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355. Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

360. Deposition and re-erosion studies by means of local impurity injection in TEXTOR

379. Demonstration of a low V_πL modulator with GHz bandwidth based on electro-optic polymer-clad silicon slot waveguides

389. Through-silicon-via technology for 3D integration

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