351. High-accuracy bulk electronic bandmapping with eliminated diffraction effects using hard X-ray photoelectron momentum microscopy.
- Author
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Babenkov, S., Medjanik, K., Vasilyev, D., Chernov, S., Schlueter, C., Gloskovskii, A., Matveyev, Yu., Drube, W., Schönhense, B., Rossnagel, K., Elmers, H.-J., and Schönhense, G.
- Subjects
ELECTRONIC structure ,X-ray photoelectron spectroscopy ,PHONON scattering ,SEMICONDUCTOR surfaces ,TIME-of-flight spectroscopy - Abstract
A key benefit of angle-resolved photoelectron spectroscopy (ARPES) in the X-ray range is the significant increase of the information depth, thanks to the large inelastic mean-free-path of the escaping photoelectrons. In practice hard X-ray ARPES (HARPES) faces severe challenges by low cross sections, large photon momentum transfer, and in particular strong phonon scattering and photoelectron diffraction effects. Here, we show that these challenges can be overcome by extending ultra-efficient time-of-flight momentum microscopy into the hard X-ray regime. Phonon scattering destroys the initial momentum distribution but subsequent diffraction at the lattice imprints a pronounced Kikuchi-type pattern on the background signal. Moreover, the pattern of the valence electrons is modulated by diffraction as well. For the examples of the medium-weight element materials Mo and layered TiTe
2 , we demonstrate how comprehensive valence-band and core-level photoemission data taken under identical conditions can be used to effectively remove photoelectron diffraction effects in HARPES band maps. The study of electronic structure of new materials has benefited from more widely available angle-resolved photoelectron spectroscopy (ARPES) at synchrotron sources, but hard X-ray ARPES, capable of mapping at a depth of some tens nanometres is still of limited access. The authors report on a method to obtain bulk electronic structure using hard X-rays ARPES combined with an effective data processing background removal strategy capable of revealing the valence band electronic dispersion of metal and semiconductor surfaces. [ABSTRACT FROM AUTHOR]- Published
- 2019
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