965,679 results on '"WAFER"'
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202. Enhancing silicon wafer ablation using passive Q-switch [formula omitted] lasers with third-order nonlinear effects
203. Brittle-ductile transition mechanism during grinding 4H-SiC wafer considering laminated structure
204. Wafer-scale growth of 2D SnSx hybrid films on germanium by atomic layer deposition for broadband photodetection
205. Wafer-scale N-polar GaN heterogeneous structure fabricated by surface active bonding and laser lift-off
206. Wafer-scale high-performance organic phototransistor arrays
207. Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry
208. A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging
209. Heterogeneous wafer bonding of ultra-wide bandgap Ga2O3: A review
210. A wafer-level 3D integrated T/R microsystem with 0.5-wavelength self-matching connectors
211. Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
212. Resistive random-access memories using quasi-2D halide perovskites for wafer-scale reliable switching behaviors
213. Masked autoencoder with dynamic multi-loss adaptation mechanism for few shot wafer map pattern recognition
214. Wafer-scale fabrication of single-crystalline calcium fluoride thin-film on insulator by ion-cutting
215. A wafer-level characterization method of thin film transverse piezoelectric coefficient evaluation
216. Wafer-scale mesoporous GaN distributed bragg reflectors with enhanced luminescence for Eu doped β-Ga2O3 thin films
217. Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles
218. Development of a wafer cooling system using ionic liquid under high vacuum condition for semiconductor fabrication device
219. High performance photodetectors by integrating CsPbBr3 perovskite directly on the germanium wafer
220. Fabrication and electrical characterization of carbon coating on a quartz wafer treated with nitrogen ion implantation
221. Influence of beam polarization on underwater femtosecond laser machining of silicon wafer
222. Development of microencapsulated phase change material slurry for diamond wire sawing silicon wafer and its effect on cutting quality
223. From surface activation to microfluidic heat pipes: An innovative in-situ wafer level heterogenous bonding method
224. Wafer-level InP-Si covalent bonding and defect-free heterointerface for photonic quantum systems
225. Engineering wafer scale single-crystalline Si growth on epitaxial Gd2O3/Si(111) substrate using radio frequency sputtering for silicon on insulator application
226. Analysis of contact length and temperature effect in rocking mode diamond wire sawing of monocrystalline silicon carbide wafer
227. Quantitative evaluation of PI-RDL interfacial delamination in fan-out wafer-level packaging during unbiased highly accelerated stress test
228. Study on removal mechanism of polycrystalline diamond wafer by grinding containing transition metals
229. Hard X-ray nanoprobe to study the emission properties of Ce-doped YAG wafer by using XEOL and TR-XEOL
230. A fast ramp-up framework for wafer yield improvement in semiconductor manufacturing systems
231. Wafer-level flexible carbon-based film for fluorescent display and optical information storage
232. DMWMNet: A novel dual-branch multi-level convolutional network for high-performance mixed-type wafer map defect detection in semiconductor manufacturing
233. Enabling MOCVD production on next generation 150 mm Indium Phosphide wafer size
234. Wear measurement of ultrathin grinding wheel using fiber optical sensor for high-precision wafer dicing
235. Controllable substitutional vanadium doping in wafer-scale molybdenum disulfide films
236. Processing of diamond films with azimuthal texture on silicon wafer for quantum systems
237. Clogging monitoring and regeneration of filtration film in wafer cleaning circulation systems for semiconductor manufacturing
238. Effect of slurry and fixed abrasive pad on chemical mechanical polishing of SiC wafer
239. Insertion loss and polarization-dependent loss measurement improvement to enable parallel silicon photonics wafer-level testing
240. Characterization of machined surface in semi-conductive SiC wafer subjected to micro-EDM drilling
241. A new look of dispatching for multi-objective interbay AMHS in semiconductor wafer manufacturing: A T–S fuzzy-based learning approach
242. High-performance Bi2S3 photodetector based on oxygen-mediated defect engineering and its wafer-scale fast fabrication
243. Nanoscale phase transformation in SiC wafer by spatiotemporal tailored ultrafast laser pulses for multiple optical data encryption
244. A framework for detecting unknown defect patterns on wafer bin maps using active learning
245. A depthwise convolutional neural network model based on active contour for multi-defect wafer map pattern classification
246. Impact of Ar plasma bombardment on the composition and surface roughness of GaAs wafer
247. Research on the reliability of wire web in diamond multi-wire saw slicing photovoltaic monocrystalline silicon wafer
248. Wafer-level metal thin film thickness scanning based on multiple probe wavelengths nanosecond transient thermoreflectance
249. Enhanced detection of unknown defect patterns on wafer bin maps based on an open-set recognition approach
250. In-situ full-wafer metrology via coupled white light and monochromatic stroboscopic illumination
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