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Your search keyword '"Isobe, K"' showing total 2,009 results
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2,009 results on '"Isobe, K"'

201. A 70 nm 16 Gb 16-Level-Cell NAND flash Memory

Author

Shibata, N., primary, Maejima, H., additional, Isobe, K., additional, Iwasa, K., additional, Nakagawa, M., additional, Fujiu, M., additional, Shimizu, T., additional, Honma, M., additional, Hoshi, S., additional, Kawaai, T., additional, Kanebako, K., additional, Yoshikawa, S., additional, Tabata, H., additional, Inoue, A., additional, Takahashi, T., additional, Shano, T., additional, Komatsu, Y., additional, Nagaba, K., additional, Kosakai, M., additional, Motohashi, N., additional, Kanazawa, K., additional, Imamiya, K., additional, Nakai, H., additional, Lasser, M., additional, Murin, M., additional, Meir, A., additional, Eyal, A., additional, and Shlick, M., additional

Published
2008
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203. Studies on the behaviour of tritium in components and structure materials of tritium confinement and detritiation systems of ITER

Author

Kobayashi, K., primary, Isobe, K., additional, Iwai, Y., additional, Hayashi, T., additional, Shu, W., additional, Nakamura, H., additional, Kawamura, Y., additional, Yamada, M., additional, Suzuki, T., additional, Miura, H., additional, Uzawa, M., additional, Nishikawa, M., additional, and Yamanishi, T., additional

Published
2007
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213. Preliminary Results of a Prospective Study of Dose Reduced Short-Course CHOP followed by Involved Field Radiotherapy for Elder Patients 70 Years Old or More with Localized Aggressive non-Hodgkins Lymphomas (Japan Radiation Oncology Group; JAROG Study)

Author

Shikama, N., primary, Oguchi, M., additional, Kagami, Y., additional, Isobe, K., additional, Nakamura, K., additional, Tamaki, Y., additional, Hasegawa, M., additional, and Sasaki, S., additional

Published
2005
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229. Site Investigation and Experimental Study on Slope Failure in Housing Complex Constructed by Cutting the Ground and Filling in 2004 Niigataken Chuetsu Earthquake.

Author

Ohtsuka, S., Isobe, K., and Takahara, T.

Abstract

The article reports on a study showing that many houses were damaged in Nagaoka City, Japan during the 2004 Niigataken Chuetsu earthquake not because of the earthquake motion but because of ground deformation. It says that severe ground damage occurred at the Takamachi housing complex due to the cut and fill method used in setting the foundation for building the residential homes. It also notes that artificial fill slopes collapsed in four sites where the soil had been saturated by water after a rainstorm that happened three days before the earthquake.

Published
2009

230. Liquefaction and its Influence to House Damage in the Niigataken Chuetsu-Oki Earthquake in 2007.

Author

Ohtsuka, S., Isobe, K., Hirade, T., and Hayashi, K.

Abstract

The article discusses the results of a study on the relationship between ground condition and damage to houses during the July 16, 2007 Niigataken Chuetsu-Oki Earthquake in Japan. Employing surface wave exploration, Swedish sounding test, boring methods and interviews with the local community, the study showed that the earthquake created extensive damage in the villages of Kariwa, Matsunami and Hashiba located in Kashiwazaki City due to ground failure as a result of liquefaction, complicated ground structure and the presence of underground sand.

Published
2009

239. LS-DYNA Simulation of Redrawing Non-Circular Cups with Tapered Dies Designed by the Slip-Line Field Method.

Author

Isobe, K., Wagoner, R. H., Ghosh, S., Castro, J. C., and Lee, J. K.

Subjects
*DIES (Metalworking), *THICKNESS measurement, *METAL formability, *SIMULATION methods & models
Abstract

This paper presents a die design technique for redrawing arbitrary non-circular cups by the slip line field method. In order to redraw oval cups, redrawing dies of oval-oval and round-oval processes were designed by the technique and were fabricated. Measured distributions of the wall thickness of the cups redrawn in the processes agree well with calculated ones obtained using LS-DYNA. The cause of the difference in thickness distribution between the processes is explained by the result of a slip-line field analysis. Then, new dies for a cup with a uniform wall thickness were designed. The simulated result obtained using LS-DYNA shows the uniformity of the wall thickness. © 2004 American Institute of Physics [ABSTRACT FROM AUTHOR]

Published
2004
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