192 results on '"Kikuchi, Katsuya"'
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152. A Study on Coupling Efficiency between VCSEL and 45°-angled mirror component for Low-cost and High-density 10Gbps/ch Optical Parallel Link Module
153. Novel Flip-Chip Bonding Technology using Chemical Process
154. Interconnection of Micropad Electrodes by Controlled “Extraneous” Deposition of Electroless NiB Film
155. Low-Cost and High-Density 10Gbps/ch Optical Parallel Link Module for Multi-Terabit Router Application
156. Extracting dielectric constant of low-k thin film material for interposer of 3-D multilayer packaging
157. Micropattern Formation of Photosensitive Imide Block Copolymer Thick Films
158. Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
159. PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system.
160. Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration.
161. Superconducting ultrahigh-speed time domain reflectometry measurement system for electrical characterization of transmission line structures
162. X-ray detection by an on-chip coil integrated superconducting tunnel junction
163. Response of an On-Chip Coil-Integrated Superconducting Tunnel Junction to X-rays
164. Fabrication of High-Density Wiring Interposer for 10 GHz 3D Packaging Using a Photosensitive Multiblock Copolymerized Polyimide
165. Fiske Steps of Josephson Tunnel Junctions Formed with Normal-Distribution Function
166. On-chip coil integrated superconducting tunnel junction for a high performance X-ray detector
167. Normal distribution function shaped superconducting tunnel junctions with Ta electrodes
168. Normal-distribution-function-shaped Josephson tunnel junctions
169. Suppression of the Josephson Current in Normal-Distribution-Shaped Tunnel Junctions
170. A technique of scatter-glare correction using a digital filtration
171. Effect of d-Limonene on the Amounts of Ethanol and Indomethacin Penetrated from Aqueous Gel Ointments to Rat Skin.
172. Vertically Pluggable and Compact 10-Gb/s 12-Channel Optical Modules With Anisotropic Conductive Film for Over 100-Gb/s Optical Interconnect Systems.
173. Method for estimating the intensity of scattered radiation using a scatter generation model
174. Simple and sensitive determination of timolol in human plasma and urine by high-performance liquid chromatography with ultraviolet detection
175. Diagnosis of gastric cancers with fluorescein-labeled monoclonal antibodies to carcinoembryonic antigen.
176. Interconnection of Multi-Pad Electrodes by "Controlled Anisotropic Extraneous (CAEx) Deposition" of Electroless NiB Film
177. Modified Thermosonic Flip-Chip Bonding based on Electroplated Cu Microbumps and Concave Pads for High-precision Low-temperature Assembly Applications
178. Investigation of Optimized High-Density Flip-Chip Interconnect Design including Micro Au Bumps for 3-D Stacked LSI Packaging
179. Fabrication and Electrical Characterization of Parylene-HT Liner Bottom-up Copper Filled Through Silicon Via (TSV)
180. Copper Filled TSV Formation with Parylene-HT Insulator for Low-Temperature Compatible 3D Integration
181. Investigation of Optimized High-Density Flip-Chip Interconnect Design including Micro Au Bumps and Underfill for Ultrabroadband (DC-40GHz) Applications
182. Investigation of Low-temperature Deposition High-uniformity Coverage Parylene-HT as a Dielectric Layer for 3D Interconnection
183. Investigation of a Microchannel-based Cooling Interposer for High-Performance Memory-on-Logic 3DIC Design
184. Wide Bus Chip-to-Chip Interconnection Technology Using Fine Pitch Bump Joint Array for 3D LSI Chip Stacking
185. Imaging analysis of hemoglobin distribution on the liver surface.
186. Magnetic properties of Mg1-pMnpTe2 near p = 0.5
187. Polarized-Neutron Study of NiS2
188. Magnetic Study of NiS2Single Crystals
189. On the anomaly of NiS2 at the Curie temperature
190. Spin Structure and Magnetic Properties of NiS2
191. Magnetic Properties of Cr1/3NbS2
192. High-precision integration approach based on alignment maintaining flip-chip bonding using cone shaped bump and truncated pyramid pad.
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