHOR]

For over half a century, traditional silicon-based integrated circuits (ICs) have been the basis of computational electronics and are widely used in computers, cell phones, and other fields. With the rapid development of human society, silicon-based semiconductor technology is approaching its physical and engineering limits. Our increasing diversity of non-traditional computing needs, such as ultra-small, ultra-fast, ultra-low-power wearables, and space radiation protection, is driving the search for new electronic materials. Semiconducting single-walled carbon nanotubes (s-SWCNTs) have many excellent electrical properties, such as high carrier mobility and high ballistic transport, making them strong candidates for new semiconductor materials in the post-Moore era. Carbon-based electronic technology has been developed for over 20 years, and the fundamental issues such as the material purification of s-SWCNTs, preparation prospects of s-SWCNT-based field-effect transistors (CNT FETs), and device physics based on CNT FETs have been basically solved. However, the chiral diversity of s-SWCNTs may lead to problems such as fluctuations in the electrical performance of CNT FETs, limiting the application of s-SWCNTs in high-end ICs. Monochiral s-SWCNTs not only have excellent electrical properties but also have a controllable structure and uniformity, which are crucial for the high-end IC of CNTs. However, some problems exist in the purity and yield of monochiral s-SWCNT preparation and the optimization of monochiral CNT FETs. Therefore, the chiral sorting of CNTs is reviewed in this paper, and the progress of polymer reprocessing in chiral separation is highlighted. Then, the research progress of monochiral CNT FETs is introduced, and possible development directions are summarized and analyzed. Finally, the application prospects of chiral-enriched s-SWCNTs include challenges and future opportunities. [ABSTRACT FROM AUTHOR]

Strain plays an important role in the performance and reliability of AlGaN/GaN high electron mobility transistors (HEMTs). However, the impact of strain on the performance of proton irradiated GaN HEMTs is yet unknown. In this study, we investigated the effects of strain relaxation on the properties of proton irradiated AlGaN/GaN HEMTs. Controlled strain relief is achieved locally using the substrate micro-trench technique. The strain relieved devices experienced a relatively smaller increase of strain after 5 MeV proton irradiation at a fluence of 5 × 1014 cm−2 compared to the non-strain relieved devices, i.e., the pristine devices. After proton irradiation, both pristine and strain relieved devices demonstrate a reduction of drain saturation current (Ids,sat), maximum transconductance (Gm), carrier density (ns), and mobility (μn). Depending on the bias conditions the pristine devices exhibit up to 32% reduction of Ids,sat, 38% reduction of Gm, 15% reduction of ns, and 48% reduction of μn values. In contrast, the strain relieved devices show only up to 13% reduction of Ids,sat, 11% reduction of Gm, 9% reduction of ns, and 30% reduction of μn values. In addition, the locally strain relieved devices show smaller positive shift of threshold voltage compared to the pristine devices after proton irradiation. The less detrimental impact of proton irradiation on the transport properties of strain relieved devices could be attributed to reduced point defect density producing lower trap center densities, and evolution of lower operation related stresses due to lower initial residual strain. [ABSTRACT FROM AUTHOR]

The effects of tensile strain and contact transmissivity on the performance limits of monolayer molybdenum disulfide ( MoS 2) nanoscale n-channel MOSFETs are studied using a semi-classical Monte Carlo method. Density functional theory calculations were performed to parametrize the electronic band structure of MoS 2 subject to tensile and shear strain. Tensile strain decreases the bandgap, increases the inter-valley band-edge energy separation between the light-mass K-valleys and heavier-mass Q-valleys, and decreases the K-valley effective mass in a way that depends on the direction and the amount of the applied strain. Biaxial tensile strain and uniaxial tensile strain along the x- or y-directions are found to have the largest effect. In bulk materials, low-field phonon-limited electron mobility is enhanced, peak and saturation drift velocities are increased, and high-field negative differential resistance becomes more pronounced. Both 200 and 15 nm gate length MoS 2 MOSFETs with end-contacts with ideal (unity) and more realistic (significantly sub-unity) contact interface transmissivity were simulated. These MoS 2 devices exhibited substantial sensitivity to strain with ideal contact transmissivity, and more so for the 15 nm quasi-ballistic device scale than 200 nm long-channel devices. However, the results showed much less strain sensitivity for devices with more realistic contact transmissivities, which may be good or bad depending on whether strain-insensitive or strain-sensitive performance is desired for a particular application and may be possible to modify with improved contact geometries. [ABSTRACT FROM AUTHOR]

