1,162 results on '"Wang, Y.L."'
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152. Cleavage fracture behavior of a C–Mn vessel steel at various loading rates in notched specimens
153. Influence of zinc ion implantation on surface nanomechanical performance and corrosion resistance of biomedical magnesium–calcium alloys
154. A novel fabrication process of MEMS devices on polyimide flexible substrates
155. Organofluorosilicate glass: A dense low- k dielectric with superior materials properties
156. Preparation of low leakage current fluorine-doped silicon-oxycarbide by PECVD
157. Copper voids improvement for the copper dual damascene interconnection process
158. High frequency of level II–V lymph node involvement in RET/PTC positive papillary thyroid carcinoma
159. Structural Relaxation of La55Al25Ni10Cu10 Bulk Metallic Glass
160. Kinematic precision scaling with physical errors in miniaturization of four-bar polymer compliant machines
161. Cost-effective and eco-friendly laser-processed cotton paper for high-performance solar evaporation
162. Mechanical performance of hybrid bismaleimide composites reinforced with three-dimensional braided carbon and Kevlar fabrics
163. High temperature deformation behaviors of a high Nb containing TiAl alloy
164. Microsegregation in high Nb containing TiAl alloy ingots beyond laboratory scale
165. The corrosion of intermetallic alloys in liquid zinc
166. Microstructure and mechanical properties of as-cast Ti–45Al–8.5Nb–(W,B,Y) alloy with industrial scale
167. Microstructure and compressive properties of multicomponent Al x(TiVCrMnFeCoNiCu) 100− x high-entropy alloys
168. Isothermal corrosion TiAl–Nb alloy in liquid zinc
169. The effects of vacuum annealing on the structure of VO 2 thin films
170. High negative temperature coefficient of resistance of heteroepitaxial (Ba, Sr) TiO 3 single crystal films prepared by pulsed laser deposition
171. Phase composition and valence of pulsed laser deposited vanadium oxide thin films at different oxygen pressures
172. Bioactivity of Mg-ion-implanted zirconia and titanium
173. The corrosion of Fe 3Al alloy in liquid zinc
174. Effects of cyadox and olaquindox on intestinal mucosal immunity and on fecal shedding of Escherichia coli in piglets
175. Four new species of monoraphid diatoms from Western Sichuan Plateau in China
176. A convenient method for preparing the ionic Nickel (bis-dithiolene) complexes
177. Characteristic and mechanism of nugget performance evolution with rotation speed for high-rotation-speed friction stir welded 6061 aluminum alloy
178. Cost-effective and eco-friendly laser-processed cotton paper for high-performance solar evaporation
179. The average size of Si nanoparticles prepared by pulsed laser ablation in the gas mixture of He/Ar, Ne/Ar or He/Ne
180. Effect of Mg ion implantation on calcium phosphate formation on titanium
181. Global Simulation of Magnetospheric Space Weather Effects of the Bastille Day Storm
182. The effects of iron on the creep properties of NiAl
183. Electrochemical hydrogen storage of ball-milled CeMg 12 and PrMg 12 alloys with Ni powders
184. Effect of forging on microstructure and tensile properties of Ti-45Al-(8–9)Nb-(W,B,Y) alloy
185. Microstructure and tensile properties of as-cast Ti–45Al–(8–9)Nb–(W, B, Y) alloy
186. Synthesis and characterization of hydroxyapatite–bacterial cellulose nanocomposites
187. Effect of deposition temperature and oxygen flow rate on properties of low dielectric constant SiCOH film prepared by plasma enhanced chemical vapor deposition using diethoxymethylsilane
188. Heat, moisture and chemical resistance on low dielectric constant (low- k) film using Diethoxymethylsilane (DEMS) prepared by plasma enhanced chemical vapor deposition
189. Investigation of overpotential and seed thickness on damascene copper electroplating
190. Friction and wear behavior of three-dimensional braided carbon fiber/epoxy composites under dry sliding conditions
191. Extraction of effective dielectric constants and the effect of process damage of low- k dielectrics for advanced interconnects
192. Comparison of characteristics and integration of copper diffusion-barrier dielectrics
193. Mechanism for Cu void defect on various electroplated film conditions
194. Novel slurry solution for dishing elimination in copper process beyond 0.1-μm technology
195. Effects of plasma treatment in the tungsten process for chemical vapor deposition titanium nitride barrier film beyond nanometer technology
196. Effect of inter-level dielectrics on electromigration in damascene copper interconnect
197. Diverse magic nanoclustering in submonolayer Tl/Si(1 1 1) system
198. Anomalous temperature dependence of photoluminescence peak energy in InAs/InAlAs/InP quantum dots
199. Solid state NMR studies of the molecular motions in the polycrystalline alpha-L-fucopyranose and methyl alpha-L-fucopyranoside
200. A simple algorithm for secure domination in proper interval graphs
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