587 results on '"Adan, Ofer"'
Search Results
252. CD-SEM real time bias correction using reference metrology based modeling
253. Holistic metrology qualification extension and its application to characterize overlay targets with asymmetric effects
254. Unique method for controlling device level overlay with high-NA optical overlay technique using YieldStar in a DRAM HVM environment
255. Overlay and stitching metrology for massively parallel electron-beam lithography (Conference Presentation)
256. X-ray EM simulation tool for ptychography dataset construction
257. Image-based overlay and alignment metrology through optically opaque media with sub-surface probe microscopy
258. Complex EUV imaging reflectometry: spatially resolved 3D composition determination and dopant profiling with a tabletop 13nm source
259. Image-based overlay measurement using subsurface ultrasonic resonance force microscopy
260. Characterization and imaging of nanostructured materials using tabletop extreme ultraviolet light sources
261. Measurement of pattern roughness and local size variation using CD-SEM: current status
262. Line-width roughness of advanced semiconductor features by using FIB and planar-TEM as reference metrology
263. Contact inspection of Si nanowire with SEM voltage contrast
264. The need for LWR metrology standardization: the imec roughness protocol
265. Through-focus scanning optical microscopy (TSOM) with adaptive optics
266. Buckling characterization of gate all around silicon nanowires
267. Material contrast based inline metrology: process verification and control using back scattered electron imaging on CD-SEM
268. Roughness characterization of gate all around Silicon Nano Wire fabrication
269. Roughness metrology of gate all around silicon nanowire devices
270. Characterization of EUV resists for defectivity at 32nm
271. Sensitivity of LWR and CD linearity to process conditions in active area
272. Standard cell electrical and physical variability analysis based on automatic physical measurement for design-for-manufacturing purposes
273. Electron-beam induced photoresist shrinkage influence on 2D profiles
274. CDSEM focus/dose monitor for product applications
275. Measurements and sensitivities of LWR in poly spacers
276. Phenomenology of electron-beam-induced photoresist shrinkage trends
277. Accurate electrical prediction of memory array through SEM-based edge-contour extraction using SPICE simulation
278. Accurate in-resolution level overlay metrology for multipatterning lithography techniques
279. Characterization of CD-SEM metrology for iArF photoresist materials
280. MacroCD contact ellipticity measurement for lithography tool qualification
281. SEM metrology for advanced lithographies
282. Metrology challenges for advanced lithography techniques
283. CD SEM metrology macro CD technology: beyond the average
284. Verification of height and sidewall angle SEM metrology accuracy using Monte Carlo simulation
285. Advanced 2D structures metrology with CD-SEM for OPC challenges
286. Characterizing and understanding stray tilt: the next major contributor to CD SEM tool matching
287. Accurate electrical prediction of memory array through SEM-based edge-contour extraction using SPICE simulation.
288. Recess metrology challenges for 3D device architectures in advanced technology nodes.
289. Accurate in-resolution level overlay metrology for multipatterning lithography techniques.
290. Phenomenology of ArF photoresist shrinkage trends.
291. Metrology challenges for advanced lithography techniques.
292. SEM metrology for advanced lithographies.
293. Small feature accuracy challenge for CD-SEM metrology physical model solution.
294. Advanced CDSEM matching methodology for OPC litho cell-based matching verification.
295. Embedded charge investigation: industry concerns and metrology solutions.
296. Verification of height and sidewall angle SEM metrology accuracy using Monte Carlo simulation.
297. Height and sidewall angle SEM metrology accuracy.
298. CD-SEM application for generic analysis of two-dimensional features on wafers and reticles.
299. Characterizing and understanding stray tilt: the next major contributor to CD SEM tool matching.
300. Edge roughness characterization of advanced patterning processes using power spectral density analysis (PSD)
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