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163. A Traction Stress Sensor Array for Use in High-Resolution Robotic Tactile Imaging

Author

Kane, Bart J., Cutkosky, Mark R., and Kovacs, Gregory T. A.

Subjects
Sensors -- Design and construction, Control equipment -- Design and construction, Array processors -- Design and construction, Engineering and manufacturing industries, Science and technology
Abstract

A high resolution large-area array capable of resolving the three independent components of a 2-D triaxial contact stress profile has been developed. The array, composed of 4096 (64 x 64) individual stress sensing elements, was constructed with a fully CMOS-compatible fabrication process, allowing integration of the sensing structures with digital control circuitry. The individual array elements have been shown to demonstrate linear responses to both applied normal stress (1.59 mV/kPa, 0-35 kPa) and applied shear stress (0.32 mV/kPa, 0-60 kPa). A spatial resolution comparable to the spacing of the papillary ridges of the human dermis ([approximately equal] 300 [micro]m) has been achieved within the 1.92 x 1.92 cm active sensing area of the array. Descriptions of the sensor structure, the required signal conditioning, and the array architecture are presented in this paper. The results of electrical and mechanical characterization studies are also outlined. [491] Index Terms--CMOS, force, MEMS, strain, tactile sensor.

Published
2000

164. Design by Composition for Layered Manufacturing

Author

Binnard, Mike and Cutkosky, Mark R.

Subjects
Decomposition method -- Models, Mechanics -- Design and construction, Engineering and manufacturing industries, Science and technology
Abstract

Three dimensional rapid prototyping processes, also called layered manufacturing or solid freeform fabrication (SFF), promise designers the ability to automatically fabricate complex shapes. SFF processes were invented with the assumption that designers would submit complete part models for automated planning and manufacturing. This planning process is normally based on some form of 'decomposition,' for example, slicing into layers. Especially for newer, more complex SFF processes, there are several disadvantages to this approach, primarily that decomposition is difficult and does not reliably produce good process plans. Furthermore, it is hard for the designer to get feedback on the manufacturability of his design, and today's decomposition systems are not fully automated. This paper presents an alternative approach, 'design by composition,' where users build designs from 'primitives' that include high-level manufacturing plans. When the user combines two primitives with a Boolean operation, software will automatically generate a manufacturing plan for the new design from the plans for the source primitives. In contrast to the decomposition method, design by composition offers several benefits to designers, primarily access to manufacturability feedback during design-time, a greater degree of automation, the ability to create designs with embedded components (such as sensors, electronic circuits, bearings, and shafts), and enhanced control over manufacturing plans. These advantages make design by composition a more attractive approach to SFF processing, especially for designers who are new to these processes. [S1050-0472(00)01701-3]

Published
2000

174. Tactile sensing for gecko-inspired adhesion

Author

Wu, X. Alice, primary, Suresh, Srinivasan A., additional, Jiang, Hao, additional, Ulmen, John V., additional, Hawkes, Elliot W., additional, Christensen, David L., additional, and Cutkosky, Mark R., additional

Published
2015
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194. Haptic surface exploration

Author

Okamura, Allison M., primary, Costa, Michael A., additional, Turner, Michael L., additional, Richard, Christopher, additional, and Cutkosky, Mark R., additional

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