Al x Ga 1 − x N/GaN high-electron-mobility transistor (HEMT) structures are key components in electronic devices operating at gigahertz or higher frequencies. In order to optimize such HEMT structures, understanding their electronic response at high frequencies and room temperature is required. Here, we present a study of the room temperature free charge carrier properties of the two-dimensional electron gas (2DEG) in HEMT structures with varying Al content in the Al x Ga 1 − x N barrier layers between x = 0.07 and x = 0.42. We discuss and compare 2DEG sheet density, mobility, effective mass, sheet resistance, and scattering times, which are determined by theoretical calculations, contactless Hall effect, capacitance-voltage, Eddy current, and cavity-enhanced terahertz optical Hall effect (THz-OHE) measurements using a low-field permanent magnet (0.6 T). From our THz-OHE results, we observe that the measured mobility reduction from x = 0.13 to x = 0.42 is driven by the decrease in 2DEG scattering time, and not the change in effective mass. For x < 0.42 , the 2DEG effective mass is found to be larger than for electrons in bulk GaN, which in turn, contributes to a decrease in the principally achievable mobility. From our theoretical calculations, we find that values close to 0.3 m 0 can be explained by the combined effects of conduction band nonparabolicity, polarons, and hybridization of the electron wavefunction through penetration into the barrier layer. [ABSTRACT FROM AUTHOR]

Theoretical models have predicted that pH-responsive surface groups can reduce the sensitivity of field-effect transistor biosensors. However, attempts to prove this experimentally have shown conflicting results. In this work, a graphene field effect transistor (gFET) biosensor is used, which, without modification, is pH insensitive. The surface of the graphene is then functionalized using 1-hydroxypyrene to modulate the pH sensitivity of the gFET. A pH sensitivity ranging from 3.9 to 36.8 mV/pH was demonstrated. The biosensitivity of the gFETs was tested using streptavidin–biotin as a model system. The experimental results showed no correlation between biosensitivity and pH sensitivity. An electrochemical membrane model was used to determine the expected relationship between biosensitivity and pH sensitivity. The model results show that biosensitivity does not decrease until a certain threshold pH sensitivity is reached. This threshold is dependent on factors such as the acid dissociation constants of the surface hydroxyl groups and ion concentration. Furthermore, the differences between the simulation and experiment suggest that the effect of screening is greatly reduced when the analyte binds within a membrane. [ABSTRACT FROM AUTHOR]

The relocation of peripheral transistors from the front-end-of-line (FEOL) to the back-end-of-line (BEOL) in fabrication processes is of significant interest, as it allows for the introduction of novel functionality in the BEOL while providing additional die area in the FEOL. Oxide semiconductor-based transistors serve as attractive candidates for BEOL. Within these categories, In2O3 material is particularly notable; nonetheless, the excessive intrinsic carrier concentration poses a limitation on its broader applicability. Herein, the deposition of Hf-doped In2O3 (IHO) films via atomic layer deposition for the first time demonstrates an effective method for tuning the intrinsic carrier concentration, where the doping concentration plays a critical role in determine the properties of IHO films and all-oxide structure transistors with Au-free process. The all-oxide transistors with In2O3: HfO2 ratio of 10:1 exhibited optimal electrical properties, including high on-current with 249 µA, field-effect mobility of 13.4 cm2 V−1 s−1, and on/off ratio exceeding 106, and also achieved excellent stability under long time positive bias stress and negative bias stress. These findings suggest that this study not only introduces a straightforward and efficient approach to improve the properties of In2O3 material and transistors, but as well paves the way for development of all-oxide transistors and their integration into BEOL technology. [ABSTRACT FROM AUTHOR]

In this study, the ungated AlGaN/GaN devices with special mesa structures were designed. The hypothesis of effective width expansion was tested experimentally by using ungated samples with different sizes, and an empirical expression for calculating the conduction channel effective width was given according to the experimental results. Finally, split-gate AlGaN/GaN heterostructure field-effect transistors (HFETs) with different gate lengths were prepared, and the channel electron mobility of split-gate samples was calculated by using the empirical expression and polarization Coulomb field (PCF) scattering theoretical model. The results showed that, for split-gate AlGaN/GaN HFETs, with the increase in the gate length, the total amount of additional polarization charges underneath the gate increases, resulting in the enhancement of the PCF scattering intensity. [ABSTRACT FROM AUTHOR]

