201. Low distortion cold rolled clad sheets for mounting material
- Author
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S. Ozawa, H. Okamoto, K. Yoshida, and K. Saijo
- Subjects
Chemical process ,Cladding (metalworking) ,Surface activated bonding ,Materials science ,Alloy ,Metallurgy ,Intermetallic ,engineering ,Brazing ,engineering.material ,Isotropic etching ,FOIL method - Abstract
A new cladding process has been developed by means of a surface activated bonding technique. The metal sheets to be bonded are cleaned by Ar plasma ion etching activated and rolled with low distortion at room temperature in vacuum. In many respects, the clad sheets manufactured by this process have advantages over conventional clad sheets. For instance, they have a clean and flat interface without intermetallic alloy layer. Thin metal foil (10 /spl mu/m/spl sim/thickness) can be bonded with the metal sheet. The multi layer clad sheet produced by this process can be formed easily by selective chemical etching method Therefore, the sheet makes it possible to design a fine and solid conductive circuit with bump only through the chemical etching process.
- Published
- 2003