201. Effect of shield-can for drop/shock behavior of board level assembly
- Author
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Kyung-Woon Jang, Ji-Young Yoon, Jae Kwak, Da Yu, Soonwan Chung, and Seungbae Park
- Subjects
Engineering ,business.industry ,Mechanical engineering ,Structural engineering ,Drop impact ,Shock (mechanics) ,Printed circuit board ,Shield ,Soldering ,visual_art ,Electromagnetic shielding ,Electronic component ,visual_art.visual_art_medium ,Integrated circuit packaging ,business - Abstract
In order to protect electronic components on a Printed Circuit Board (PCB) against electromagnetic radiation/wave, a shielding in the form of an electrically conductive shield-can or box is normally attached on the PCB covering the electronic components. The attached shield-can could provide an additional mechanical strength and minimize the out-ofplane deformation especially where the electronic package is located. In this study, both the dynamic responses of PCB and the characteristic life of solder joints with respect to different shield-can designs were investigated.
- Published
- 2010
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