The plasma instability of two-dimensional electron gas (2DEG) is a crucial physical mechanism for generating terahertz radiation in field-effect transistors, especially in high electron mobility transistors (HEMTs). In this paper, we have proposed a new semi-analytical and semi-numerical method to deal with oscillation problems of any nonuniform 2DEG plasma, especially considering the steady-state distribution, which can be calculated and analyzed more quickly than only using numerical calculation. By constructing a wave equation, using the auxiliary function and Wentzel–Kramers–Brillouin approximation method, the wave vector of the plasma wave is obtained. On this basis, combined with the Dyakonov–Shur instability's boundary conditions, the oscillation frequency, the wave amplitude increment, and their correction caused by the nonuniformity can be obtained by numerical calculation. Furthermore, the analytical solution is obtained under reasonable approximate conditions for the linear distribution of electron concentration. It is proved that the electron concentration gradient in the channel will not only attenuate the wave increment but also decrease the plasmonic frequency in the case of linear distribution. Moreover, we get the reasons for the above conclusions through theoretical derivation. We also investigate the effects of various device parameters on attenuation, such as gate length, electron mobility, and voltage, which may explain the difference between the actual and theoretical values in HEMTs and provide new guidance for device design. [ABSTRACT FROM AUTHOR]

The formation of a two-dimensional electron gas (2DEG) at the GaN (0001)/AlN interface holds significant implications for GaN-based high-voltage and high-frequency (RF) devices. Due to the promising results provided by the addition of a thin layer of AlN in metal–oxide-semiconductor channel high-electron-mobility transistor devices, this interface can be found in both the access region and near the dielectric gate. Recent ab initio simulations shed light on the crucial role played by spontaneous and piezoelectric polarizations within polar GaN and AlN crystals in driving the formation of the 2DEG. This study explores the underlying mechanisms behind the 2DEG formation and investigates the impact of fixed charges and additional layers, like Al 2 O 3 , on the carrier concentration. Consistent with the literature, our findings highlight the predominant role of polarizations within III–V materials in the formation of the 2DEG. Moreover, we examine the influence of fixed charges on the AlN surface, revealing their ability to accumulate or deplete the 2DEG, while maintaining charge conservation through the emergence of a new two-dimensional charge gas on the AlN surface. Additionally, we explore the effects of incorporating a β -Al 2 O 3 crystal layer on the GaN/AlN structure, finding that the 2DEG's carrier density is reduced, yet not entirely eliminated, while a significant positive charge concentration at the AlN/Al 2 O 3 interface pins the Fermi level. This comprehensive investigation contributes to our understanding of microscopic phenomena in III–V heterostructures, paving the way for future advancements and applications in power electronics. [ABSTRACT FROM AUTHOR]

ScN in the rock salt structure is a well-investigated material due to its desirable properties like the high hardness or large thermal conductivity. Recent computations by Adamski et al. [Appl. Phys. Lett. 115, 232103 (2019)] showed that ScN/GaN heterostructures exhibit an outstanding polarization gradient which would be beneficial for polarization induced electron gases. The pseudobinary semiconductor Sc x Al 1 − x N, when maintaining the cubic rock salt structure, could be beneficial for tailoring the polarization gradient using the Sc dependency of material properties. The structural properties of rs-Sc x Al 1 − x N are not fully discovered yet, thus in this work, DC-magnetron sputtered cubic rock salt Sc x Al 1 − x N thin films with 0.55 < x < 1.00 were grown and analyzed on ScN(111)/Si(111). The epitaxial relation of ScN(111) thin films on the Si(111) substrate is determined to be ScN[110] ∥ Si[100]. Furthermore, concentration dependent properties like the lattice parameter of Sc x Al 1 − x N were measured [a(ScN) = 4.50 Å, a(Sc0.55Al0.45N) = 4.30 Å] and the stress σ within the layers was determined. The crystal quality was evaluated using ω -scans, revealing FWHM = 1.14 ° for Sc0.95Al0.05N. The diameters of the columns were determined by atomic force microscopy and scanning electron microscopy and they are range from 34 to 59 nm for 0.55 < x < 1.00. At x = 0.55 , Sc x Al 1 − x N columns in the hexagonal wurtzite as well as cubic rock salt structure were detected. This information about the structural specifications of Sc x Al 1 − x N in the rock salt structure forms the basis for further investigations and experimental confirmation of the electric properties of ScN/GaN heterostructures or even a Sc x Al 1 − x N/GaN based approach for improved structures for high-electron-mobility transistors. [ABSTRACT FROM AUTHOR]

