301. Deposition of a low-stress diamond film on stainless steel with a Mo/Mo-N interlayer.
- Author
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Li, Xiao, Zhang, Xijin, Xia, Fan, Chen, Chengke, Jiang, Meiyan, Lu, Shaohua, and Hu, Xiaojun
- Subjects
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DIAMOND films , *STAINLESS steel , *BOND strengths , *THERMAL expansion , *PROBLEM solving - Abstract
Depositing an adhering diamond film on stainless steel is still challenging. In this work, Mo/Mo-N film is used as an interlayer to solve the problem. The results show that diamond film with good adhesion is obtained when the interlayer with the N 2 /Ar ratios of 50 %–100 % is used. It is ascribed to the formation of Mo 2 N phase in the interlayer through which it is more difficult for carbon atoms to diffuse than Mo phase. On the Mo/Mo-N interlayer, carbon atoms are easily gathered and a new phase MoC appeared as well as Mo 2 C phase at the interface of diamond/interlayer. Thermal expansion of MoC is obviously lower than that of Mo 2 C, resulting in the lower stress of diamond film. And MoC offers higher bond strength between the diamond and the interlayer compared to Mo 2 C phase. As a result, the diamond film presents good adhesion. • Adherent diamond films were prepared on the steel using Mo/Mo-N interlayers. • The stress of diamond films on stainless steel is lower using Mo/Mo-N interlayers. • The high adhesion of diamond film is ascribed to the formation of Mo 2 N. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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