568 results on '"Lee, Chang-Chun"'
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202. Physically based modeling for stress assessment in MOS devices
203. Emergence and Evolution of Avian H5N2 Influenza Viruses in Chickens in Taiwan
204. Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
205. Mechanical property effects of Si1−xGex channel and stressed contact etching stop layer on nano-scaled n-type metal–oxide–semiconductor field effect transistors
206. Overview of interfacial fracture energy predictions for stacked thin films using a four-point bending framework
207. Development of simulation-approach for 3D chip stacking with fine-pitch array-type microbumps.
208. Novel assembly framework of bi-layered molding materials for 3D-ICs packaging
209. Membrane Permeability of Hydrocarbon-Cross-Linked Peptides
210. Effect of Curcumin on Peptide-Membrane Interaction: In Kinetics and in Equilibrium
211. Ge1 − xSix on Ge-based n-type metal–oxide semiconductor field-effect transistors by device simulation combined with high-order stress–piezoresistive relationships.
212. Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film
213. Stress Impact of a Tensile Contact Etch Stop Layer on Nanoscale Strained NMOSFETs Embedded with a Silicon–Carbon Alloy Stressor
214. Strain Engineering of Nanoscale Si P-Type Metal-Oxide-Semiconductor Field-Effect Transistor Devices with SiGe Alloy Integrated with Contact-Etch-Stop Layer Stressors
215. Development of robust flexible OLED encapsulations using simulated estimations and experimental validations
216. A New Stress Migration Failure Mode in Highly Scaled Cu/Low-$k$ Interconnects
217. Light degradation test and design of thermal performance for high-power light-emitting diodes
218. Transversals inm×nArrays
219. Emerged HA and NA Mutants of the Pandemic Influenza H1N1 Viruses with Increasing Epidemiological Significance in Taipei and Kaohsiung, Taiwan, 2009–10
220. Permeation of Amphipathic Drug through a Lipid Bilayer: Curcumin
221. Competitive Binding to Lipid Bilayers by Peptides and Drugs
222. How Islet Amyloid Polypeptide Damages Lipid Bilayers
223. Mechanical reliability enhancement of flexible packaging with OLED display under bending loading conditions
224. Effective moduli prediction for silicon interposer with high-density Cu-filled through-silicon via
225. Impact of Strain Engineering on Nanoscale Strained InGaAs MOSFET Devices
226. Technology computer-aided design simulation study for a strained InGaAs channel n-type metal-oxide-semiconductor field-effect transistor with a high-k dielectric oxide layer and a metal gate electrode
227. Transmembrane Pores Formed by Human Antimicrobial Peptide LL-37
228. pH Dependence of the Adhesion Property of Lipid Bilayers and a Method of Measuring the Adhesion Energy
229. Adhesion and Merging of Lipid Bilayers: A Method for Measuring the Free Energy of Adhesion and Hemifusion
230. Kinetics of Membrane Permeabilization by Human Antimicrobial Peptide LL-37
231. Impact of strain engineering on InGaAs NMOSFET with an InGaAs alloy stressor
232. Kinetic Process of β-Amyloid Formation via Membrane Binding
233. The Impact of Matching Vaccine Strains and Post-SARS Public Health Efforts on Reducing Influenza-Associated Mortality among the Elderly
234. Membrane-Mediated Peptide Conformation Change from α-Monomers to β-Aggregates
235. Simulation of a nanoscale strained Si NMOSFET with a silicon–carbon alloy stressor
236. Observation of Beta-Amyloid Formation Via Membrane Binding
237. Thermodynamics of Membrane-Mediated β-Amyloid Formation: A Free Energy Description Based on X-Ray, CD, and GUV Experiments
238. Strain engineering of nanoscale Si MOS devices
239. A TCAD simulation study of impact of strain engineering on nanoscale strained Si NMOSFETs with a silicon–carbon alloy stressor
240. Fracture prediction of dissimilar thin film materials in Cu/low-k packaging
241. Adhesion investigation of low-k films system using 4-point bending test
242. Carrier backscattering characteristics of nanoscale strained complementary metal-oxide-semiconductor devices featuring the optimal stress engineering
243. Lead‐free solder joint reliability estimation of flip chip package using FEM‐based sensitivity analysis
244. Interaction of Tea Catechin (−)-Epigallocatechin Gallate with Lipid Bilayers
245. Interfacial Fracture Analysis of CMOS Cu/Low-$k$ BEOL Interconnect in Advanced Packaging Structures
246. Hemifusion of Giant Lipid Vesicles by a Small Transient Osmotic Depletion Pressure
247. Interaction of Tea Catechin (—)-Epigallocatechin Gallate with Lipid Bilayers
248. Impact of channel width and dummy length on performance enhancement in p-type metal oxide semiconductor field effect transistor with a silicon-germanium alloy stressor
249. Cracking energy estimation of ultra low-k package using novel prediction approach combined with global–local modeling technique
250. The Bound States of Amphipathic Drugs in Lipid Bilayers: Study of Curcumin
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