This work highlights the influence of surface properties, on the characteristics of InAlN/GaN based high electron mobility transistor (HEMT) structures grown on the SiC substrate by metalorganic vapor phase epitaxy. The growth parameters, i.e., reactor pressure and V/III ratio were tuned to improve the morphological and two-dimensional electron gas (2DEG) characteristics of the HEMT structure. It was found that V/III ratio plays a significant role in improving surface morphology and 2DEG properties without altering average indium composition. It was also found that 2DEG properties are highly sensitive to surface morphology and its features. The step flow smooth surface morphology with very low surface and interface roughness was observed in optimized lattice-matched InAlN/GaN HEMT structures. The sheet resistance of ∼170 Ω/sq with good 2DEG concentration (∼2.4 × 1013 cm−2) and 2DEG mobility (∼1500 cm2/V s) was achieved in the optimized lattice-matched InAlN/GaN HEMT structure. A comparison between different barrier-based HEMT structures, i.e., lattice-matched InAlN/GaN and strained AlGaN/GaN, was also discussed. Their structural, electrical, morphological, and interfacial characteristics were compared. [ABSTRACT FROM AUTHOR]

This paper investigates near-interfacial charge trapping effects in graphene field-effect transistors with high-K gate dielectrics. Experimental and model-based analysis elucidates the impact of trapped charge on the transport properties of graphene. Landauer formalism is applied to correlate trapping-enhanced charged impurity scattering to degradation in conductivity and mobility. The analysis shows a significant reduction in conductivity and mobility with a transition toward the dominance of charge impurity scattering as evidenced by their dependence on the sheet carrier density. Moreover, we quantify the impact of trapped charge buildup on the carrier backscattering mean free path associated with charged impurities. This work provides new insights into the impact of charge trapping toward the development of logic, memory, and neuromorphic devices based on graphene and other low-dimensional materials and ultrascaled high-K dielectrics. [ABSTRACT FROM AUTHOR]

Designing organic semiconductors for practical applications in organic solar cells, organic field-effect transistors, and organic light-emitting diodes requires understanding charge transfer mechanisms across different length and time scales. The underlying electron transfer mechanisms can be efficiently explored using semiempirical quantum mechanical (SQM) methods. The dimer projection (DIPRO) method combined with the recently introduced non-self-consistent density matrix tight-binding potential (PTB) [Grimme et al., J. Chem. Phys. 158, 124111 (2023)] is used in this study to evaluate charge transfer integrals important for understanding charge transport mechanisms. PTB, parameterized for the entire Periodic Table up to Z = 86, incorporates approximate non-local exchange, allowing for efficient and accurate calculations for large hetero-organic compounds. Benchmarking against established databases, such as Blumberger's HAB sets, or our newly introduced JAB69 set and comparing with high-level reference data from ωB97X-D4 calculations confirm that DIPRO@PTB consistently performs well among the tested SQM approaches for calculating coupling integrals. DIPRO@PTB yields reasonably accurate results at low computational cost, making it suitable for screening purposes and applications to large systems, such as metal-organic frameworks and cyanine-based molecular aggregates further discussed in this work. [ABSTRACT FROM AUTHOR]

GdI 2 monolayer is a promising material for spintronics applications due to its robust room-temperature ferromagnetism and sizable valley polarization. In two-dimensional van der Waals magnets, interlayer magnetic coupling plays a crucial role in device applications. The performance of these devices can be effectively tuned by adjusting the stacking order, charge doping, and strain. By performing first-principles calculations, we have demonstrated that the interlayer magnetic coupling in bilayer GdI 2 is highly dependent on the stacking order, which can be tuned between ferromagnetic (FM) and antiferromagnetic orders through lateral shifting. Furthermore, the interlayer magnetic coupling can also be tuned by charge doping and strain, where both electron and hole doping can enhance the FM coupling interaction between layers, and the interlayer FM coupling can be strengthened with increasing biaxial tensile strain. These results show that bilayer GdI 2 has rich tunable interlayer magnetic interactions, which can be used in designing interesting spin tunnel field-effect transistor devices. [ABSTRACT FROM AUTHOR]

