351. Temperature changes during deformation of polycrystalline and nanocrystalline nickel
- Author
-
Thomas Sears, David Backman, T. Chan, Uwe Erb, Iain Brooks, and R. Bos
- Subjects
Materials science ,Stress-induced ,Polycrystalline materials ,chemistry.chemical_element ,Nano-crystalline nickel ,Temperature changes ,True stress-strain ,Nickel ,High resolution ,Polycrystalline ,Nanocrystallines ,Room temperature ,Nanocrystalline materials ,Maximum temperature ,Heat generation ,Metallurgy ,General Engineering ,Heat zone ,Strain rate ,Nanocrystalline material ,Grain size ,Deformation ,Grain growth ,Stress-strain curves ,chemistry ,Onset temperature ,Crystallite ,Deformation (engineering) ,Grain size and shape - Abstract
Commercially available polycrystalline nickel (grain size: 30 μm) and electrodeposited nanocrystalline nickel (grain size: 30 nm) were analyzed for the effect of stress-induced heat generation during plastic deformation at room temperature. Tensile coupons in conformance to ASTM E8 standard were tested at a strain rate of 10 -1/s to record the amount heat dissipated using a high resolution infrared detector. The maximum temperature increases recorded for nanocrystalline and polycrystalline nickel close to sample fracture were 58° and 70°, respectively. Grain growth in nanocrystalline nickel due to stress-induced heat generation is unlikely since the maximum temperature during deformation is below the previously reported onset temperature for grain growth in nanocrystalline nickel. © (2012) Trans Tech Publications, Switzerland., 7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011, 1 August 2011 through 5 August 2011, Quebec City, QC
- Published
- 2012