201. Porous polyimide separator promotes uniform lithium plating for lithium‐free cells
- Author
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Jui‐Yu Pai, Hao‐Yu Ku, Chun‐Cheng Lin, Chien‐Wei Chiang, Laurence J. Hardwick, and Chi‐Chang Hu
- Subjects
copper substrate ,dendrite inhibition ,lithium plating/stripping ,polyimide ,separator ,Industrial electrochemistry ,TP250-261 ,Chemistry ,QD1-999 - Abstract
Abstract Electrospun polyimide (PI) separators were found to reduce the charge‐transfer resistance of Li plating/stripping and the overpotentials of Li nucleation/growth onto Cu foils in the 1.2 M LiPF6/(ethylene carbonate/dimethyl carbonate = 1/1) electrolyte without any additives in comparison with polyethylene (PE) separators. Lithium deposition through the PI separator led to the formation of a granular morphology of 15–30 µm in diameter compared to lithium dendrites using PE. A similar trend of lithium deposition was observed in LiFePO4//Cu cells. The PI separator was found to enhance the discharge capacity and cycle life of Li plating/stripping in the Li//Cu and LiFePO4//Cu cells containing 40 µl electrolytes, verifying that the PI separator provides dendrite inhibition capability for the lithium‐metal‐free cells.
- Published
- 2022
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