Graphene-based field-effect transistors (FETs) are suitable for pH sensors due to their outstanding surface chemical properties and its biocompatibility. To improve the devices' stability and pH sensitivity, different sets of dielectric passivation layers composed of monolayer hexagonal boron nitride with and without aluminum oxide layers were evaluated. Non-linearities of the pH response were observed. Heterostructure FETs were derived from subtractive manufacturing of commercially transferred two-dimensional materials on four-inch SiO2/Si wafers via stainless steel and polypropylene masking. Phosphate solutions (10 mM) of varying pH were incubated on bare devices, whereby liquid-gating elucidated linear changes in the Dirac voltage of hBN/graphene (−40 mV/pH) that was smaller than a device consisting only of monolayer graphene (−47 mV/pH). Graphene-based FETs were passivated with aluminum oxide nanofilms via electron beam or atomic layer deposition and were observed to have distinct Raman spectral properties and atomic force microscopy topologies corroborating the hypothesis that morphological differences of the deposited aluminum oxide influence the pH-dependent electrical properties. Atomic layer deposition of aluminum oxide on the 2D sensing areas resulted in non-linear shifting of the Dirac voltage with respect to pH that evolved as a function of deposition thickness and was distinct between graphene with and without hexagonal boron nitride as a capping monolayer. The non-linear response of varying thickness of AlxOy on graphene-based FETs was progressively reduced upon basic wet etching of the AlxOy. Overall, passivated graphene-based transistors exhibit deposition-dependent pH responses. [ABSTRACT FROM AUTHOR]

Using Bayesian spectroscopy, we performed spectral decomposition of gate modulation (GM) spectra measured in a pentacene organic field-effect transistor to understand comprehensively the optical nonlinear response due to GM and hole injection. Although GM spectra contain a variety of spectral components, by Bayesian spectroscopy, we can specify the role of each component in the nonlinear response by performing model selection that chooses the spectral components needed to explain the data without preconceptions. For a GM spectrum under positive GM, Bayesian spectroscopy shows that nonlinear responses by the change in polarizability dominate the GM spectrum among several types of Stark signals induced by the GM electric field, which is a physically valid conclusion. For GM spectra under negative GM where gate-induced carriers are injected, Bayesian spectroscopy succeeds in completely elucidating the spectral structure, which is composed of the two types of Stark signals due to changes in the polarizability and the dipole moment, bleaching, and gate-induced absorption signals. A pentacene film is known to have solid and isolated molecular phases, which may give different spectral responses. Therefore, we compared a model that treats these responses equally and a model that distinguishes them. Bayesian spectroscopy selects the latter models for all GM spectra, revealing statistically that nonlinear optical effects and hole injection effects are different in these phases. [ABSTRACT FROM AUTHOR]

In this article, we use spatially modulated control fields to increase the four-wave mixing efficiency in a four-subband semiconductor asymmetric double quantum well, motivated by similar works in atomic systems. Using a simplified version of the propagation equations, we show analytically that for control fields with a constant amplitude and linearly varying mixing angles with the propagation distance, a conversion efficiency close to unity can be achieved even for relatively short propagation distances. Subsequently, we confirm these results by numerically simulating the full set of propagation equations. [ABSTRACT FROM AUTHOR]

This study provides experimental evidence of charged interface states limited scattering in III-nitride heterostructures. Temperature-dependent Hall measurements and temperature-dependent ID–VG measurements indicate a significant influence of the charged interface states on the electron mobility in different AlGaN/GaN heterostructures where the characteristic of the interface is controlled by modulating the growth conditions. Charged interface states at the AlGaN/GaN heterointerface lead to electron scattering as the distance between the centroid of the two-dimensional electron gas and the interface decreases with increasing electron density. It is observed that a component of experimental Hall mobility, which ranges between 9.2 × 103 and 3.4 × 104 cm2/V s among the three samples, obtained after adding all the scattering events using Matthiessen's rule cannot be explained completely by considering all the conventional scattering mechanisms such as phonon–phonon scattering, interface roughness scattering, and dislocation density scattering. An in-depth analysis reveals a significant scattering of channel electrons by the charged states at the GaN/AlN/AlGaN interface. Furthermore, the estimated interface states from the temperature-dependent subthreshold slopes conducted on the fabricated high electron mobility transistors are in good agreement with the charged interface states extracted from the temperature-dependent Hall measurements. A good understanding on this new scattering mechanism in the GaN heterostructure may help in designing high-performance III-nitride devices in the future. [ABSTRACT FROM AUTHOR]

We propose and analyze the performance of terahertz (THz) room-temperature bolometric detectors based on the graphene channel field-effect transistors (GC-FET). These detectors comprise the gate barrier layer (BL) composed of the lateral hexagonal-boron nitride black-phosphorus/hexagonal-boron nitride (h-BN/b-P/h-BN) structure. The main part of the GC is encapsulated in h-BN, whereas a short section of the GC is sandwiched between the b-P gate BL and the h-BN bottom layer. The b-P gate BL serves as the window for the electron thermionic current from the GC. The electron mobility in the GC section encapsulated in h-BN can be fairly large. This might enable a strong resonant plasmonic response of the GC-FET detectors despite relatively lower electron mobility in the GC section covered by the b-P window BL. The narrow b-P window diminishes the Peltier cooling and enhances the detector performance. The proposed device structure and its operation principle promote elevated-temperature GC-FET THz detector responsivity values and other characteristics, especially at the plasmonic resonances. [ABSTRACT FROM AUTHOR]

To this day, trapezoidal defects are found in clusters and high counts in wafers representing the industry standard in terms of material quality being produced. This study sheds light on the nature, origin, behavior, and impact of this defect on device yield and reliability. Trapezoidal defects in 4H-SiC epitaxial layers were investigated by photoluminescence (PL) imaging, scanning electron microscopy (SEM), cathodoluminescence spectrum imaging (CLSI), SEM electron beam induced current (EBIC) imaging, and by transmission electron microscopy (TEM) observation. The bar-shaped stacking faults were identified by the PL and CL measurements with a peak emission wavelength of 420 and 450 nm. An optoelectronic behavioral study based on the recombination enhanced dislocation glide mechanism revealed how expanding dislocations and stacking faults interact with each other. Combining the luminescence and microscopy results, the nature of the stacking faults was identified as being a combination of Shockley-type and Frank-type stacking faults. The TEM analysis showed that these defects originate from the substrate and the stacking sequences of some of the faults were determined as (...2, 4, 2...) and (...2, 3, 2...) in the Zhdanov's notation by high-resolution TEM. The origin of this defect is speculated based on our results and previous reports. The EBIC imaging showed that the high density of SFs in these towers is a strong site of carrier recombination, which presumably has an impact on the transfer characteristics of SiC devices. Furthermore, these defects have shown to impact metal oxide semiconductor field effect transistors electrical performance via an increase in the on-state resistance depending on the coverage percentage of the tower of defects in the active area of the device. [ABSTRACT FROM AUTHOR]

Silicon carbide (SiC) power devices are becoming central components in high voltage electronics. However, defects at interfaces and in the bulk continue to severely impact their reliability and performance. Here, we develop a charge pumping method to characterize SiC/SiO 2 interface defects in fully fabricated commercial SiC power metal–oxide–semiconductor field-effect transistors (MOSFETs). The method is then used to address spin states at the SiC/SiO 2 interface via charge pumping electrically detected magnetic resonance (CP-EDMR). We apply these methods to investigate the power MOSFET after electron irradiation over a dose range of 10 13 − 10 17 cm − 2 . We finally discuss CP-EDMR as a technique to interrogate spins during device operation for real-time monitoring of the device quality, performance, and degradation and as a probe for local magnetic fields. [ABSTRACT FROM AUTHOR]

Field-effect transistors (FETs) made from colloidal quantum dot (QD) solids commonly suffer from current–voltage hysteresis caused by the bias-stress effect (BSE), which complicates fundamental studies of charge transport in QD solids and the use of QD FETs in electronics. Here, we show that the BSE can be eliminated in n-channel PbSe QD FETs by first removing the QD ligands with a dose of H2S gas and then infilling the QD films with alumina by atomic layer deposition (ALD). The H2S-treated, alumina-infilled FETs have stable, hysteresis-free device characteristics (total short-term stability), indefinite air stability (total long-term stability), and a high electron mobility of up to 14 cm2 V−1 s−1, making them attractive for QD circuitry and optoelectronic devices. The BSE-free devices are utilized to conclusively establish the dependence of the electron mobility on temperature and QD diameter. We demonstrate that the BSE in these devices is caused by both electron trapping at the QD surface and proton drift within the film. The H2S/alumina chemistry produces ligand-free PbSe/PbS/Al2O3 interfaces that lack the traps that cause the electronic part of the BSE, while full alumina infilling stops the proton motion responsible for the ionic part of the BSE. Our matrix engineering approach should aid efforts to eliminate the BSE, boost carrier mobilities, and improve charge transport in other types of nanocrystal solids. [ABSTRACT FROM AUTHOR]

Switching a silicon carbide (SiC) metal–oxide–semiconductor field-effect transistor between inversion and accumulation with removed drain and grounded source terminals leads to defect-assisted carrier recombination and light emission. The energy spectrum of the emitted photons provides valuable information on the involved defects, located both at the 4H-SiC/ SiO 2 interface and in the 4H-SiC bulk. Here, we measured and analyzed the emitted light over a broad temperature range between 12 and 297 K. Our results reveal two local maxima in light intensity around 30 and 140 K. Most importantly, the local intensity maxima and the related temperatures correlate with both the overall recombination current and gate capacitance measurements. The spectral analysis allowed us to distinguish between recombinations occurring on 4H-SiC bulk defects and 4H-SiC/ SiO 2 interface-related defects. We explain an initial increase of light emission with decreasing temperature to competing non-radiative pathways with activation energies of 34 and 60 meV for SiC/ SiO 2 interface- and 4H-SiC bulk-related emissions, respectively. Based on an extensive literature review, we link the measured photon emission to donor–acceptor pair recombination, the EH 6 / 7 or the Z 1 / 2 defect centers. In addition to that, we could link a prominent peak at 2.915 eV to the L 1 line of the D 1 -center. Most importantly, we conducted our own ab initio simulations revealing that recombination via P bC -centers, previously identified with carbon dangling bonds at the 4H-SiC/ SiO 2 interface [Cottom et al., J. Appl. Phys. 124, 045302 (2018)], could also provide an explanation for the photon emission around 1.75 eV. Finally, our simulation of an interface-related silicon vacancy V Si , I reveals a radiative transition around 2.8 eV. [ABSTRACT FROM AUTHOR]

Heterogeneous integration of functional oxides with ultra-wide bandgap (UWBG) semiconductors is desired for the realization of novel hybrid systems applicable to a wide array of commercial electronics and defense applications. In this work, we demonstrate the growth of crystalline SrTiO3 (STO) thin films on high-electron-mobility transistor (HEMT) heterostructures based on an emergent UWBG semiconductor ScAlN, used as the barrier layer on a GaN channel, and determine the effects of the pre-growth chemical treatments of the ScAlN surface on resultant heterostructure properties. We investigate wet chemical cleans of ScAlN with solvents, piranha solution, UV ozone and hydrofluoric acid, and a sulfuric-phosphoric acid mix prior to STO growth, and show that the commonly used piranha solution degrades the ScAlN surface, thereby reducing the crystal quality of the deposited STO layers and lowering the channel mobility. We determine that among the treatments studied, the solvent and sulfuric-phosphoric acid cleans were the least disruptive to the electrical properties of the GaN channel as evidenced from Hall effect measurements, but the sulfuric-phosphoric acid clean results in best oxide crystallinity, as determined from structural characterizations. We perform transmission electron microscopy imaging on the piranha-treated and sulfuric-phosphoric-treated samples to compare the microstructure and find that while intermixing occurs at the oxide-nitride interfaces for both samples, the interface roughness is lower and the STO grain size is larger in the sample with sulfuric-phosphoric acid treatment. This work demonstrates the first epitaxial growth of STO on an UWBG semiconductor and motivates STO/ScAlN/GaN as material platforms for high-frequency, high-power-density HEMTs. [ABSTRACT FROM AUTHOR]

In this work, we study the electronic properties of nanotubes with spin–orbit interaction that exhibit a spin Hall effect. Nanoribbons made of these materials are expected to have topologically protected states. The lack of edge states in a seamless tube eliminates the possibility of finding a topological edge state. The spin–orbit interaction breaks the degeneracy of Dirac's cones and eliminates the chance of finding a metal nanotube. As a consequence, this makes all nanotubes with spin–orbit interaction trivial band insulators. We focus our attention on two features. First, we study the energy band gap as a function of the diameter of the nanotubes. Then, we concentrate on controlling the bandgap of a nanotube by applying an external radial electric field. Finally, we discuss the possibility of using one of these tubes as a field-effect transistor. [ABSTRACT FROM AUTHOR]